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US5041519A Expired / Lapsed US ⏱️ 0.0 years remaining

Composition comprising epoxy resin, bismaleimide and barbituric acid

Assignee: Industrial Technology Research Institute
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Filing: 1988-12-08
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Granted: 1991-08-20
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Expires: 2008-12-08
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Abstract

Abstract This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.

Inventors

  • 👤 Jing-Pin Pan
  • 👤 Ker-Ming Chen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 12:17
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4042; C08G59/50; C08G59/56; C08L; C08L63/00

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 120 words
A composition consisting of epoxy resin, bismaleimide and barbituric acid prepared by: a) dissolving said bismaleimide in a suitable solvent or solvent system and adding a suitable amount of said barbituric acid or its derivative to form a mixture; b) heating and stirring said mixture of step a) at a temperature of 115°-145° C. for 0.5-1.5 hours in order to form a bismaleimide resin mixture; c) adding said epoxy resin to said resin mixture of step b) and agitating and heating to form a resin system, wherein the molar ratio of said epoxy resin to said bismaleimide is 2.0-3.5; and d) adding a curing agent to said resin system of step c) and mixing and heating to form said composition.
Claim 2
Dependent Claim 120 words
A composition consisting of epoxy resin, bismaleimide and barbituric acid prepared by: a) dissolving said bismaleimide in a suitable solvent or solvent system and adding a suitable amount of said barbituric acid or its derivative to form a mixture; b) heating and stirring said mixture of step a) at a temperature of 115°-145° C. for 0.5-1.5 hours in order to form a bismaleimide resin mixture; c) adding said epoxy resin to said resin mixture of step b) and agitating and heating to form a resin system, wherein the molar ratio of said epoxy resin to said bismaleimide is 2.0-3.5; and d) adding a curing agent to said resin system of step c) and mixing and heating to form said composition.
Claim 3
Dependent Claim 32 words
A resin composition according to claim 1, wherein said barbituric acid or its derivatives are of the formula: ##STR7## wherein R 1 and R 2 represent hydrogen, an alkyl group or phenyl.
Claim 4
Dependent Claim 23 words
A resin composition according to claim 1, wherein said bismaleimide is of the formula: ##STR8## wherein R represents --CH 2 -- or --O--.
Claim 5
Dependent Claim 41 words
A resin composition according to claim 1, wherein said epoxy resin has the formula: ##STR9## wherein R is an alkyl group having 1-4 carbon atoms, n is a positive integer, and the equivalent molar weight of said epoxy resin is 150-1000.
Claim 6
Dependent Claim 21 words
A resin composition according to claim 1, wherein said molar ratio of bismaleimide to barbituric acid or its derivatives is 1.3-2.2.

References Cited (Backward Citations)

US4107153A Cited
US4294877A Cited
US4401777A Cited
US4539392A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-08-19 1995-02-18 1995-08-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-08-19 1999-02-18 1999-08-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-08-19 2003-02-18 2003-08-20 $7700.00 Window Closed / Lapsed

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