US4926227A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sensor devices with internal packaged coolers
Assignee: Nanometrics Inc
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Filing: 1986-08-01
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Granted: 1990-05-15
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Expires: 2006-08-01
Abstract
Abstract Heat sensitive sensors, such as charge coupled devices which must be cooled to reduce dark current leakage, are packaged in a chip carrier and in contact with the cold surface of an electrothermal cooler the warm opposite surface of which contacts the floor of the carrier to heat the carrier body and the window of the chip carrier to prevent fogging of the cover glass while the sensor remains cold.
Inventors
- 👤 Earl M. Jensen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:32
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/28
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
92 words
A package having a floor, a roof, side walls coupled between said floor and said roof, and a window, said package containing a heat sensitive sensor and means for cooling said sensor and for heating said package and window to reduce fogging thereof, said means including an electrothermal cooler having a first surface in contact with the floor of said package and a second surface in contact with said sensor, said cooler developing a warm first surface and a cold second surface upon the application of electrical current of a particular polarity.
Claim 2
Dependent Claim
92 words
A package having a floor, a roof, side walls coupled between said floor and said roof, and a window, said package containing a heat sensitive sensor and means for cooling said sensor and for heating said package and window to reduce fogging thereof, said means including an electrothermal cooler having a first surface in contact with the floor of said package and a second surface in contact with said sensor, said cooler developing a warm first surface and a cold second surface upon the application of electrical current of a particular polarity.
Claim 3
Dependent Claim
16 words
The package claimed in claim 1 wherein said heat sensitive sensor is a charge coupled device.
References Cited (Backward Citations)
JPS5313885A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-05-14 | 1993-11-13 | 1994-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-05-14 | 1997-11-13 | 1998-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-05-14 | 2001-11-13 | 2002-05-15 | $7700.00 | Window Closed / Lapsed |