← Back to Patent Explorer
US5024733A Expired / Lapsed US ⏱️ 0.0 years remaining

Palladium alloy electroplating process

Assignee: Nokia Bell Labs
•
Filing: 1990-05-11
•
Granted: 1991-06-18
•
Expires: 2010-05-11
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract An electroplating process is described for electroplating alloys of palladium and arsenic. The resulting electrodeposits are bright, ductile and remain ductile and crack-free even when the electrodeposits are quite thick. The deposits are quite hard and suitable for contact surfaces particularly in situations where wear characteristics require thick deposits. The electroplating process is also useful for making articles such as bellows by electroform procedures particularly since the electroplated material has extraordinary physical properties (good resilience, low stress and ductility) as well as good corrosion resistance.

Inventors

  • 👤 Joseph A. Abys
  • 👤 Heinrich K. Straschil

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-10 01:09
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/567

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 186 words
A process of electroplating a metallic substance onto a surface, said metallic substance comprising palladium and arsenic, said process comprising the step of passing current through a cathode, an electroplating bath and an anode, said electroplating bath comprising a source of palladium and a source of arsenic and having an electrical conductivity greater than 10 -3 mho-cm and pH greater than 7, said source of palladium comprises a palladium complex ion with a complexing agent selected from the group consisting of ammonia, diaminopropane, 1,4-diamino butane, 1,6-diaminohexane, and 2-hydroxyl-1,3-diaminopropane, said source of arsenic is selected from the group consisting of As 2 O 3 , As 2 O 5 , KH 2 AsO 4 , K 2 HAsO 4 , K 3 AsO 4 , NaH 2 AsO 4 , Na 2 HAsO 4 , Na 3 AsO 4 , K 3 AsO 3 , KAsO 2 , Na 3 AsO 3 , NaAsO 2 and Na 4 As 2 O 7 , said electroplating bath having a palladium concentration of from 0.005 to 1.0 molar, and an arsenic concentration of from 0.01 molar to 0.1 molar.
Claim 2
Dependent Claim 186 words
A process of electroplating a metallic substance onto a surface, said metallic substance comprising palladium and arsenic, said process comprising the step of passing current through a cathode, an electroplating bath and an anode, said electroplating bath comprising a source of palladium and a source of arsenic and having an electrical conductivity greater than 10 -3 mho-cm and pH greater than 7, said source of palladium comprises a palladium complex ion with a complexing agent selected from the group consisting of ammonia, diaminopropane, 1,4-diamino butane, 1,6-diaminohexane, and 2-hydroxyl-1,3-diaminopropane, said source of arsenic is selected from the group consisting of As 2 O 3 , As 2 O 5 , KH 2 AsO 4 , K 2 HAsO 4 , K 3 AsO 4 , NaH 2 AsO 4 , Na 2 HAsO 4 , Na 3 AsO 4 , K 3 AsO 3 , KAsO 2 , Na 3 AsO 3 , NaAsO 2 and Na 4 As 2 O 7 , said electroplating bath having a palladium concentration of from 0.005 to 1.0 molar, and an arsenic concentration of from 0.01 molar to 0.1 molar.
Claim 3
Dependent Claim 11 words
The process of claim 1 in which said diaminopropane is 1,3-diaminopropane.
Claim 4
Dependent Claim 28 words
The process of claim 1 in which the source of arsenic is selected from the group consisting of As 2 O 3 and As 2 O 5 .
Claim 5
Dependent Claim 17 words
The process of claim 1 in which the electroplating bath further comprises a surfactant and a brightener.
Claim 6
Dependent Claim 15 words
The process of claim 1 in which the electroplating bath further comprises a phosphate buffer.
Claim 7
Dependent Claim 11 words
The process of claim 5 in which the buffer comprises phosphate.
Claim 8
Dependent Claim 21 words
The process of claim 1, in which the concentration of palladium in the electroplating bath ranges from 0.05 to 0.3 molar.
Claim 9
Dependent Claim 138 words
A process of electroplating a metallic substance on a surface, said metallic substance comprising palladium and arsenic, said process comprising the step of passing current through a cathode, an electroplating bath and an anode with cathode potential great enough to electroplate the metallic substance, said electroplating bath comprising a source of palladium and a source of arsenic and having an electrical conductivity greater than 10 -3 mho-cm and pH greater than 7, said source of palladium comprises a palladium complex ion with complexing agent selected from the group consisting of ammonia and 1,3-diaminopropane, said source of arsenic is selected from the group consisting of As 2 O 3 and As 2 O 5 , said electroplating bath having a palladium concentration of from 0.005 to 1.0 molar and an arsenic concentration of from 0.01 molar to 0.1 molar.
Claim 10
Dependent Claim 138 words
A process of electroplating a metallic substance on a surface, said metallic substance comprising palladium and arsenic, said process comprising the step of passing current through a cathode, an electroplating bath and an anode with cathode potential great enough to electroplate the metallic substance, said electroplating bath comprising a source of palladium and a source of arsenic and having an electrical conductivity greater than 10 -3 mho-cm and pH greater than 7, said source of palladium comprises a palladium complex ion with complexing agent selected from the group consisting of ammonia and 1,3-diaminopropane, said source of arsenic is selected from the group consisting of As 2 O 3 and As 2 O 5 , said electroplating bath having a palladium concentration of from 0.005 to 1.0 molar and an arsenic concentration of from 0.01 molar to 0.1 molar.
Claim 11
Dependent Claim 21 words
The process of claim 1, in which the concentration of palladium in the electroplating bath ranges from 0.05 to 0.3 molar.
Claim 12
Dependent Claim 17 words
The process of claim 1 in which the electroplating bath further comprises a surfactant and a brightener.
Claim 13
Dependent Claim 15 words
The process of claim 1 in which the electroplating bath further comprises a phosphate buffer.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-06-17 1994-12-17 1995-06-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-06-17 1998-12-17 1999-06-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-06-17 2002-12-17 2003-06-18 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag