Epoxy resins containing imido rings, production process thereof and epoxy resin compositions containing the same

Claim 2

An epoxy resin obtained from an imido-ring-containing diphenol represented by the following formula (I): ##STR5## wherein R represents an aliphatic group having at least two carbon atoms, an alicyclic group, a monocyclic aryl group, a fused polycyclic aromatic group, or a non-fused polycyclic aromatic group formed of aromatic groups coupled together directly or via a linking member and the two hydroxyl groups are each bonded to a meta position or the para position, at least 50% of the hydroxyl groups of molecules of said diphenol having been epoxidized.

Claim 3

The epoxy resin of claim 1, wherein R is a residue of a tetracarboxylic dianhydride selected from ethylenetetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perillenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride, 1,2,7,8-anthracenetetracarboxylic dianhydride, 1,2,7,8-phenanethrenetetracarboxylic dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)phenyl dianhydride.

Claim 4

The epoxy resin of claim 2, wherein R is a residue of a tetracarboxylic dianhydride selected from 1,2,3,4-butanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl) sulfone dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride.

Claim 5

A process for producing an imido-ring-containing epoxy resin, which comprises reacting an imido-ring-containing diphenol represented by the following formula (I): ##STR6## wherein R represents an aliphatic group having at least two carbon atoms, an alicyclic group, a monocyclic aryl group, a fused polycyclic aromatic group, or a non-fused polycyclic aromatic group formed of aromatic groups coupled together directly or via a linking member and the two hydroxyl groups are each bonded to a meta position or the para position, at least 50% of the hydroxyl groups of molecules of said diphenol having been epoxidized, with an epihalohydrin.

Claim 6

A process for producing an imido-ring-containing epoxy resin, which comprises reacting an imido-ring-containing diphenol represented by the following formula (I): ##STR6## wherein R represents an aliphatic group having at least two carbon atoms, an alicyclic group, a monocyclic aryl group, a fused polycyclic aromatic group, or a non-fused polycyclic aromatic group formed of aromatic groups coupled together directly or via a linking member and the two hydroxyl groups are each bonded to a meta position or the para position, at least 50% of the hydroxyl groups of molecules of said diphenol having been epoxidized, with an epihalohydrin.

Claim 7

The process of claim 4, wherein the reaction temperature ranges from about 40° C. to about 120° C.

Claim 8

The process of claim 4, wherein the epihalohydrin is epichlorohydrin.

Claim 9

A process for producing an imido-ring-containing epoxy resin, which comprises reacting an imido-ring-containing diphenol, which is represented by the following formula (I): ##STR7## wherein R represents an aliphatic group having at least two carbon atoms, an alicyclic group, a monocyclic aryl group, a fused polycyclic aromatic group, or a non-fused polycyclic aromatic group formed of aromatic groups coupled together directly or via a linking member and the two hydroxyl groups are each bonded to a meta position or the para position, at least 50% of the hydroxyl groups of molecules of said diphenol having been epoxidized, with an epihalohydrin in the presence of a hydrogen halide acceptor.

Claim 10

A process for producing an imido-ring-containing epoxy resin, which comprises reacting an imido-ring-containing diphenol, which is represented by the following formula (I): ##STR7## wherein R represents an aliphatic group having at least two carbon atoms, an alicyclic group, a monocyclic aryl group, a fused polycyclic aromatic group, or a non-fused polycyclic aromatic group formed of aromatic groups coupled together directly or via a linking member and the two hydroxyl groups are each bonded to a meta position or the para position, at least 50% of the hydroxyl groups of molecules of said diphenol having been epoxidized, with an epihalohydrin in the presence of a hydrogen halide acceptor.

Claim 11

The process of claim 7, wherein the reaction temperature ranges from about 40° C. to about 120° C.

Claim 12

The process of claim 7, wherein the epihalohydrin is epichlorohydrin.

Claim 13

The process of claim 7, wherein the hydrogen halide acceptor is a metal hydroxide, an alkali metal salt of an organic acid, an organic amine or an alcoholate.

Claim 14

The process of claim 7, wherein the hydrogen halide acceptor is an alkali metal hydroxide.

Claim 15

An epoxy resin composition comprising the epoxy resin of claim 1, 2 or 3 and a curing agent, wherein the epoxy resin is in a proportion of at least 15 wt. % of the whole composition.

Claim 16

The epoxy resin composition of claim 12, wherein the epoxy resin is in a proportion of about 20-100 wt. % of the whole epoxy component.

Claim 17

The epoxy resin composition of claim 12, further comprising a curing accelerator.

Claim 18

The epoxy resin composition of claim 14, wherein the curing agent is a novolak resin, alicyclic amine, aromatic amine, aromatic amine-formaldehyde condensation product, guanidine derivative or polybasic acid anhydride.