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Vertical-walled contacts for VLSI semiconductor devices

Assignee: Texas Instruments Inc
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Filing: 1987-08-03
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Granted: 1991-04-09
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Expires: 2007-08-03
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Abstract

Abstract A contact and interconnect for an MOS VLSI semiconductor device employs a contact hole in an insulator coating; the contact hole has vertical instead of sloped sidewalls. A first metallization is applied by CVD so that the sidewalls will be coated to a uniform thickness, then this first metal is anisotropicalloy etched to leave metal sidewalls. A second metallization is applied by sputtering or evaporation, which provides a more dense and electromigration-resistant coating. A refractory metal layer may be interposed between the metallization and the silicon substrate, and also between the metal interconnect and the insulator, since the insulator usually contains phosphorus.

Inventors

  • 👤 Kendall S. Wills

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 19:47
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/057

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 84 words
A semiconductor device comprising: a region in a face of a semiconductor body, an insulator coating on said face having a contact hole over said region, said contact hole having substantially vertical sidewalls, a first coating of chemical vapor deposited metal continuously covering said sidewalls and the bottom of said contact hole but not extending over the face of the insulator coating, and a metal strip extending along the face over said insulator and also extending into said contact hole over said first coating.
Claim 2
Dependent Claim 84 words
A semiconductor device comprising: a region in a face of a semiconductor body, an insulator coating on said face having a contact hole over said region, said contact hole having substantially vertical sidewalls, a first coating of chemical vapor deposited metal continuously covering said sidewalls and the bottom of said contact hole but not extending over the face of the insulator coating, and a metal strip extending along the face over said insulator and also extending into said contact hole over said first coating.
Claim 3
Dependent Claim 37 words
A device according to claim 1 wherein said semiconductor is silicon, said insulator is a phosphosilicate glass, said first coating is metal, and said metal strip is composed of the same said metal as said first coating.
Claim 4
Dependent Claim 22 words
A device according to claim 1 wherein a barrier layer is interposed between said first coating and said region in said face.
Claim 5
Dependent Claim 14 words
A device according to claim 3 wherein said barrier layer is a refractory metal.
Claim 6
Dependent Claim 21 words
A device according to claim 1 wherein alternate layers of different conductors cover said sidewalls to substantially fill said contact hole.

References Cited (Backward Citations)

US4201999A Cited
US4471376A Cited
US4507853A Cited
US4514751A Cited
US4698125A Cited
US4589196A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-04-08 1994-10-08 1995-04-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-04-08 1998-10-08 1999-04-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-04-08 2002-10-08 2003-04-09 $7700.00 Window Closed / Lapsed

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