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US5082880A
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Semiconductor sealing composition containing epoxy resin and polymaleimide
Assignee: Mitsui Toatsu Chemicals Inc
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Filing: 1989-09-08
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Granted: 1992-01-21
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Expires: 2009-09-08
Abstract
Abstract A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, this semiconductors such as flat packages, there semiconductors provide high reliability.
Inventors
- 👤 Mikio Kitahara
- 👤 Koichi Machida
- 👤 Takayuki Kubo
- 👤 Motoyuki Torikai
- 👤 Koutarou Asahina
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:44
CPC Classifications
C; C09; C09K; C09K3/00; C09K3/10; C09K3/1006; C09K3/1018; C08; C08F; C08F283/00; C08F283/10; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08G59/3227; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4042; C08G59/62; C08G59/621; C08G77/00; C08G77/04; C08G77/20; C08K; C08K3/00; C08K3/01; C08K3/013; C08K3/34; C08K3/36; C08L; C08L63/00; C08L83/00; C08L83/04; C08L83/06; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C08L2203/00; C08L2203/20; C08L2203/206; C09K2200/00; C09K2200/06; C09K2200/0615; C09K2200/0625; C09K2200/0645; C09K2200/0647; C09K2200/067; C09K2200/0672; C09K2200/068; C09K2200/0685
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
84 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (I): ##STR25## wherein X 1 represents ##STR26## X 2 represents ##STR27## and n is an average ranging from 0 to 10; (b) a hardening agent; (c) an inorganic filler; and (d) a polymaleimide represented by the following general formula (III): ##STR28## (wherein R 1 represents an m-valent organic group having at least two carbon atoms and m is an integer of not less than 2).
Claim 2
Dependent Claim
84 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (I): ##STR25## wherein X 1 represents ##STR26## X 2 represents ##STR27## and n is an average ranging from 0 to 10; (b) a hardening agent; (c) an inorganic filler; and (d) a polymaleimide represented by the following general formula (III): ##STR28## (wherein R 1 represents an m-valent organic group having at least two carbon atoms and m is an integer of not less than 2).
Claim 3
Dependent Claim
39 words
The resin composition for sealing semiconductors of claim 1 wherein the epoxy resin represented by the general formula (I) is an epoxy resin represented by the general formula: ##STR29## wherein n is an average ranging from 0 to 10.
Claim 4
Dependent Claim
39 words
The resin composition for sealing semiconductors of claim 1 wherein the epoxy resin represented by the general formula (I) is an epoxy resin represented by the general formula: ##STR30## wherein n is an average ranging from 0 to 10.
Claim 5
Dependent Claim
39 words
The resin composition for sealing semiconductors for claim 1 wherein the epoxy resin represented by the general formula (I) is an epoxy resin represented by the general formula: ##STR31## wherein n is an average ranging from 0 to 10.
Claim 6
Dependent Claim
63 words
The resin composition for sealing semiconductors of claim 1 wherein the polymaleimide is a bismaleimide compound represented by the following general formula: ##STR32## wherein R 2 represents ##STR33## wherein X represents a direct bond, a bivalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide.
Claim 7
Dependent Claim
45 words
The resin composition for sealing semiconductors as set forth in claim 1 wherein the polymaleimide is a member selected from those represented by the following general formula: ##STR34## wherein n is an average number of the units enclosed in brackets ranging from 0 to 10.
Claim 8
Dependent Claim
14 words
The resin composition for sealing semiconductors of claim 1 wherein the polymaleimide is 4,4'-bis(3-maleimidephenoxy)biphenyl.
Claim 9
Dependent Claim
14 words
The resin composition for sealing semiconductors of claim 1 wherein the polymaleimdie is bis[4-(3-maleimidephenoxy)phenyl]sulfide.
Claim 10
Dependent Claim
21 words
The resin composition for sealing semiconductors of claim 1 wherein the hardening agent is novolak phenol resin and/or phenol aralkyl resin.
Claim 11
Dependent Claim
31 words
The resin composition for sealing semiconductors of claim 1 wherein the amount of the hardening agent ranges from 0.1 to 10 expressed in equivalent weight ratio based on the epoxy resin.
Claim 12
Dependent Claim
18 words
The resin composition for sealing semiconductors of claim 1 wherein the inorganic filler is crystalline and/or fused silica.
