Apparatus for producing compound semiconductor thin films

Claim 3

The apparatus of claim 1 wherein the closed loop operates as a thermosiphon.

Claim 4

The apparatus of claim 1 including a horizontally oriented by-pass line selectively communicating with said hot leg riser and cold leg downcomer above the elevation of said crossconnect.

Claim 5

The apparatus of claim 1 wherein the supply means comprises at least one hot trap for collecting, containing, and supplying a source of said further constituent and including means for heating and cooling said hot trap.

Claim 6

The apparatus of claim 1 wherein cold traps are included for collecting and containing said further constituent species for reuse and comprising means for heating and cooling said cold traps.

Claim 7

The apparatus of claim 1 wherein said hot leg riser comprises a cracking section to decompose a precursor of said additional constituent.

Claim 8

The apparatus of claim 1 wherein a pyrolysis chamber between said hot leg riser and said reaction chamber comprises a cracking section to decompose a precursor said further constituent.

Claim 9

The apparatus of claim 1 including an induction blower communicating with said reaction chamber and inducing gas flows through the apparatus.

Claim 10

The apparatus of claim 1 in which the hot leg riser and reaction chamber are replaced by a vertically oriented combined riser/reaction chamber in which said volatile gas species react with one or more constituents of a semiconductor thin film to form said semiconductor thin film.

Claim 11

The apparatus of claim 3 and 4 including a gas inlet line selectively communicating with said cross-connect, a first waste line selectively communicating with said cross-connect, auxiliary lines selectively communicating said cross-connect with said hot trap and said cold trap, and a second waste line selectively communicating with said reaction chamber.

Claim 12

The apparatus of claim 1 wherein said constituents are chosen from the group consisting of Groups IB, IIIA and VIA of the Periodic Table.

Claim 13

The apparatus of claim 11 wherein said constituents are copper, indium and selenium.

Claim 14

The apparatus of claim 4 wherein the reactive atmosphere contains selenium and the source material is elemental selenium.

Claim 15

The apparatus of claim 12 wherein said gaseous species is hydrogen selenide gas.

Claim 16

A process for producing a compound semiconductor thin film material having a plurality of constituent elements in a closed loop apparatus having as functional components means for supplying source material of at least one constituent element, a vertically oriented hot leg riser selectively communicating with said supply means, a reaction chamber located above said supply means and said hot leg riser, heating means for said reaction chamber, a vertically oriented cold leg downcomer selectively communicating with said reaction chamber, a horizontally oriented cross-connect located above said supply means and below said reaction chamber and selectively communicating with said hot leg riser and cold leg downcomer, and independently controlled heating and cooling means for said supply means, cross-connect and by-pass line, and means for controlling the flow communication through said apparatus, said process comprising the steps of: a. preheating the apparatus; b. operating the apparatus reactor in a closed loop fashion by establishing an initial thermosiphon flow of the source material through the hot leg riser and across the by-pass line and down the cold leg downcomer and across the cross-connect line; c. diverting the flow through the reaction chamber after thermosiphon flow is established through the by-pass line; and d. diverting the supply means to entrain the source material through the hot leg riser and into the reaction chamber for reaction with materials on the substrate.

Claim 17

A process for producing a compound semiconductor thin film material having a plurality of constituent elements in a closed loop apparatus having as functional components means for supplying source material of at least one constituent element, a vertically oriented hot leg riser selectively communicating with said supply means, a reaction chamber located above said supply means and said hot leg riser, heating means for said reaction chamber, a vertically oriented cold leg downcomer selectively communicating with said reaction chamber, a horizontally oriented cross-connect located above said supply means and below said reaction chamber and selectively communicating with said hot leg riser and cold leg downcomer, and independently controlled heating and cooling means for said supply means, cross-connect and by-pass line, and means for controlling the flow communication through said apparatus, said process comprising the steps of: a. preheating the apparatus; b. operating the apparatus reactor in a closed loop fashion by establishing an initial thermosiphon flow of the source material through the hot leg riser and across the by-pass line and down the cold leg downcomer and across the cross-connect line; c. diverting the flow through the reaction chamber after thermosiphon flow is established through the by-pass line; and d. diverting the supply means to entrain the source material through the hot leg riser and into the reaction chamber for reaction with materials on the substrate.

