Method of making a semiconductor laser

Claim 1

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; heating the semiconductor body in gaseous hydrogen chloride to etch and remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as an etching mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing in a metalorganic chemical vapor deposition process a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.

Claim 2

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; heating the semiconductor body in gaseous hydrogen chloride to etch and remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as an etching mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing in a metalorganic chemical vapor deposition process a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.

Claim 3

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; heating the semiconductor body and irradiating it with an arsenic molecular beam to etch and remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as an etching mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing by molecular beam epitaxy a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.

Claim 4

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; heating the semiconductor body and irradiating it with an arsenic molecular beam to etch and remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as an etching mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing by molecular beam epitaxy a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.

Claim 5

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; placing said semiconductor body in a solvent and dissolving said first current blocking layer but not said second current blocking layer to remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as a dissolution mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing by liquid-phase epitaxy a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.

Claim 6

A method of making a semiconductor laser device comprising: successively epitaxially growing a first conductivity-type Al x Ga.sub.(1-x) As first cladding layer on a first conductivity-type GaAs substrate, an Al y Ga.sub.(1-y) As active layer on said first cladding layer, a second conductivity-type Al x Ga.sub.(1-x) As second cladding layer on said active layer, a GaAs first current blocking layer on said second cladding layer, and an Al z Ga.sub.(1-z) As layer as a second current blocking layer as a semiconductor body; forming a photoresist grating on said Al z Ga.sub.(1-z) As layer; selectively etching said Al z Ga.sub.(1-z) As layer with said photoresist grating as an etching mask to form said Al z Ga.sub.(1-z) As second current blocking layer into a second current blocking layer grating having stripes; epitaxially growing a first conductivity-type GaAs third current blocking layer on said first current blocking layer and on and burying said second current blocking layer grating; forming a groove in said third current blocking layer extending in depth to said first current blocking layer and in length transverse to the second current blocking layer grating stripes; placing said semiconductor body in a solvent and dissolving said first current blocking layer but not said second current blocking layer to remove the portion of said first current blocking layer at the bottom of the groove and portions of said first current blocking layer with said grating stripes as a dissolution mask whereby the width of the groove in said first current blocking layer changes periodically along the length of the groove; and successively epitaxially growing by liquid-phase epitaxy a second conductivity-type Al x Ga.sub.(1-x) As third cladding layer, filling the groove and covering said third current blocking layer, and a second conductivity-type GaAs contact layer on said third cladding layer.