Rack mounted circuit board

Claim 2

A rack-mountable circuit board of substantially rectangular shape comprising a substrate having a first surface whereon a printed circuit is provided, a second surface having a thermally conductive heat management layer bonded thereto, said second surface supporting components in thermal contact with said heat management layer, said board having two opposite edges, a guide mounted at each of said opposite edges, said guides providing first portions in thermal contact with said heat management layer, second portions presenting conduction surfaces at said second surface of the substrate, and third portions, in the plane of said substrate, presenting clear margins enabling the board to be inserted, in use, in a convection cooled box, and connectors mounted on and projecting from said second surface adjacent but inwardly of said third portions of said edge guides, the board further including board clamping means mounted longitudinally of said first portions of said edge guides, in opposition to said second portions, and serving upon actuation to urge said second portions into thermal contact with cold surfaces of a conduction cooled box when the board is mounted therein.

Claim 3

A circuit board of substantially rectangular shape having a first edge provided with at least one connector, said circuit board being arranged to be rack-mounted in a box having a bus and, when so mounted, being connected by said at least one connector to the bus, said circuit board having a first surface whereon a printed circuit is provided and a second surface whereto is bonded a heat management layer and whereon circuit components are mounted in thermal contact with the heat management layer, opposite edges of said board adjacent said first edge each having extending therealong a respective wedge-lock clamping means mounted on said heat management layer and projecting therefrom a predetermined distance, said at least one circuit board connector mounted on and projecting from said second surface so as to project therefrom in the same direction as said wedge-lock clamping means, wherein guides are mounted along marginal portions of said opposite edges to permit said board to be rack-mounted in a VMEbus box and wherein said guides are in thermal contact with said heat management layer and present, at said first surface, thermal contact surfaces arranged, in use, to be urged by said wedge-lock clamping means into heat dissipating contact with corresponding surfaces of a box rack.

Claim 4

A circuit board of substantially rectangular shape having a first edge provided with at least one connector, said circuit board being arranged to be rack-mounted in a box having a bus and, when so mounted, being connected by said at least one connector to the bus, said circuit board having a first surface whereon a printed circuit is provided and a second surface whereto is bonded a heat management layer and whereon circuit components are mounted in thermal contact with the heat management layer, opposite edges of said board adjacent said first edge each having extending therealong a respective wedge-lock clamping means mounted on said heat management layer and projecting therefrom a predetermined distance, said at least one circuit board connector mounted on and projecting from said second surface so as to project therefrom in the same direction as said wedge-lock clamping means, wherein guides are mounted along marginal portions of said opposite edges to permit said board to be rack-mounted in a VMEbus box and wherein said guides are in thermal contact with said heat management layer and present, at said first surface, thermal contact surfaces arranged, in use, to be urged by said wedge-lock clamping means into heat dissipating contact with corresponding surfaces of a box rack.

Claim 5

A circuit board as claimed in claims 1 or 2 wherein said heat management layer is formed of an annealed aluminium sheet.

Claim 6

A circuit board as claimed in claim 2 wherein said guides are of a metal harder than annealed aluminum.

Claim 7

A circuit board as claimed in claim 2 wherein said heat management layer has opposite edges extending to adjacent said opposite edges of said board, beneath said guides, and said wedge-lock clamping means are arranged in use, to urge said opposite edges of said heat management layer into good thermal contact with said guides and, in turn, said guides into good thermal contact with heat removing surfaces of a box rack.

Claim 8

A circuit board as claimed in claim 2 wherein a fourth edge of said board, opposite said first edge, is provided with ejector latches to assist in insertion and removal of said board from a box.

Claim 9

A circuit board as claimed in claim 2 wherein said at least one connector on said first edge projects from said second surface of the board substantially the same distance said wedge-lock clamping means project, in the same direction, from said heat management layer.