Claim 18

The process of claim 15 wherein the semiconductor thin film is copper indium diselenide.

Claim 19

The process of claim 15 including controlling the temperature of the substrate in the reaction chamber independently of the temperature of the source material and the temperatures of the components of the remainder of the reactor.

Claim 20

The process of claim 16 wherein the source material is hydrogen selenide or elemental selenium.

Claim 21

The process of claim 16 wherein the supply means is a hot trap, including the step of diverting the flow through the cold trap instead of the cross-connect line to condense any residual selenium and impurities and isolate them from material in the hot trap.

Claim 22

The process of claim 19 wherein the entire flow is reversed after a predetermined quantity of selenium is trapped in the cold trap.

Claim 23

The process of claim 15 wherein the constituents of the semiconductor are copper, indium, selenium and sulfur and relative amounts of selenium and sulfur ratios are controlled by controlling flows from selenium and sulfur supply means.

Claim 24

The process of claim 15 including cracking the source material in the gas flow through the hot leg riser to increase the relative concentration of reactive species of the constituent element.

Claim 25

The process of claim 15 including cracking the source material in a pyrolysis chamber between hot leg riser and the reaction chamber to increase the relative concentration of reactive species of the constituent element.

Claim 26

The process of claim 15 including utilization of an induction blower to supplement the thermosiphon flow.

Claim 27

The process of claim 15 including closing communication with the supply means and the cold trap, introducing a flow of source gas into the cross-connect line to charge the apparatus, and recirculate the gas through the reaction chamber in a closed loop fashion using a thermosiphon flow or by assistance from an induction blower.

Claim 28

The process of claim 24 wherein the source material is hydrogen selenide.

Claim 29

The process of claim 15 wherein the supply means is a hot trap, including heating the hot trap or cold trap and maintaining the other trap at a lower temperature to divert pressure driven flow to the other trap and purify the recollected source material in the traps.

Claim 30

The process of claim 26 wherein the source material is selenium.

Claim 31

The process of claim 15 including diverting the flow from the reaction chamber and across the by-pass line during the loading and unloading of the substrates into and out of the reaction chamber.

Claim 32

The process of claim 15 including directly the flow out of the cold trap directly to a waste treatment facility, providing makeup inert gas from a gas inlet line into the cross-connect.

Claim 33

A process for producing a compound semiconductor thin film material having a plurality of constituent elements in an apparatus having as functional components means for supplying source material of at least one constituent element, a vertically oriented hot leg riser selectively communicating with said supply means, a reaction chamber located above said supply means and said hot leg riser, heating means for said reaction chamber, a vertically oriented cold leg downcomer selectively communicating with said reaction chamber, a horizontally oriented cross-connect located above said supply means and below said reaction chamber and selectively communicating with said hot leg riser and cold leg downcomer, and independently controlled heating and cooling means for said supply means, cross-connect and by-pass line, and means for controlling the flow communication through said apparatus, said process comprising the steps of: a. preheating the apparatus; b. selectively flowing gaseous species of the constituent element into the cross-connect line, through the hot leg riser and into the reaction chamber; and c. discharging waste from the reaction chamber into a waste line in a once-through operation.

Claim 34

A process for producing a compound semiconductor thin film material having a plurality of constituent elements in an apparatus having as functional components means for supplying source material of at least one constituent element, a vertically oriented hot leg riser selectively communicating with said supply means, a reaction chamber located above said supply means and said hot leg riser, heating means for said reaction chamber, a vertically oriented cold leg downcomer selectively communicating with said reaction chamber, a horizontally oriented cross-connect located above said supply means and below said reaction chamber and selectively communicating with said hot leg riser and cold leg downcomer, and independently controlled heating and cooling means for said supply means, cross-connect and by-pass line, and means for controlling the flow communication through said apparatus, said process comprising the steps of: a. preheating the apparatus; b. selectively flowing gaseous species of the constituent element into the cross-connect line, through the hot leg riser and into the reaction chamber; and c. discharging waste from the reaction chamber into a waste line in a once-through operation.

Claim 35

The process of claim 30 wherein the constituents of the semiconductor are copper, indium and selenium and the source material is hydrogen selenide.