US4733632A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer feeding apparatus
Assignee: Tokyo Electron Ltd
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Filing: 1986-09-25
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Granted: 1988-03-29
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Expires: 2006-09-25
Abstract
Abstract A wafer feeding apparatus comprises a horizontally movable arm section, an electrostatic chuck mechanism having a vertically movable support member attached to the arm section and moving mechanism for moving the support member, and an electrostatic chuck attached to the support member and having two semi-circular electrodes located in a manner to be electrically isolated from each other and each having a wafer attraction section and an insulating film formed on the wafer attraction section. A direct-current voltage is across the electrodes to electrostatically attract a semiconductor wafer to the wafer attraction sections of the electrodes through the insulating film.
Inventors
- 👤 Tadahiro Ohmi
- 👤 Hiromi Kumagai
- 👤 Yoshiaki Yanagi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 23:13
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7602; H10P72/72
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
122 words
A wafer feeding apparatus comprising: a movable arm section; an electrostatic chuck transporting mechanism having a movable support member attached to said arm section and movable in a direction different from that in which the arm is movable and moving mechanism for moving the support member; an electrostatic chuck attached to said support member of said electrostatic chuck transporting mechanism and having a plurality of electrodes located in a manner to be electrically isolated from each other and each having a wafer attraction section and an insulating film formed on the wafer attraction section; and means for applying a direct-current voltage across the electrodes to electrostatically attract a semiconductor wafer to the wafer attraction sections of the electrodes through the insulating film.
Claim 2
Dependent Claim
122 words
A wafer feeding apparatus comprising: a movable arm section; an electrostatic chuck transporting mechanism having a movable support member attached to said arm section and movable in a direction different from that in which the arm is movable and moving mechanism for moving the support member; an electrostatic chuck attached to said support member of said electrostatic chuck transporting mechanism and having a plurality of electrodes located in a manner to be electrically isolated from each other and each having a wafer attraction section and an insulating film formed on the wafer attraction section; and means for applying a direct-current voltage across the electrodes to electrostatically attract a semiconductor wafer to the wafer attraction sections of the electrodes through the insulating film.
Claim 3
Dependent Claim
21 words
A wafer feeding apparatus according to claim 1, in which said electrodes have opposite faces with a predetermined spacing left therebetween.
Claim 4
Dependent Claim
24 words
A wafer feeding apparatus according to claim 1, in which each of said electrodes has a sectional shape and are arranged in a circle.
Claim 5
Dependent Claim
155 words
A wafer feeding apparatus adapted to feed a semiconductor wafer onto a susceptor located within a preparatory chamber and feed it from there to another location, which comprises: an arm section movable in a horizontal direction and having a portion movable into and out of the preparatory chamber; an electrostatic chuck transporting mechanism having a support member attached to said portion of said arm section and vertically movable toward and away from said susceptor and movable mechanism or moving said support member; an electrostatic chuck attached to said support member of said electrostatic chuck transporting mechanism, including wafer attraction sections opposite to said susceptor and having a plurality of plate-like electrodes electrically isolating from each other and an insulating layer attached to the electrode and providing said wafer attraction section; and means for applying a direct-current voltage between the electrodes to allow the semiconductor wafer to be attracted to the electrodes through said insulating film.
Claim 6
Dependent Claim
155 words
A wafer feeding apparatus adapted to feed a semiconductor wafer onto a susceptor located within a preparatory chamber and feed it from there to another location, which comprises: an arm section movable in a horizontal direction and having a portion movable into and out of the preparatory chamber; an electrostatic chuck transporting mechanism having a support member attached to said portion of said arm section and vertically movable toward and away from said susceptor and movable mechanism or moving said support member; an electrostatic chuck attached to said support member of said electrostatic chuck transporting mechanism, including wafer attraction sections opposite to said susceptor and having a plurality of plate-like electrodes electrically isolating from each other and an insulating layer attached to the electrode and providing said wafer attraction section; and means for applying a direct-current voltage between the electrodes to allow the semiconductor wafer to be attracted to the electrodes through said insulating film.
Claim 7
Dependent Claim
34 words
A wafer feeding apparatus according to claim 4, in which said wafer attraction sections of said electrostatic chuck attract said semiconductor wafer at a location near the outer curved marginal portion of that wafer.
Claim 8
Dependent Claim
39 words
A wafer feeding apparatus according to claim 5, in which said electrodes are comprised of semicircular sections and provide a circular array as a whole and the whole surfaces of said respective electrodes are covered with said insulating film.
Claim 9
Dependent Claim
67 words
A wafer feeding apparatus comprising: an electrostatic chuck having electrode means comprised of a plurality of semicircular electroconductive plates each having a flat portion and a curved marginal portion, and an insulating layer formed on at least one surface of the curved marginal portion, the curved marginal portions being arranged on a circular line to form a wafer attraction section; and means for moving said electrostatic chuck.
Claim 10
Dependent Claim
67 words
A wafer feeding apparatus comprising: an electrostatic chuck having electrode means comprised of a plurality of semicircular electroconductive plates each having a flat portion and a curved marginal portion, and an insulating layer formed on at least one surface of the curved marginal portion, the curved marginal portions being arranged on a circular line to form a wafer attraction section; and means for moving said electrostatic chuck.
Claim 11
Dependent Claim
25 words
A wafer feeding apparatus according to claim 7, in which said electrode means has a diameter substantially the same as that of a semiconductor wafer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-29 | 1991-09-28 | 1992-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-29 | 1995-09-28 | 1996-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-29 | 1999-09-28 | 2000-03-29 | $7700.00 | Window Closed / Lapsed |