US4959443A
Expired / Lapsed
US
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Thermosetting resin composition from bis maleimide and aromatic amine resin
Assignee: Mitsui Toatsu Chemicals Inc
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Filing: 1989-05-15
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Granted: 1990-09-25
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Expires: 2009-05-15
Abstract
Abstract The present invention relates to thermosetting resin compositions comprising a bismaleimide compound represented by the formula (I) ##STR1## and an aromatic amine resin represented by the general formula (II) ##STR2## and to processes for preparing the same.
Inventors
- 👤 Norimasa Yamaya
- 👤 Masahiro Ohta
- 👤 Akihiro Yamaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:40
CPC Classifications
C; C08; C08L; C08L79/00; C08L79/02; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08G73/126; C08G73/127; C08G73/123; C08G73/124; C08L79/04; C08L79/08
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
198 words
A thermosetting resin composition comprising (i) about 100 parts by weight of a bismaleimide compound represented by the formula (I) ##STR28## wherein R represents a divalent group selected from the group consisting of ##STR29## wherein X is directly bonded to the benzene rings and is a group selected from the group consisting of a divalent hydrocarbon group having from 1 to 10 carbon atoms, an isopropylidene group having six fluorine atoms, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group and an oxo group, and (ii) from about 5 to about 100 parts by weight of an aromatic amine resin represented by the formula (II) ##STR30## wherein A represents a group selected from the group consisting of a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group and a naphthylenyl group; R 1 is selected from the group consisting of a halogen atom, a hydroxyl group, an alkoxy group having no greater than 4 carbon atoms, and an alkyl group having no greater than 5 carbon atoms; l is 1 to 2; m is an integer of from 0 to 3, and n is an integer of from 0 to 300.
Claim 2
Dependent Claim
198 words
A thermosetting resin composition comprising (i) about 100 parts by weight of a bismaleimide compound represented by the formula (I) ##STR28## wherein R represents a divalent group selected from the group consisting of ##STR29## wherein X is directly bonded to the benzene rings and is a group selected from the group consisting of a divalent hydrocarbon group having from 1 to 10 carbon atoms, an isopropylidene group having six fluorine atoms, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group and an oxo group, and (ii) from about 5 to about 100 parts by weight of an aromatic amine resin represented by the formula (II) ##STR30## wherein A represents a group selected from the group consisting of a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group and a naphthylenyl group; R 1 is selected from the group consisting of a halogen atom, a hydroxyl group, an alkoxy group having no greater than 4 carbon atoms, and an alkyl group having no greater than 5 carbon atoms; l is 1 to 2; m is an integer of from 0 to 3, and n is an integer of from 0 to 300.
Claim 3
Dependent Claim
22 words
The thermosetting resin composition of claim 1 wherein m is 2 or 3 and the groups represented by R 1 are indentical.
Claim 4
Dependent Claim
22 words
The thermosetting resin composition of claim 1 wherein m is 2 or 3 and the groups represented by R 1 are different.
Claim 5
Dependent Claim
36 words
The thermosetting resin composition of claim 1 wherein m is 2 or 3 and the groups represented by R 1 form a five membered ring or six membered aliphatic ring which may have a side chain.
Claim 6
Dependent Claim
25 words
The thermosetting resin composition of claim 1 wherein said R in said formula (I) represents a divalent group selected from the group consisting of ##STR31##
Claim 7
Dependent Claim
24 words
The thermosetting resin composition of claim 1 wherein R in said formula (I) represents a divalent group selected from the group consisting of ##STR32##
Claim 8
Dependent Claim
23 words
The thermosetting resin composition of claim 1 wherein A in said formula (II) represents a group selected from the group consisting of ##STR33##
Claim 9
Dependent Claim
24 words
The thermosetting resin composition of claim 1 wherein A in said formula (II) represents a group selected from the group consisting of and ##STR34##
Claim 10
Dependent Claim
15 words
The thermosetting resin composition of claim 1 wherein A in said formula (II) represents ##STR35##
Claim 11
Dependent Claim
38 words
The thermosetting resin composition of claim 1 wherein R 1 in said formulat (II) is selected from the group consisting of an alkyl group having from 1 to 3 carbon atoms, a hydroxyl group and a halogen atom.
Claim 12
Dependent Claim
15 words
The thermosetting resin composition of claim 1 wherein m in said formula (II) is 0.
Claim 13
Dependent Claim
16 words
The thermosetting resin composition of claim 1 wherein said l in said formula (II) is 1.
Claim 14
Dependent Claim
18 words
The thermosetting resin composition of claim 1 wherein the aromatic amine resin of the formula (II) is ##STR36##
Claim 15
Dependent Claim
17 words
The thermosetting resin composition of claim 13 wherein the bismaleimide compound of the formula (I) is ##STR37##
Claim 16
Dependent Claim
17 words
The thermosetting resin composition of claim 13 wherein the bismaleimide compound of the formula (I) is ##STR38##
Claim 17
Dependent Claim
17 words
The thermosetting resin composition of claim 13 wherein the bismaleimide compound of the formula (I) is ##STR39##
Claim 18
Dependent Claim
17 words
The thermosetting resin composition of claim 13 wherein the bismaleimide compound of the formula (I) is ##STR40##
Claim 19
Dependent Claim
25 words
The thermosetting resin composition of claim 1 wherein the weight average molecular weight of said aromatic amine resin is from about 300 to about 60,000.
Claim 20
Dependent Claim
23 words
The thermosetting resin composition of claim 1 wherein the molecular weight of said aromatic amine resin is from about 300 to about 20,000.
Claim 21
Dependent Claim
43 words
A process for preparing the thermosetting resin composition of claim 1 comprising mixing about 100 parts of said bismaleimide compound of the formula (I) with from about 5 to about 80 parts by weight of said aromatic amine resin of the formula (II).
Claim 22
Dependent Claim
55 words
The process of claim 20 further comprising heating a mixture of said bismaleimide compound of the formula (I) and said aromatic amine resin of the formula (II) at a temperature of from about 70 to about 220° C. for from about 10 to about 180 minutes to partially cure said mixture to form a prepolymer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1993-09-24 | 1994-03-26 | 1994-09-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-24 | 1998-03-26 | 1998-09-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-24 | 2002-03-26 | 2002-09-25 | $7700.00 | Window Closed / Lapsed |