Abstract A method of forming solder bumps includes the steps of applying a thick layer of solder resist to a substrate. The resist is selectively removed to provide wells at solder pads on the substrate. The solder paste is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps on the pads. A socket for a solder bumped member is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist is applied to the substrate. The resist is selectively removed to provide wells at the metalized pads of the substrate. Solder paste is then deposited in the wells. The solder bumped member can then be positioned so that the solder bumps are located in the wells. The solder paste is reflowed to bond to the solder bumps and the metalized pads. The solder paste can be selected to have a lower melting temperature than the solder bumps. By reflowing the solder paste at a temperature lower than the melting temperature of the solder bumps, the paste can wet to and blend with the solder bumps while not causing the solder bumps to reflow.
A method of forming solder bumps comprising the steps of: applying a thick layer of resist on the substrate forming wells in the resist by selectively removing portions thereof over solder pads on the substrate applying solder paste only in the wells to contact the solder pads, and reflowing the solder paste to form solder bumps on the solder pads.
Claim 2
Independent Claim
60 words
A method of forming solder bumps comprising the steps of: applying a thick layer of resist on the substrate forming wells in the resist by selectively removing portions thereof over solder pads on the substrate applying solder paste only in the wells to contact the solder pads, and reflowing the solder paste to form solder bumps on the solder pads.
Claim 3
Dependent Claim
25 words
A method of forming solder bumps as defined in claim 1, including the further step of removing the remaining resist after forming the solder bumps.
Claim 4
Dependent Claim
22 words
A method of forming solder bumps as defined in claim 1, in which the layer of resist is approximately 15 mils. thick.
Claim 5
Independent Claim
24 words
A method of forming solder bumps as defined in claim, 1 in which the solder paste is applied to the substrate with a squeegee.
Claim 6
Dependent Claim
25 words
A method of forming solder bumps as defined in claim 1, in which the wells are formed to be slightly larger than the solder pads.
Claim 7
Dependent Claim
24 words
A method of forming solder bumps as defined in claim 1, in which the layer of solder resist is at least 10 mils. thick.