Rack mounted circuit board

Claim 2

A circuit board comprising: a substrate having opposed first and second surfaces; a printed circuit provided on said first surface; a thermally conductive heat management layer, bonded to said second surface, with which components supported on said circuit board are in thermal contact; at least one connector mounted on said circuit board adjacent a first edge of said circuit board; at least one guide having a conduction surface provided at each of a pair of opposite edges of said circuit board adjacent said first edge, each guide having a first portion in thermal communication with said heat management layer; board clamping means mounted longitudinally on said pair of opposing edges for urging the conduction surfaces of the guides into thermal contact with a surface of a conduction cooled box and clamping the circuit board in the conduction cooled box when the circuit board is mounted therein; and projection means formed by a second portion of each guide for inserting said circuit board in grooves of a convection cooled box when the circuit board is mounted therein.

Claim 3

A circuit board comprising: a substrate having opposed first and second surfaces; a printed circuit provided on said first surface; at least one connector mounted on said circuit board adjacent a first edge of said circuit board; heat management means provided on said second surface for conducting excess heat from components supported on said circuit board including at least one guide at each of a pair of opposite edges of said circuit board adjacent said first edge, said guide defining a conduction surface and projection means formed by each guide for inserting said circuit board in grooves of a convection cooled box when the circuit board is mounted therein; and board clamping means mounted along each of said pair of opposite edges for urging each conduction surface of the guides into thermal contact with a surface of a conduction cooled box and clamping the circuit board in the conduction cooled box when the circuit board is mounted therein.

Claim 4

A circuit board comprising: a substrate having opposed first and second surfaces; a printed circuit provided on said first surface; at least one connector mounted on said circuit board adjacent a first edge of said circuit board; heat management means provided on said second surface for conducting excess heat from components supported on said circuit board including at least one guide at each of a pair of opposite edges of said circuit board adjacent said first edge, said guide defining a conduction surface and projection means formed by each guide for inserting said circuit board in grooves of a convection cooled box when the circuit board is mounted therein; and board clamping means mounted along each of said pair of opposite edges for urging each conduction surface of the guides into thermal contact with a surface of a conduction cooled box and clamping the circuit board in the conduction cooled box when the circuit board is mounted therein.

Claim 5

A circuit board as defined in claim 2, wherein the heat management means comprises a heat management layer bonded to said second surface.

Claim 6

A circuit board as defined in claim 3, wherein the components are mounted in thermal contact with said heat management layer and have connectors extending through said substrate to be connected to said printed circuit provided on said first surface.

Claim 7

A circuit board as defined in claim 2, and further comprising means facilitating insertion and removal of the circuit board from a box mounted at an edge of said circuit board opposite said first edge.

Claim 8

A circuit board as defined in claim 5, wherein the means facilitating insertion and removal of the circuit board comprise pivotally mounted ejectors located at said edge of said circuit board opposite said first edge.

Claim 9

A circuit board as defined in claim 2, wherein said board clamping means can be expanded perpendicularly relative to the first and second surfaces to provide said thermal contact after the circuit board has been inserted in a conduction cooled box.

Claim 10

A circuit board as defined in claim 3, wherein said heat management layer is of annealed aluminum.

Claim 11

A circuit board as defined in claim 8, wherein each guide is of unannealed aluminum which is harder and more wear resistant than the aluminum of said heat management layer.

Claim 12

A circuit board as defined in claim 3, wherein the at least one guide is separate from said heat management layer and is clamped in good thermal contact to said heat management layer.

Claim 13

A circuit board as defined in claim 3, wherein the at least one guide is separate from said heat management layer and is bonded in good thermal contact to said heat management layer.

Claim 14

A circuit board as defined in claim 7, and further comprising tightening screws which can be tightened to expand each conduction surface into thermal contact with heat removing faces of a conduction cooled box.

Claim 15

A circuit board as defined in claim 2, wherein the board clamping means projects from said second surface of the board substantially the same distance and in the same direction from the heat management means as said at least one connector.

Claim 16

The combination of a box, a rack mounted circuit board, and a board clamping means removably clamping the circuit board in the box, said box comprising a bus arrangement provided at a rear portion of said box; and a rack including at least one slot into which said circuit board slides; said circuit board comprising a substrate having opposed first and second surfaces; a printed circuit provided on said first surface; at least one connector mounted on said circuit board adjacent a first edge of said circuit board which connects said printed circuit to said bus arrangement; heat management means provided on said second surface conducting excess heat from components supported on said circuit board including at least one guide at each of a pair of opposite edges of said circuit board adjacent said first edge, said guide defining a conduction surface and projection means formed by each guide for inserting said circuit board in said rack; and said board clamping means urging each conduction surface of the guides into thermal contact with a surface of said rack and clamping the circuit board.

Claim 17

The combination of a box, a rack mounted circuit board, and a board clamping means removably clamping the circuit board in the box, said box comprising a bus arrangement provided at a rear portion of said box; and a rack including at least one slot into which said circuit board slides; said circuit board comprising a substrate having opposed first and second surfaces; a printed circuit provided on said first surface; at least one connector mounted on said circuit board adjacent a first edge of said circuit board which connects said printed circuit to said bus arrangement; heat management means provided on said second surface conducting excess heat from components supported on said circuit board including at least one guide at each of a pair of opposite edges of said circuit board adjacent said first edge, said guide defining a conduction surface and projection means formed by each guide for inserting said circuit board in said rack; and said board clamping means urging each conduction surface of the guides into thermal contact with a surface of said rack and clamping the circuit board.