Abstract An electrical packaging arrangement is described wherein individual electrical components are mounted on printed wiring boards with the body of the components in physical contact with heat sink strip members also located on the printed wiring boards. These heat sink strip members terminate at the edge of the board and the board is adapted to be inserted into slots provided in a frame member such that the frame member acts as a heat sink. The invention resides in providing a coating of a material having properties of high thermal conductivity and a low coefficient of friction between the heat sink strips on the edge of the board and the frame member. In practice, it is found that a coating of Teflon between the edge of the boards and the frame member provides excellent results.
Apparatus for packaging electronic equipment comprising: cold plate means comprised of thermally conductive material; a plurality of spring clip means attached to said cold plate means and spaced at intervals along at least one side thereof; a plurality of printed wiring board means having a conductive pattern thereon and having a circuit component connected to said conducting pattern; a metallized layer from on at least one surface of said printed wiring board means in physical contact with said components and extending to and along opposite edges of said board means; and an electrically insulating thermally conductive coating having a low coefficient of friction affixed to said metallized layer along said opposite edges.
Claim 2
Dependent Claim
112 words
Apparatus for packaging electronic equipment comprising: cold plate means comprised of thermally conductive material; a plurality of spring clip means attached to said cold plate means and spaced at intervals along at least one side thereof; a plurality of printed wiring board means having a conductive pattern thereon and having a circuit component connected to said conducting pattern; a metallized layer from on at least one surface of said printed wiring board means in physical contact with said components and extending to and along opposite edges of said board means; and an electrically insulating thermally conductive coating having a low coefficient of friction affixed to said metallized layer along said opposite edges.
Claim 3
Dependent Claim
10 words
Apparatus as in claim 1 wherein said coating is polytetrafluoroethylene.