Abstract A method of manufacturing a thermal printing head includes forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a large number of lead electrodes are formed beforehand in such a manner that the lead electrodes are separated from the common electrodes by a predetermined distance and are disposed on one side of the common electrodes in a vertical direction. It further includes performing a first etching on the layer of polyimide resin precursor such that a predetermined pattern is formed. Heat treatment is then performed on the layer of polyimide resin precursor to simultaneously form, between the lead electrodes and the common electrode disposed close to the lead electrodes, a polyimide resin heat accumulating layer as a base for a heating resistor as well as a polyimide resin insulating layer capable of electrically insulating a jumper wire connecting the common electrode disposed remote from the lead electrodes to the heating resistor on the common electrode disposed close to the lead electrodes. The heating resistor is then formed on the polyimide resin heat accumulating layer. Finally, a wire connecting the heating resistor to the two common electrodes and to the plurality of lead electrodes is formed.
A method of manufacturing a thermal print head, comprising the steps of: forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a plurality of lead electrodes have been formed in such a manner that said plurality of lead electrodes are separated from said common electrodes by a predetermined distance and are disposed on one side of said common electrodes, in a vertical direction; performing a first etching on said layer of polyimide resin precursor to form a predetermined pattern and then performing heat treatment on said layer of polyimide resin precursor to simultaneously form, between said plurality of lead electrodes, a polyimide resin heat accumulating layer as a base for a heating resistor and a polyimide resin insulating layer capable of electrically insulating a jumper wire, connecting one of said two parallel common electrodes disposed remote from said plurality of lead electrodes, to said heating resistor on one of said common electrodes, disposed close to said plurality of lead electrodes; forming said heating resistor on said polyimide resin heat accumulating layer; and forming a wire, connecting said heating resistor to said two parallel common electrodes and to said plurality of lead electrodes.
Claim 2
Independent Claim
202 words
A method of manufacturing a thermal print head, comprising the steps of: forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a plurality of lead electrodes have been formed in such a manner that said plurality of lead electrodes are separated from said common electrodes by a predetermined distance and are disposed on one side of said common electrodes, in a vertical direction; performing a first etching on said layer of polyimide resin precursor to form a predetermined pattern and then performing heat treatment on said layer of polyimide resin precursor to simultaneously form, between said plurality of lead electrodes, a polyimide resin heat accumulating layer as a base for a heating resistor and a polyimide resin insulating layer capable of electrically insulating a jumper wire, connecting one of said two parallel common electrodes disposed remote from said plurality of lead electrodes, to said heating resistor on one of said common electrodes, disposed close to said plurality of lead electrodes; forming said heating resistor on said polyimide resin heat accumulating layer; and forming a wire, connecting said heating resistor to said two parallel common electrodes and to said plurality of lead electrodes.
Claim 3
Dependent Claim
24 words
The method of claim 1, wherein the layer of polyimide precursor is formed by coating an aromatic polyamic acid solution in an organic solvent.
Claim 4
Dependent Claim
25 words
The method of claim 1, wherein the polyimide resin heat accumulating layer and the polyimide resin insulating layer each has a thickness of 3-60 μm.
Claim 5
Dependent Claim
25 words
The method of claim 1, wherein the polyimide resin heat accumulating layer and the polyimide resin insulating layer each has a thickness of 3-30 μm.