US5031026A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin semiconductor card
Assignee: Mitsubishi Electric Corp
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Filing: 1988-07-01
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Granted: 1991-07-09
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Expires: 2008-07-01
Abstract
Abstract The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.
Inventors
- 👤 Tetsuya Ueda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:36
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/02
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
53 words
A thin semiconductor card comprising: a card main body comprising a first section surrounded by a second section; a semiconductor module mounted to said first section; a deformable material surrounding said first section connecting said first and second sections; whereby said deformable material absorbs stresses resulting from external forces applied to said card.
Claim 2
Dependent Claim
53 words
A thin semiconductor card comprising: a card main body comprising a first section surrounded by a second section; a semiconductor module mounted to said first section; a deformable material surrounding said first section connecting said first and second sections; whereby said deformable material absorbs stresses resulting from external forces applied to said card.
Claim 3
Dependent Claim
88 words
A thin semiconductor card comprising: a card main body comprising a first section surrounded by a second section making up the rest of said card main body; a semiconductor module mounted to said first section; a material that is weaker than said first and second sections surrounding and connecting said first and second sections; said weaker material absorbs stresses resulting from external forces applied to said card and breaks before said first section containing said semiconductor module is stressed sufficiently to cause damage to said mounted semiconductor module.
Claim 4
Dependent Claim
88 words
A thin semiconductor card comprising: a card main body comprising a first section surrounded by a second section making up the rest of said card main body; a semiconductor module mounted to said first section; a material that is weaker than said first and second sections surrounding and connecting said first and second sections; said weaker material absorbs stresses resulting from external forces applied to said card and breaks before said first section containing said semiconductor module is stressed sufficiently to cause damage to said mounted semiconductor module.
Claim 5
Dependent Claim
58 words
A thin semiconductor card comprising: a card main body comprising a first section and a second section; a semiconductor module mounted to said first section; a flexible mechanical coupling connecting said first and second sections along their common boarder; whereby the mechanical action of said flexible mechanical coupling absorbs stresses resulting from external forces applied to said card.
Claim 6
Dependent Claim
58 words
A thin semiconductor card comprising: a card main body comprising a first section and a second section; a semiconductor module mounted to said first section; a flexible mechanical coupling connecting said first and second sections along their common boarder; whereby the mechanical action of said flexible mechanical coupling absorbs stresses resulting from external forces applied to said card.
Claim 7
Dependent Claim
18 words
A thin semiconductor card according to claim 1, wherein said deformable material is comprised of an elastic material.
Claim 8
Dependent Claim
19 words
A thin semiconductor card according to claim 3, wherein said flexible mechanical coupling is comprised of a hinged coupling.
Claim 9
Dependent Claim
23 words
A thin semiconductor card according to claim 1, wherein a set of electrode contacts are mounted on the surface of said semiconductor module.
Claim 10
Dependent Claim
23 words
A thin semiconductor card according to claim 2, wherein a set of electrode contacts are mounted on the surface of said semiconductor module.
Claim 11
Dependent Claim
23 words
A thin semiconductor card according to claim 3, wherein a set of electrode contacts are mounted on the surface of said semiconductor module.
Claim 12
Dependent Claim
23 words
A thin semiconductor card according to claim 1, wherein said card's overall shape is substantially identical to that of a conventional IC card.
Claim 13
Dependent Claim
23 words
A thin semiconductor card according to claim 2, wherein said card's overall shape is substantially identical to that of a conventional IC card.
Claim 14
Dependent Claim
23 words
A thin semiconductor card according to claim 3, wherein said card's overall shape is substantially identical to that of a conventional IC card.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-08 | 1995-01-07 | 1995-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-08 | 1999-01-07 | 1999-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-08 | 2003-01-07 | 2003-07-09 | $7700.00 | Window Closed / Lapsed |