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Method for making solid state image sensing device

Assignee: Panasonic Holdings Corp
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Filing: 1990-06-27
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Granted: 1991-08-20
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Expires: 2010-06-27
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Abstract

Abstract In a solid state image sensing device of p-conductivity type well, photo-electro converting region (1) are configurated to have larger area as depth increases, so that excessive electric charges generated in the p-conductivity type well are easily transferred from expanded peripheral parts (7) at the bottom (1b) to channel (3), without being undesirably transferred downward through thin p-conductivity type region 6 to substrate (4), and smear electric charges which has been generated in a thin p-conductivity type well under the photo-electro converting region in the conventional device is suppressed, to effectively decrease the smear phenomenon.

Inventors

  • 👤 Takao Kuroda
  • 👤 Toshihiro Kuriyama
  • 👤 Kenju Horii
  • 👤 Hiroyuki Mizuno

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 03:42
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/15; H10F39/158; H10F39/153

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 180 words
Method for making a solid state image sensing device comprising the steps of: forming a first layer of a first conductivity type on a semiconductor substrate of a second conductivity type which is opposite to said first conductivity type; forming a second layer of said second conductivity type on said first layer; selectively introducing an impurity of said first conductivity type from a surface of said second layer to reach said first layer where it is underlying said second layer, for forming at least two impurity diffused regions of said first conductivity type, resulting in at least one photoelectric converting region which is surrounded by said first layer and two of said impurity diffused regions of said first conductivity type, said selectivity introducing step forming said photoelectric converting region of a shape to have a larger horizontal section at a lower portion than at an upper portion to reduce smearing phenomena; forming at least one charge transfer region on said impurity diffused regions; and forming at least one gate electrode above said impurity diffused regions and said charge transfer region.
Claim 2
Dependent Claim 180 words
Method for making a solid state image sensing device comprising the steps of: forming a first layer of a first conductivity type on a semiconductor substrate of a second conductivity type which is opposite to said first conductivity type; forming a second layer of said second conductivity type on said first layer; selectively introducing an impurity of said first conductivity type from a surface of said second layer to reach said first layer where it is underlying said second layer, for forming at least two impurity diffused regions of said first conductivity type, resulting in at least one photoelectric converting region which is surrounded by said first layer and two of said impurity diffused regions of said first conductivity type, said selectivity introducing step forming said photoelectric converting region of a shape to have a larger horizontal section at a lower portion than at an upper portion to reduce smearing phenomena; forming at least one charge transfer region on said impurity diffused regions; and forming at least one gate electrode above said impurity diffused regions and said charge transfer region.
Claim 3
Dependent Claim 38 words
Method for making solid state imaging sensing device in accordance with claim 1, wherein said substrate is of an n-conductivity type, said first layer is of a p-conductivity type and said photo-electro converting region is of n-conductivity type.

References Cited (Backward Citations)

US3838439A Cited
DE2447289A1 Cited
DE2744023A1 Cited
JPS54132183A Cited
JPS55156358A Cited
US4527182A Cited
US4663771A Cited
NL8202761A Cited
DE3326924A1 Cited
US4630091A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-08-19 1995-02-18 1995-08-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-08-19 1999-02-18 1999-08-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-08-19 2003-02-18 2003-08-20 $7700.00 Window Closed / Lapsed

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