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US5066544A
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Dispersion strengthened lead-tin alloy solder
Assignee: Philips North America LLC
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Filing: 1990-08-27
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Granted: 1991-11-19
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Expires: 2010-08-27
Abstract
Abstract An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic.
Inventors
- 👤 Hemant S. Betrabet
- 👤 Otmar H. Boser
- 👤 Robert H. Kane
- 👤 Susan McGee
- 👤 Thomas Caulfield
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 14:56
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268; B23K35/262; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/346; H05K3/3465; H05K3/3485; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/0263; H05K2201/0272; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12486; Y10T428/12493; Y10T428/12687
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
36 words
A dispersion strengthened lead-tin alloy solder comprising up to 5vol. % of particles of a material selected from the group consisting of nickel-tin intermetallics and/or metal sulfide, the size of said particles being less than 5μm.
Claim 2
Dependent Claim
36 words
A dispersion strengthened lead-tin alloy solder comprising up to 5vol. % of particles of a material selected from the group consisting of nickel-tin intermetallics and/or metal sulfide, the size of said particles being less than 5μm.
Claim 3
Dependent Claim
13 words
The solder of claim 1 wherein 0.5-5 vol.% of the particles are present.
Claim 4
Dependent Claim
10 words
A soldered joint formed from the solder of claim 1.
Claim 5
Dependent Claim
36 words
A dispersion strengthened lead-tin alloy solder comprising 0.2-2 vol. percent of particles of a material selected from the group consisting of nickel-tin intermetallics and/or metal sulfide, the size of said particles being less than 5 μm.
Claim 6
Dependent Claim
36 words
A dispersion strengthened lead-tin alloy solder comprising 0.2-2 vol. percent of particles of a material selected from the group consisting of nickel-tin intermetallics and/or metal sulfide, the size of said particles being less than 5 μm.
Claim 7
Dependent Claim
14 words
The solder of claim 1 wherein the particles are particles of a metal sulfide.
Claim 8
Dependent Claim
16 words
The solder of claim 5 wherein the size of the particles is less than 1 μm.
Claim 9
Dependent Claim
15 words
The solder of claim 6 wherein the particles are of iron sulfide or manganese sulfide.
Claim 10
Dependent Claim
43 words
The solder of claim 7 wherein the lead-tin alloy is an alloy consisting of about 60% by weight of Sn and about 40% by weight of Pb or an alloy of about 95% by weight of Pb and 5% by weight of Sn.
Claim 11
Dependent Claim
13 words
The solder of claim 1 wherein the particles are particles of nickel-tin intermetallics.
Claim 12
Dependent Claim
15 words
The solder of claim 9 wherein the size of the particles is less than 1μm.
Claim 13
Dependent Claim
21 words
The solder of claim 10 wherein the particles are particles of Ni 3 Sn 4 or Cu 9 NiSn 3 .
Claim 14
Dependent Claim
43 words
The solder of claim 11 wherein the lead-tin alloy is an alloy consisting of about 60% by weight of Sn and about 40% by weight of Pb or an alloy of about 95% by weight of Pb and 5% by weight of Sn.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-18 | 1995-05-20 | 1995-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-18 | 1999-05-20 | 1999-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-18 | 2003-05-20 | 2003-11-19 | $7700.00 | Window Closed / Lapsed |