Patent US5045236A successfully refreshed from Google Patents.
US5045236A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper conductive composition
Assignee: Gun Ei Chemical Industry Co Ltd
•
Filing: 1989-11-14
•
Granted: 1991-09-03
•
Expires: 2009-11-14
Abstract
Abstract A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.
Inventors
- 👤 Masayuki Tsunaga
- 👤 Kazuaki Yuba
- 👤 Yoshiaki Kurimoto
- 👤 Maraki Hirosawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:51
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; C; C08; C08K; C08K9/00; C08K9/02; H01; H01B; H01B1/00; H01B1/20; H01B1/22
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
107 words
A copper conductive composition comprising: 100 parts by weight of spherical copper powder coated with silver, the average particle size of said spherical copper powder being from 2 to 20 μm and the amount of the silver coating being from 0.5 to 5 wt %, based on said spherical copper powder; 6 to 18 parts by weight of resol phenolic resin containing 5% or more of dimethylene ether bonds in the bonded formaldehyde, the molar ratio of formaldehyde to phenol (formaldehyde/phenol) in said phenolic resin being from 1.0 to 3.0; 0.05 to 1 parts by weight of dispersant; and 2 to 15 parts by weight of solvent.
Claim 2
Dependent Claim
107 words
A copper conductive composition comprising: 100 parts by weight of spherical copper powder coated with silver, the average particle size of said spherical copper powder being from 2 to 20 μm and the amount of the silver coating being from 0.5 to 5 wt %, based on said spherical copper powder; 6 to 18 parts by weight of resol phenolic resin containing 5% or more of dimethylene ether bonds in the bonded formaldehyde, the molar ratio of formaldehyde to phenol (formaldehyde/phenol) in said phenolic resin being from 1.0 to 3.0; 0.05 to 1 parts by weight of dispersant; and 2 to 15 parts by weight of solvent.
Claim 3
Dependent Claim
23 words
A copper conductive composition according to claim 1, wherein the average particle size of said spherical copper powder is 5 to 10 μm.
Claim 4
Dependent Claim
24 words
A copper conductive composition according to claim 1, wherein the amount of the silver coating is 1 to 3, based on metal copper powder.
Claim 5
Dependent Claim
25 words
A copper conductive composition according to claim 1, wherein said resol phenolic resin contains 15 50 30% of dimethylene ether bonds in said bonded formaldehyde.
Claim 6
Dependent Claim
26 words
A copper conductive composition according to claim 1, wherein the molar ratio of formaldehyde to phenol in said resol phenolic resin is from 1.5 to 2.5.
Claim 7
Dependent Claim
16 words
A copper conductive composition according to claim 1, wherein said dispersant comprises an organic titanate compound.
Claim 8
Dependent Claim
16 words
A copper conductive composition according to claim 1, wherein said solvent comprises a polyhydric alcohol derivative.
Claim 9
Dependent Claim
23 words
A copper conductive composition according to claim 1, containing one or more of an anti-foaming agent, a leveling agent, and a thixotropic agent.
Claim 10
Dependent Claim
23 words
A copper conductive composition according to claim 1, wherein said metal copper powder is coated with silver by an EDTA acidic bath method.
Claim 11
Dependent Claim
23 words
A copper conductive composition according to claim 5, wherein said metal copper powder is coated with silver by an EDTA acidic bath method.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-02 | 1995-03-04 | 1995-09-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-02 | 1999-03-04 | 1999-09-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-02 | 2003-03-04 | 2003-09-03 | $7700.00 | Window Closed / Lapsed |