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US4617088A Expired / Lapsed US ⏱️ 0.0 years remaining

Thermal head producing process

Assignee: Kyocera Corp
•
Filing: 1985-10-15
•
Granted: 1986-10-14
•
Expires: 2005-10-15
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Abstract

Abstract A thermal head composed of an electrically insulative substrate, a resistive film made of TiO x (0<x<2) formed on the substrate, and an electrode made of a metal such as Au, Al, and Cu etc. The resistive film is produced by an electron beam vapor deposition method employing an apparatus having a vacuum chamber wherein an evaporation source composed of Ti is irradiated with an electron beam to evaporate Ti so as to deposit a resultant TiO x on the substrate.

Inventors

  • 👤 Yasuo Nishiguchi
  • 👤 Keijiro Minami

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 20:44
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33505; B41J2/3351; B41J2/33515; B41J2/3355; B41J2/33555; B41J2/3357; B41J2/3359

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 37 words
A process for producing a thermal head comprising the steps of: preparing an electrically insulative substrate; forming a resistive film comprising TiO x (0<x<2) on the electrically insulative substrate; and forming an electrode on the resistive film.
Claim 2
Dependent Claim 37 words
A process for producing a thermal head comprising the steps of: preparing an electrically insulative substrate; forming a resistive film comprising TiO x (0<x<2) on the electrically insulative substrate; and forming an electrode on the resistive film.
Claim 3
Dependent Claim 29 words
A process as claimed in claim 1, wherein said step of forming the resistive film on the electrically insulative substrate is accomplished by an electron beam vapor deposition method.
Claim 4
Dependent Claim 84 words
A process as claimed in claim 2, wherein said electron beam vapor deposition method comprises: preparing an apparatus comprising a vacuum chamber for containing a cathode, an anode, an evaporation source composed of Ti and a substrate holder having a substrate disposed thereon; irradiating said evaporation source composed of Ti with an electron beam to evaporate Ti in the vacuum chamber; and causing evaporated Ti to be bonded with the oxygen remaining in the vacuum chamber to thereby deposit TiO x on said substrate.
Claim 5
Dependent Claim 22 words
A process as claimed in claim 3, wherein the vacuum chamber has the vacuum degree within 2×10 -5 to 5×10 -6 torr.
Claim 6
Dependent Claim 31 words
A process as claimed in claim 3, wherein the electron beam is emitted by applying a voltage of about 20 kV between the cathode and the anode in the vacuum chamber.
Claim 7
Dependent Claim 25 words
A process as claimed in claim 3, wherein said TiO x is deposited on the substrate at the rate of about 20 to 100 Å/min.
Claim 8
Dependent Claim 48 words
A process as claimed in claim 1, wherein said step of forming the electrode on the resistive film is accomplished by preparing a metal selected from the group of Au, Al, and Cu as a material of the electrode and utilizing a vapor deposition method and etching process.

References Cited (Backward Citations)

US4206541A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-10-13 1990-04-14 1990-10-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-10-13 1994-04-14 1994-10-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-10-13 1998-04-14 1998-10-14 $7700.00 Window Closed / Lapsed

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