US5063169A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Selectively plating conductive pillars in manufacturing a semiconductor device
Assignee: US Philips Corp
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Filing: 1990-06-01
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Granted: 1991-11-05
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Expires: 2010-06-01
Abstract
Abstract Electrical connection to a device region (3,4) of a semiconductor device is formed by providing a semiconductor body (1) having adjacent one major surface (12) a device region (3,4) bounded by an insulating region (19a,19b,9), providing an activating layer (11) on the one major surface (12), applying a flowable material as a layer (13) of photosensitive resist, exposing and developing the resist to define an opening (14) over a contact area (12a) of the device region (3,4), and selectively plating electrically conductive material into the opening (14) to form a conductive pillar (15) in electrical contact with the contatct area (12a). The layer (13) of photosensitive resist is removed after formation of the conductive pillar (15) and a layer of insulating material is then provided to cover the conductive pillar (15) and the surface (12). The insulating layer is then etched to expose a top surface (15a) of the conductive pillar (15).
Inventors
- 👤 Leendert De Bruin
- 👤 Robertus D. J. Verhaar
- 👤 Josephus M. F. G. Van Laarhoven
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 14:51
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/081; H10W20/089; H10W72/00; H10W72/01; H10W72/012; H10W20/031; H10W20/032; H10W20/038; H10W20/042; H10W20/043; H10W20/054; H10W20/063; H10W20/069; H10W72/20; H10W72/251; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S148/00; Y10S148/026; Y10S438/00; Y10S438/903
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
191 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to the device region by providing an activating layer on the one major surface, applying a photosensitive resist material to form a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to define an opening through the photosensitive resist layer thereby exposing a contact area of the device region, and selectively depositing conductive material into the opening to form a conductive pillar which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic insulating material to cover the conductive pillar and said major surface, applying a resist layer to the inorganic insulating material layer and etching the insulating and resist layers at the same rate to expose the top surface of the electrically conductive pillar and to provide a relatively flat surface for the insulating material bounding the conductive pillar.
Claim 2
Independent Claim
191 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to the device region by providing an activating layer on the one major surface, applying a photosensitive resist material to form a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to define an opening through the photosensitive resist layer thereby exposing a contact area of the device region, and selectively depositing conductive material into the opening to form a conductive pillar which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic insulating material to cover the conductive pillar and said major surface, applying a resist layer to the inorganic insulating material layer and etching the insulating and resist layers at the same rate to expose the top surface of the electrically conductive pillar and to provide a relatively flat surface for the insulating material bounding the conductive pillar.
Claim 3
Dependent Claim
42 words
A method according to claim 1, further comprising providing the activating layer as a plating layer of electrically conductive material prior to applying the flowable material and using the plating layer as an electrode during selective electroplating to form the conductive pillar.
Claim 4
Dependent Claim
19 words
A method according to claim 2, further comprising providing the plating layer as a layer of a titanium-tungsten alloy.
Claim 5
Dependent Claim
43 words
A method according to claim 1, further comprising providing the activating layer as a nucleating layer comprising a precious metal selected from the group consisting of palladium, platinum and rhodium for facilitating electroless plating of the conductive material to form the conductive pillar.
Claim 6
Dependent Claim
19 words
A method according to claim 3, further comprising selectively plating nickel into the opening to form the conductive pillar.
Claim 7
Dependent Claim
70 words
A method according to claim 1, further comprising providing the layer of inorganic insulating material by depositing a layer of silicon oxide, applying a resist layer to the silicon oxide to provide a flatter surface and then etching the further layer so that the silicon oxide and resist are etched at the same rate thereby providing a relatively flat surface upon exposure of the top surface of the conductive pillar.
Claim 8
Independent Claim
158 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to said device region by providing a layer of a titanium-tungsten alloy as a plating layer on the one major surface, applying a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to define an opening through the photosensitive resist layer thereby exposing a contact area of said device region, selectively plating nickel material into said opening to form a conductive pillar which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic material to cover the conductive pillar and said major surface, and etching the insulating layer to expose the top surface of said conductive pillar.
Claim 9
Independent Claim
158 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to said device region by providing a layer of a titanium-tungsten alloy as a plating layer on the one major surface, applying a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to define an opening through the photosensitive resist layer thereby exposing a contact area of said device region, selectively plating nickel material into said opening to form a conductive pillar which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic material to cover the conductive pillar and said major surface, and etching the insulating layer to expose the top surface of said conductive pillar.
Claim 10
Independent Claim
173 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to the device region by providing an activating layer comprising a material selected from the group consisting of palladium, platinum and rhodium on the one major surface, applying a photosensitive resist material to form a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to thereby define an opening through the photosensitive resist layer exposing a contact area of the device region, selectively electrolessly plating nickel into said opening to form a conductive pillar, which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic insulating material to cover the conductive pillar and said major surface, and etching the layer of insulating material to expose the top surface of said conductive pillar.
Claim 11
Independent Claim
173 words
A method of manufacturing a semiconductor device, which method comprises providing a semiconductor body having adjacent one major surface a device region bounded by an insulating region and forming an electrical connection to the device region by providing an activating layer comprising a material selected from the group consisting of palladium, platinum and rhodium on the one major surface, applying a photosensitive resist material to form a photosensitive resist layer on the one major surface, exposing and developing the photosensitive resist layer to thereby define an opening through the photosensitive resist layer exposing a contact area of the device region, selectively electrolessly plating nickel into said opening to form a conductive pillar, which pillar has a top surface and which pillar is in electrical contact with the contact area, removing the photosensitive resist layer after formation of the conductive pillar, providing a layer of an inorganic insulating material to cover the conductive pillar and said major surface, and etching the layer of insulating material to expose the top surface of said conductive pillar.
Claim 12
Dependent Claim
19 words
A method according to claim 4, further comprising selectively plating nickel into the opening to form the conductive pillar.
Claim 13
Dependent Claim
22 words
A method according to claim 7, further comprising providing a layer of a silicon oxide as the layer of inorganic insulating material.
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| 3.5 Years (Year 4) | 1994-11-04 | 1995-05-06 | 1995-11-05 | $2000.00 | Window Closed / Lapsed |
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