Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
205 words
A split-ring electrostatic chuck for holding a semiconductor wafer, said chuck comprising: a substantially disc-shaped first electrode having a raised central hub portion and a raised outer rim portion forming a depression between said raised hub and said raised rim, said depression having a taper; a second electrode having a donut shape with a substantially circular wall defining a central opening and an outer edge to form a band between said circular wall and said outer edge, wherein: (a) said hub of said first electrode engages said central opening of said second electrode, (b) said rim of said first electrode surrounds said outer edge of said second electrode, and (c) said band is adapted to engage said depression of said first electrode and is tapered to correspond to said taper of said depression; an insulator electrically separating said first electrode from said second electrode and covering the tops of said first electrode and said second electrode to form a clamping surface; a first electrical contact connected to said first electrode; and a second electrical contact connected to said second electrode, wherein a voltage is applied between said first electrode and said second electrode generating an attractive force for clamping said wafer to said clamping surface.
Claim 2
Dependent Claim
205 words
A split-ring electrostatic chuck for holding a semiconductor wafer, said chuck comprising: a substantially disc-shaped first electrode having a raised central hub portion and a raised outer rim portion forming a depression between said raised hub and said raised rim, said depression having a taper; a second electrode having a donut shape with a substantially circular wall defining a central opening and an outer edge to form a band between said circular wall and said outer edge, wherein: (a) said hub of said first electrode engages said central opening of said second electrode, (b) said rim of said first electrode surrounds said outer edge of said second electrode, and (c) said band is adapted to engage said depression of said first electrode and is tapered to correspond to said taper of said depression; an insulator electrically separating said first electrode from said second electrode and covering the tops of said first electrode and said second electrode to form a clamping surface; a first electrical contact connected to said first electrode; and a second electrical contact connected to said second electrode, wherein a voltage is applied between said first electrode and said second electrode generating an attractive force for clamping said wafer to said clamping surface.
Claim 3
Dependent Claim
53 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said taper of said depression formed between said raised hub and said raised rim of said first electrode and said corresponding taper of said band between said circular wall and said outer edge of said second electrode are about ten degrees from normal.
Claim 4
Dependent Claim
19 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said clamping surface defines two, separate, equal electrode areas.
Claim 5
Dependent Claim
17 words
A split-ring electrostatic chuck as claimed in claim 3 wherein said equal electrode areas are symmetrically distributed.
Claim 6
Dependent Claim
20 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said clamping surface is a single, co-planar, flat smooth surface.
Claim 7
Dependent Claim
48 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said clamping surface of said electrostatic chuck has an outer boundary and said semiconductor wafer clamped by said electrostatic chuck on said clamping surface has an outer boundary which extends beyond said outer boundary of said clamping surface.
Claim 8
Dependent Claim
25 words
A split-ring electrostatic chuck as claimed in claim 1 further comprising a protective ring surrounding said rim of said first electrode of said electrostatic chuck.
Claim 9
Dependent Claim
16 words
A split-ring electrostatic chuck as claimed in claim 7 wherein said protective ring is anodized aluminum.
Claim 10
Dependent Claim
23 words
A split-ring electrostatic chuck as claimed in claim 1 wherein an epoxy bond is formed between said first electrode and said second electrode.
Claim 11
Dependent Claim
18 words
A split-ring electrostatic chuck as claimed in claim 1 wherein no electrical contact is made to said wafer.
Claim 12
Dependent Claim
35 words
A split-ring electrostatic chuck as claimed in claim 1 wherein a capacitance is generated between said first electrode and said second electrode, said capacitance being sufficiently great to render negligible the induced rf voltage difference.
Claim 13
Dependent Claim
46 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said electrostatic chuck has a network of gas distribution grooves through said first electrode and said second electrode and a vertically disposed gas supply tube through said first electrode and said second electrode connecting said grooves.
Claim 14
Dependent Claim
44 words
A split-ring electrostatic chuck as claimed in claim 12 wherein a cooling gas is passed through said gas supply tube into said network of gas distribution grooves to control the temperature of the semiconductor wafer clamped by said electrostatic chuck on said clamping surface.
Claim 15
Dependent Claim
23 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said first electrode has a series of cooling channels for carrying a fluid.
Claim 16
Dependent Claim
22 words
A split-ring electrostatic chuck as claimed in claim 1 wherein said insulator has a thickness of between approximately 0.001 and 0.003 inches.
Claim 17
Dependent Claim
24 words
A split-ring electrostatic chuck as claimed in claim 15 wherein said insulator has a breakdown voltage strength of at least 500 volts per mil.
Claim 18
Dependent Claim
15 words
A split-ring electrostatic chuck as claimed in claim 15 wherein said insulator is anodized aluminum.