Claim 13
Dependent Claim
42 words
The resin composition for sealing semiconductors of claim 1 wherein the amount of the inorganic filler ranges from 100 to 800 parts by weight per 100 parts by weight of the sum of the epoxy resin, the hardening agent and the polymaleimide.
Claim 14
Dependent Claim
113 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (II): ##STR35## (in the formula (II), R represents a tetravalent group selected from the group consisting of aliphatic groups having at least two carbon atoms, alicyclic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups and non-condensed polycyclic aromatic groups formed by connecting aromatic groups directly or through a divalent group); (b) a hardening agent; (c) an inorganic filler: and (d) a polymaleimide represented by the following general formula (III): ##STR36## (wherein R 1 represents an m-valent organic group having at least two carbon atoms and m is an integer of not less than 2).
Claim 15
Dependent Claim
113 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (II): ##STR35## (in the formula (II), R represents a tetravalent group selected from the group consisting of aliphatic groups having at least two carbon atoms, alicyclic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups and non-condensed polycyclic aromatic groups formed by connecting aromatic groups directly or through a divalent group); (b) a hardening agent; (c) an inorganic filler: and (d) a polymaleimide represented by the following general formula (III): ##STR36## (wherein R 1 represents an m-valent organic group having at least two carbon atoms and m is an integer of not less than 2).
Claim 16
Dependent Claim
63 words
The resin composition for sealing semiconductors of claim 13 wherein the polymaleimide is a bismaleimide compound represented by the following general formula: ##STR37## wherein R 2 represents ##STR38## wherein X represents a direct bond, a bivalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide.
Claim 17
Dependent Claim
42 words
The resin composition for sealing semiconductors of claim 13 wherein the polymaleimide is a member selected from those represented by the following general formula: ##STR39## wherein n is an average number of the units enclosed in brackets ranging from 0 to 10.
Claim 18
Dependent Claim
14 words
The resin composition for sealing semiconductors of claim 13 wherein the polymaleimide is 4,4'-bis(3-maleimidephenoxy)biphenyl.
Claim 19
Dependent Claim
14 words
The resin composition for sealing semiconductors of claim 13 wherein the polymaleimide is bis[4-(3-maleimidephenoxy)phenyl]sulfide.
Claim 20
Dependent Claim
21 words
The resin composition for sealing semiconductors of claim 13 wherein the hardening agent is novolak phenol resin and/or phenol aralkyl resin.
Claim 21
Dependent Claim
31 words
The resin composition for sealing semiconductors of claim 13 wherein the amount of the hardening agent ranges from 0.1 to 10 expressed in equivalent weight ratio based on the epoxy resin.
Claim 22
Dependent Claim
18 words
The resin composition for sealing semiconductors of claim 13 wherein the inorganic filler is crystalline and/or fused silica.
Claim 23
Dependent Claim
42 words
The resin composition for sealing semiconductors of claim 13 wherein the amount of the inorganic filler ranges from 100 to 800 parts by weight per 100 parts by weight of the sum of the epoxy resin, the hardening agent and the polymaleimide.
Claim 24
Dependent Claim
127 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (II): ##STR40## (in the formula (II), R represents a tetravalent group selected from the group consisting of aliphatic groups having at least two carbon atoms, alicyclic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups and non-condensed polycyclic aromatic groups formed by connecting aromatic groups directly or through a divalent group); (b) a novolak phenol resin hardening agent (c) an inorganic filler; and (d) a bismaleimide compound represented by the following general formula: ##STR41## wherein X represents a direct bond, a bivalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide.
Claim 25
Dependent Claim
127 words
A resin composition for sealing semiconductors which comprises components, (a) an epoxy resin represented by the following general formula (II): ##STR40## (in the formula (II), R represents a tetravalent group selected from the group consisting of aliphatic groups having at least two carbon atoms, alicyclic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups and non-condensed polycyclic aromatic groups formed by connecting aromatic groups directly or through a divalent group); (b) a novolak phenol resin hardening agent (c) an inorganic filler; and (d) a bismaleimide compound represented by the following general formula: ##STR41## wherein X represents a direct bond, a bivalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-01-20 | 1995-07-22 | 1996-01-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-01-20 | 1999-07-22 | 2000-01-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-01-20 | 2003-07-22 | 2004-01-21 | $7700.00 | Window Closed / Lapsed |