Patent US5043211A successfully refreshed from Google Patents.
US5043211A
Expired / Lapsed
US
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Epoxy resin composition and a resin-sealed semiconductor device
Assignee: Toshiba Corp
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Filing: 1988-03-30
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Granted: 1991-08-27
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Expires: 2008-03-30
Abstract
Abstract An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.
Inventors
- 👤 Akira Yoshizumi
- 👤 Kazutaka Matsumoto
- 👤 Shinetsu Fujieda
- 👤 Ken Uchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 16:42
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/476; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/62; C08G59/621; C08K; C08K3/00; C08K3/34; C08K3/36; C08K5/00; C08K5/54; C08K9/00; C08K9/08; C08L; C08L51/00; C08L51/04; C08L61/00; C08L61/04; C08L61/06; C08L63/00; H10W74/473; C08L2203/00; C08L2203/20; C08L2203/206; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/239; Y10T428/25; Y10T428/259; Y10T428/31504; Y10T428/31511
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
94 words
An epoxy resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) 30-75 parts by weight of phenolic resin; (C) 320-570 parts by weight of silica powder whose surface is treated, at room temperature, by a mixture of (i) 0.05-1.00% by weight of silane coupling agent, (ii) 0.05-1.00% by weight of a silicone base surface active agent, (iii) 0.15-3.00% by weight of thermosetting silicone rubber; and (D) 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer which is a graft copolymer in which the methyl methacrylate is graft-polymerized on the styrene butadiene copolymer.
Claim 2
Dependent Claim
94 words
An epoxy resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) 30-75 parts by weight of phenolic resin; (C) 320-570 parts by weight of silica powder whose surface is treated, at room temperature, by a mixture of (i) 0.05-1.00% by weight of silane coupling agent, (ii) 0.05-1.00% by weight of a silicone base surface active agent, (iii) 0.15-3.00% by weight of thermosetting silicone rubber; and (D) 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer which is a graft copolymer in which the methyl methacrylate is graft-polymerized on the styrene butadiene copolymer.
Claim 3
Dependent Claim
26 words
An epoxy resin composition according to claim 1, wherein phenolic resin (B) is a novolak type phenolic resin containing 10-70% by weight of phenol aralkyl resin.
Claim 4
Dependent Claim
32 words
An epoxy resin composition according to claim 1, wherein the silica powder is prepared from fused silica; and the total content of uranium and thorium is less than 1.0 ppb by weight.
Claim 5
Dependent Claim
102 words
A semiconductor device sealed by an epoxy resin composition, said epoxy resin composition containing: (A) 100 parts by weight of epoxy resin; (B) 30-75 parts by weight of phenolic resin; (C) 320-570 parts of silica powder whose surface is treated, at room temperature, by a mixture of (i) 0.05-1.00% by weight of silane coupling agent, (ii) 0.05-1.00% by weight of a silicone base surface active agent, and (iii) 0.15-3.00% by weight of thermosetting silicone rubber; and (D) 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer which is a graft copolymer in which the methyl methacrylate is graft-polymerized on the styrene butadiene copolymer.
Claim 6
Dependent Claim
102 words
A semiconductor device sealed by an epoxy resin composition, said epoxy resin composition containing: (A) 100 parts by weight of epoxy resin; (B) 30-75 parts by weight of phenolic resin; (C) 320-570 parts of silica powder whose surface is treated, at room temperature, by a mixture of (i) 0.05-1.00% by weight of silane coupling agent, (ii) 0.05-1.00% by weight of a silicone base surface active agent, and (iii) 0.15-3.00% by weight of thermosetting silicone rubber; and (D) 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer which is a graft copolymer in which the methyl methacrylate is graft-polymerized on the styrene butadiene copolymer.
Claim 7
Dependent Claim
30 words
A semiconductor device sealed by a resin according to claim 4, wherein phenolic resin (B) is a novolak type phenolic resin which contains 10-70% by weight of phenol aralkyl resin.
Claim 8
Dependent Claim
32 words
A semiconductor device sealed by a resin according to claim 4, wherein silica powder is prepared from fused silica; and the total content of uranium and thorium is 1.00 ppb by weight.
Claim 9
Dependent Claim
19 words
An epoxy resin composition according to claim 1, wherein said styrene-butadiene-methyl methacrylate copolymer is in the form of powder.
Claim 10
Dependent Claim
19 words
A semiconductor device according to claim 4, wherein said styrene-butadiene-methyl methacrylate copolymer is in the form of a powder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-26 | 1995-02-25 | 1995-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-26 | 1999-02-25 | 1999-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-26 | 2003-02-25 | 2003-08-27 | $7700.00 | Window Closed / Lapsed |