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EP0116148A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Identity card with integrated circuit

Assignee: GAO Gesellschaft fuer Automation und Organisation mbH
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Filing: 1983-12-12
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Granted: —
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Expires: 2003-12-12
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Abstract

Abstract Translated from German Mehrschichtige Ausweiskarte, die in einem Hohlraum einen IC-Baustein enthält. Der Hohlraum wird vor dem Laminieren des Kartenverbundes unter Anwendung von Druck und Wärme mit einem flüssig bis pastös eingestellten Polymer gefüllt. Beim Laminieren füllt das Polymer, unterstützt durch die Druckeinwirkung, den Hohlraum um den IC-Baustein völlig aus. Bei der fertigen Karte ist das Polymer zu einer festen, gummiartigen Masse vernetzt, die den IC-Baustein im Kartenhohlraum schützt. Multi-layer ID card containing an IC chip in a cavity. Before the laminated card is laminated, the cavity is filled with a liquid to pasty polymer using pressure and heat. During lamination, the polymer completely fills the cavity around the IC chip, supported by the pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass that protects the IC component in the card cavity.

Inventors

  • 👤 Joachim Hoppe

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 09:54
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/0772; G06K19/07728; H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

DE2734439A1 Cited
EP0019280A1 Cited
FR2483128A1 Cited
GB2081974A Cited
EP0071255A2 Cited
FR2520541A1 Cited

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