US5032897A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated thermoelectric cooling
Assignee: International Business Machines Corp
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Filing: 1990-02-28
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Granted: 1991-07-16
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Expires: 2010-02-28
Abstract
Abstract A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.
Inventors
- 👤 Mohanlal S. Mansuria
- 👤 Joseph M. Mosley
- 👤 Richard D. Musa
- 👤 William F. Shutler
- 👤 Vito J. Tuozzolo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 12:07
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/28; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
194 words
An integrated circuit package comprising an electrically insulative module, said module including a plurality of walls including a bottom surface, said plurality of walls defining a cavity, said module including a plurality of input/output pins, said module defining integrated circuit connection conductors which extend from some of said input/output pins to positions located along the walls of said cavity spaced from the bottom surface of said cavity, said module defining thermoelectric cooler conductor channels which extend from others of said input/output pins to said bottom surface of said cavity, an integrated circuit chip positioned within said cavity, said integrated circuit chip being electrically connected to said portions located along the walls of said cavity, a thermoelectric cooler having a first side and a second side, said first side of said thermoelectric cooler being thermally connected to said integrated circuit chip, and said second side being thermally connected to said bottom surface of said cavity so as to cool said integrated circuit chip, and thermoelectric cooler conductors passing though said thermoelectric conductor channels, said thermoelectric cooler conductors being electrically connected between said second side of said thermoelectric cooler and said others of said input/output pins.
Claim 2
Dependent Claim
194 words
An integrated circuit package comprising an electrically insulative module, said module including a plurality of walls including a bottom surface, said plurality of walls defining a cavity, said module including a plurality of input/output pins, said module defining integrated circuit connection conductors which extend from some of said input/output pins to positions located along the walls of said cavity spaced from the bottom surface of said cavity, said module defining thermoelectric cooler conductor channels which extend from others of said input/output pins to said bottom surface of said cavity, an integrated circuit chip positioned within said cavity, said integrated circuit chip being electrically connected to said portions located along the walls of said cavity, a thermoelectric cooler having a first side and a second side, said first side of said thermoelectric cooler being thermally connected to said integrated circuit chip, and said second side being thermally connected to said bottom surface of said cavity so as to cool said integrated circuit chip, and thermoelectric cooler conductors passing though said thermoelectric conductor channels, said thermoelectric cooler conductors being electrically connected between said second side of said thermoelectric cooler and said others of said input/output pins.
Claim 3
Dependent Claim
47 words
The integrated circuit package of claim 1 wherein said thermoelectric cooler includes a plurality of thermoelectric cooler elements, each said thermoelectric cooler element having a first end oriented in the direction of said module and a second end oriented in the direction of said integrated circuit chip.
Claim 4
Dependent Claim
46 words
The integrated circuit package of claim 2 wherein said module includes first conductors positioned along a wall of said cavity, said first conductors electrically connecting pairs of said first ends of said thermoelectric cooler elements so as to provide a hot side of said thermoelectric cooler.
Claim 5
Dependent Claim
67 words
The integrated circuit package of claim 3 further comprising a cold plate positioned between said integrated circuit chip and said thermoelectric cooler, said cold plate being configured to conduct thermal energy from said integrated circuit chip to said thermoelectric cooler, said cold plate including second conductors, said second conductors electrically connecting pairs of said second ends so as to provide a cold side of said thermoelectric cooler.
Claim 6
Dependent Claim
17 words
The integrated circuit package of claim 2 wherein said thermoelectric cooler elements are constructed of semiconductor materials.
Claim 7
Dependent Claim
21 words
The integrated circuit package of claim 5 wherein said thermoelectric cooler elements are constructed of different types of said semiconductor materials.
Claim 8
Dependent Claim
20 words
The integrated circuit package of claim 6 wherein said different types of semiconductor materials include P-type material and N-type material.
Claim 9
Dependent Claim
24 words
The integrated circuit package of claim 7 wherein said P-type material and N-type material are arranged alternately, electrically in series and thermally in parallel.
Claim 10
Dependent Claim
20 words
The integrated circuit package of claim 1 further comprising: a heat sink attached to an exterior wall of said module.
Claim 11
Dependent Claim
23 words
The integrated circuit package of claim 1 wherein said input/output pins are electrically connected to said integrated circuit chip via wire bond connections.
Claim 12
Dependent Claim
24 words
The integrated circuit package of claim 1 wherein said input/output pins are electrically connected to said integrated circuit chip via controlled chip collapse connections.
Claim 13
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein said thermoelectric cooler is hermetically sealed within said module.
Claim 14
Dependent Claim
22 words
The integrated circuit package of claim 1 wherein portions of said thermoelectric cooler conductors are located along walls of said module cavity.
Claim 15
Dependent Claim
21 words
The integrated circuit package of claim 1 further comprising a plurality of integrated circuit chips thermally connected to said thermoelectric cooler.
Claim 16
Dependent Claim
46 words
The integrated circuit package of claim 1 further comprising a plurality of integrated circuit chips, and a plurality of thermoelectric coolers, said thermoelectric coolers being thermally connected between said integrated circuit chips and a wall of said cavity so as to cool said integrated circuit chips.
Claim 17
Dependent Claim
19 words
The integrated circuit package of claim 15 wherein said plurality of thermoelectric coolers correspond to respective integrated circuit chips.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-15 | 1995-01-14 | 1995-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-15 | 1999-01-14 | 1999-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-15 | 2003-01-14 | 2003-07-16 | $7700.00 | Window Closed / Lapsed |