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US5044306A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder applying mechanism
Assignee: Individual
•
Filing: 1990-06-11
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Granted: 1991-09-03
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Expires: 2010-06-11
Abstract
Abstract Mechanism is disclosed for wiping solder paste onto a printed circuit board through a stencil superposed on the board, including a first squeeges for wiping solder paste onto the stencil, a second squeegee for depositing solder paste at a location for engagement by the first squeeges and a tray, alternatively engagable with both squeeges to cooperate with the squeeges to deposit solder paste at the beginning of a wiping stroke and to pick up excess solder paste at the end of a wiping stroke.
Inventors
- 👤 Gunter Erdmann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 09:19
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0692; H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/1233; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0139
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
93 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a first squeegee for wiping solder paste onto a stencil b) a second squeegee for depositing solder paste at a location for engagement by the first squeegee; and c) a movable tray alternatively engagable with both squeegees to cooperate with the second squeegee to deposit solder paste at the beginning of a wiping stroke and to cooperate with the first squeegee to pick up excess solder paste at the end of a wiping stroke.
Claim 2
Dependent Claim
93 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a first squeegee for wiping solder paste onto a stencil b) a second squeegee for depositing solder paste at a location for engagement by the first squeegee; and c) a movable tray alternatively engagable with both squeegees to cooperate with the second squeegee to deposit solder paste at the beginning of a wiping stroke and to cooperate with the first squeegee to pick up excess solder paste at the end of a wiping stroke.
Claim 3
Dependent Claim
17 words
Mechanism according to claim 1 wherein both squeegees and the tray are carried by a reciprocating carriage.
Claim 4
Dependent Claim
21 words
Mechanism according to claim 1 wherein the tray is pivotable relative to the squeegees and movable linearly relative to the squeegees.
Claim 5
Dependent Claim
25 words
Mechanism according to claim 1 wherein there are means for raising the squeegees and the tray away from the stencil after it has been wiped.
Claim 6
Dependent Claim
197 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a reciprocating carriage movable relative to the surface of a stencil through a wiping stroke from a solder distributing location to a solder collecting location; b) a tray pivotably mounted relative to the carriage to receive unwiped solder paste at the collecting location at the end of a wiping stroke and to return the paste to the distributing location at the beginning of a wiping stroke; c) a wiping squeegee movable with the carriage to wipe solder paste onto the stencil and to move excess solder paste onto the tray at the end of a wiping stroke; d) a distributing squeegee spaced from the wiping squeegee for removing solder paste from the tray and depositing it at the distribution location; and e) means for moving the tray from an inactive position to the collecting position wherein it cooperates with the wiping squeegee to collect unspread solder paste at the end of a wiping stroke, to the distributing location wherein it cooperates with the distributing squeegee to deposit solder paste at the distributing location to begin a wiping stroke.
Claim 7
Dependent Claim
197 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a reciprocating carriage movable relative to the surface of a stencil through a wiping stroke from a solder distributing location to a solder collecting location; b) a tray pivotably mounted relative to the carriage to receive unwiped solder paste at the collecting location at the end of a wiping stroke and to return the paste to the distributing location at the beginning of a wiping stroke; c) a wiping squeegee movable with the carriage to wipe solder paste onto the stencil and to move excess solder paste onto the tray at the end of a wiping stroke; d) a distributing squeegee spaced from the wiping squeegee for removing solder paste from the tray and depositing it at the distribution location; and e) means for moving the tray from an inactive position to the collecting position wherein it cooperates with the wiping squeegee to collect unspread solder paste at the end of a wiping stroke, to the distributing location wherein it cooperates with the distributing squeegee to deposit solder paste at the distributing location to begin a wiping stroke.
Claim 8
Dependent Claim
26 words
Mechanism according to claim 5 wherein there are means for raising the carriage at the end of a wiping stroke after a stencil has been wiped.
Claim 9
Dependent Claim
22 words
Mechanism according to claim 5 wherein the means for moving the tray from the inactive position to the collecting position are pneumatic.
Claim 10
Dependent Claim
20 words
Mechanism according to claim 5 wherein the tray is provided with sides to prevent lateral displacement of the solder paste.
Claim 11
Dependent Claim
219 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a reciprocating carriage movable relative to the surface of a stencil through a wiping stroke from a solder distributing location to a solder collecting location; b) a tray pivotably mounted relative to the carriage to receive unwiped solder paste at the collecting location at the end of a wiping stroke and to return the paste to the distributing location at the beginning of a wiping stroke; c) a wiping squeegee movable with the carriage to wipe solder paste onto the stencil and to move excess solder paste onto the tray at the end of a wiping stroke; d) a distributing squeegee located between the wiping squeegee and the tray for removing solder paste from the tray and depositing it at the distribution location; e) the wiping squeegee being longer than the distributing squeegee; and f) means for reciprocating the tray from an inactive position remote from the wiping squeegee to the collecting position adjacent the wiping squeegee wherein it cooperates with the wiping squeegee to collect unspread solder paste at the end of a wiping stroke, to the distributing location wherein it cooperates with the distributing squeegee to deposit solder paste at the distributing location to begin a wiping stroke.
Claim 12
Dependent Claim
219 words
Mechanism for wiping solder paste onto a printed circuit board through a stencil superposed on the board, comprising: a) a reciprocating carriage movable relative to the surface of a stencil through a wiping stroke from a solder distributing location to a solder collecting location; b) a tray pivotably mounted relative to the carriage to receive unwiped solder paste at the collecting location at the end of a wiping stroke and to return the paste to the distributing location at the beginning of a wiping stroke; c) a wiping squeegee movable with the carriage to wipe solder paste onto the stencil and to move excess solder paste onto the tray at the end of a wiping stroke; d) a distributing squeegee located between the wiping squeegee and the tray for removing solder paste from the tray and depositing it at the distribution location; e) the wiping squeegee being longer than the distributing squeegee; and f) means for reciprocating the tray from an inactive position remote from the wiping squeegee to the collecting position adjacent the wiping squeegee wherein it cooperates with the wiping squeegee to collect unspread solder paste at the end of a wiping stroke, to the distributing location wherein it cooperates with the distributing squeegee to deposit solder paste at the distributing location to begin a wiping stroke.
Claim 13
Dependent Claim
26 words
Mechanism according to claim 9 wherein there are means for raising the carriage at the end of a wiping stroke after a stencil has been wiped.
Claim 14
Dependent Claim
22 words
Mechanism according to claim 9 wherein the means for moving the tray from the inactive position to the collecting position are pneumatic.
Claim 15
Dependent Claim
20 words
Mechanism according to claim 9 wherein the tray is provided with sides to prevent lateral displacement of the solder paste.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-02 | 1995-03-04 | 1995-09-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-02 | 1999-03-04 | 1999-09-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-02 | 2003-03-04 | 2003-09-03 | $7700.00 | Window Closed / Lapsed |