An overheating detection circuit including a reversely biased junction having a temperature dependent reverse leakage current for detecting overheating of a power integrated circuit

Claim 2

An overheating detection circuit for detecting an overheating of a power integrated circuit, said power integrated circuit being formed in a substrate, comprising: a reversely biased junction having a reverse leakage current, said reverse leakage current being temperature dependent; means for amplifying said reverse leakage current; and means for producing a voltage proportional to said amplified reverse leakage current and for producing a signal when said voltage exceeds a threshold voltage to indicate that said power integrated circuit is overheated, said overheating detection circuit being disposed in said substrate.

Claim 3

An overheating detection circuit for detecting an overheating of a power integrated circuit, said power integrated circuit being formed in a substrate, comprising: first and second temperature detection circuits, said first temperature detection circuit having a first temperature threshold and said second temperature detection circuit having a second temperature threshold lower than said first temperature threshold, each of said temperature detection circuits having a reversely biased junction having a reverse leakage current, said reverse leakage current being temperature dependent, means for amplifying said reverse leakage current, and means for producing a voltage proportional to said amplified reverse leakage current and for producing a signal when said voltage exceeds an associated threshold voltage to indicate that said power integrated circuit has a temperature exceeding a respective one of said temperature thresholds; and hysteresis means for receiving said signals produced by said first and second temperature detecting circuits, for producing an overheating signal upon receipt of said signal produced by said first temperature detecting circuit to indicate that said power integrated circuit is overheated, and for inhibiting the output of said overheating signal upon a receipt of said signal produced by said second temperature detecting circuit after receipt of said signal produced by said first temperature detecting circuit to indicate that said power integrated circuit is not overheated, said overheating detection circuit being disposed in said substrate.

Claim 4

An overheating detection circuit for detecting an overheating of a power integrated circuit, said power integrated circuit being formed in a substrate, comprising: first and second temperature detection circuits, said first temperature detection circuit having a first temperature threshold and said second temperature detection circuit having a second temperature threshold lower than said first temperature threshold, each of said temperature detection circuits having a reversely biased junction having a reverse leakage current, said reverse leakage current being temperature dependent, means for amplifying said reverse leakage current, and means for producing a voltage proportional to said amplified reverse leakage current and for producing a signal when said voltage exceeds an associated threshold voltage to indicate that said power integrated circuit has a temperature exceeding a respective one of said temperature thresholds; and hysteresis means for receiving said signals produced by said first and second temperature detecting circuits, for producing an overheating signal upon receipt of said signal produced by said first temperature detecting circuit to indicate that said power integrated circuit is overheated, and for inhibiting the output of said overheating signal upon a receipt of said signal produced by said second temperature detecting circuit after receipt of said signal produced by said first temperature detecting circuit to indicate that said power integrated circuit is not overheated, said overheating detection circuit being disposed in said substrate.

Claim 5

The overheating detection circuit of claim 2, wherein said hysteresis means comprises inverting means for inverting said signal produced by said second temperature detecting circuit, and first and second NAND gates.

Claim 6

The overheating detection circuit of claim 2, wherein said means for amplifying amplifies said reverse leakage current of said reversely biased junction of said second temperature detection circuit more than said reverse leakage current of said reversely biased junction of said first temperature detection circuit, and wherein said threshold voltage associated with said second temperature detection circuit is substantially equal to said threshold voltage associated with said first temperature detection circuit.

Claim 7

The overheating detection circuit of claim 1 or 2, wherein said junction comprises a PN junction diode.

Claim 8

The overheating detection circuit of claim 5, further comprising means for limiting a volume of a depletion layer of said PN junction diode to control said temperature dependency of said reverse leakage current.

Claim 9

The overheating detection circuit of claim 6, wherein said means for limiting comprises a polysilicon layer.

Claim 10

The overheating detection circuit of claim 1 or 2, wherein said means for amplifying comprises at least one transistor.

Claim 11

The overheating detection circuit of claim 1 or 2, wherein said means for producing comprises a constant current circuit for producing said voltage proportional to said amplified reverse leakage current, and a buffer circuit having said threshold voltage for producing said signal when said voltage exceeds said threshold voltage.

Claim 12

The overheating detection circuit of claim 9, wherein said constant current circuit comprises a MOSFET.