Method of fabricating a CMOS semiconductor device

Claim 1

A method of fabricating a semiconductor device, comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; implanting first ions into the substrate to form an LDD layer in the substrate; forming a resist pattern covering the gate electrode; and implanting second ions into the substrate to form source and drain regions containing the LDD layer; wherein said resist pattern prevents the gate electrode from being exposed to ion implantation during the second ion implanting step so that channeling is prevented from occurring in the gate electrode.

Claim 2

A method of fabricating a semiconductor device, comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; implanting first ions into the substrate to form an LDD layer in the substrate; forming a resist pattern covering the gate electrode; and implanting second ions into the substrate to form source and drain regions containing the LDD layer; wherein said resist pattern prevents the gate electrode from being exposed to ion implantation during the second ion implanting step so that channeling is prevented from occurring in the gate electrode.

Claim 3

A method of fabricating a semiconductor device, comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; forming a first protective film on the gate electrode; implanting first ions into the substrate to form an LDD layer in the substrate; removing the first protective film; forming walls around the gate electrode after said removing step; forming a second protective film on the gate electrode after said wall-forming step; and implanting second ions into the substrate to form source and drain regions in the substrate; wherein said first protective film prevents the gate electrode from being exposed to ion implantation during the first ion implanting step and said second protective film prevents the gate electrode from being exposed to ion implantation during the second ion implanting step so that channeling is prevented from occurring in the gate electrode.

Claim 4

A method of fabricating a semiconductor device, comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; forming a first protective film on the gate electrode; implanting first ions into the substrate to form an LDD layer in the substrate; removing the first protective film; forming walls around the gate electrode after said removing step; forming a second protective film on the gate electrode after said wall-forming step; and implanting second ions into the substrate to form source and drain regions in the substrate; wherein said first protective film prevents the gate electrode from being exposed to ion implantation during the first ion implanting step and said second protective film prevents the gate electrode from being exposed to ion implantation during the second ion implanting step so that channeling is prevented from occurring in the gate electrode.

Claim 7

A method of fabricating a semiconductor device comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; forming a first protective film on the gate electrode; implanting first ions into the substrate to form an LDD layer in the substrate, wherein said first protective film prevents the gate electrode from being exposed to ion implantation during said first ion implantating step so that channeling is prevented from occurring in the gate electrode; removing the first protective film; forming walls around the gate electrode after said removing step; implanting second ions into the substrate to form source and drain regions of a PMOS transistor in the substrate; forming a second protective film on the gate electrode after said second ion implanting step; and implanting third ions into the substrate to form source and drain regions of an NMOS transistor in the substrate, wherein said second protective film prevents the gate electrode from being exposed to ion implantation during the third ion implanting step so that channeling is prevented from occurring in the gate electrode.

Claim 8

A method of fabricating a semiconductor device comprising the steps of: forming a gate oxide film on a semiconductor substrate; forming a gate electrode on the gate oxide film; forming a first protective film on the gate electrode; implanting first ions into the substrate to form an LDD layer in the substrate, wherein said first protective film prevents the gate electrode from being exposed to ion implantation during said first ion implantating step so that channeling is prevented from occurring in the gate electrode; removing the first protective film; forming walls around the gate electrode after said removing step; implanting second ions into the substrate to form source and drain regions of a PMOS transistor in the substrate; forming a second protective film on the gate electrode after said second ion implanting step; and implanting third ions into the substrate to form source and drain regions of an NMOS transistor in the substrate, wherein said second protective film prevents the gate electrode from being exposed to ion implantation during the third ion implanting step so that channeling is prevented from occurring in the gate electrode.