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US5001174A
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Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin
Assignee: Sumitomo Bakelite Co Ltd
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Filing: 1989-12-04
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Granted: 1991-03-19
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Expires: 2009-12-04
Abstract
Abstract An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R 1 , R 2 and R 3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R 1 , R 2 and R 3 must not be hydrogen atom simultaneously, (B) a phenolic resin curing agent, (C) a silica filler, and (D) a curing accelerator.
Inventors
- 👤 Kenichi Yanagisawa
- 👤 Naoki Mogi
- 👤 Hironori Ohsuga
- 👤 Hiroshi Shimawaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:38
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08G59/02; C08G59/04; C08G59/06; C08G59/08; C08K; C08K3/00; C08K3/34; C08L; C08L61/00; C08L61/04; C08L63/00; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C08L2203/00; C08L2203/20; C08L2203/206
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
117 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR20## wherein n and m are each an integer of 0 or more, n+m=1-10, the ratio of (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 30--100% by weight, based on total amount of phenolic resin curing agent, of a paraxylene-modified phenolic resin curing agent represented by the formula (II) ##STR21## wherein n is an integer of 0-5, (C) a silica filler, and (D) a curing accelerator.
Claim 2
Dependent Claim
117 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR20## wherein n and m are each an integer of 0 or more, n+m=1-10, the ratio of (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 30--100% by weight, based on total amount of phenolic resin curing agent, of a paraxylene-modified phenolic resin curing agent represented by the formula (II) ##STR21## wherein n is an integer of 0-5, (C) a silica filler, and (D) a curing accelerator.
Claim 3
Dependent Claim
142 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR22## wherein n and m are each an integer of 0 or more, n+m=1-10, the ratio of (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 50-100% by weight, based on total amount of phenolic resin curing agent, of a tris(hydroxyphenyl)methane phenolic resin curing agent represented by the formula (III) ##STR23## wherein n and m are each an integer of 0-10, n+m=1-10, and R is selected from hydrogen atom, methyl group, ethyl group, propyl group, butyl group, tert-butyl group, or a combination thereof, (C) a silica filler, and (D) a curing accelerator.
Claim 4
Dependent Claim
142 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR22## wherein n and m are each an integer of 0 or more, n+m=1-10, the ratio of (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 50-100% by weight, based on total amount of phenolic resin curing agent, of a tris(hydroxyphenyl)methane phenolic resin curing agent represented by the formula (III) ##STR23## wherein n and m are each an integer of 0-10, n+m=1-10, and R is selected from hydrogen atom, methyl group, ethyl group, propyl group, butyl group, tert-butyl group, or a combination thereof, (C) a silica filler, and (D) a curing accelerator.
Claim 5
Dependent Claim
138 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR24## wherein n and m are each an integer of 0 or more, n+m=1-10, (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 50-100% by weight, based on total amount of phenolic resin curing agent, of a dicyclopentadiene-modified phenolic resin curing agent represented by the formula (IV) ##STR25## wherein n is an integer of 0-5 and each R is independently an atom or group selected from hydrogen atom, a halogen atom and an alkyl group of 1-4 carbon atoms, (C) a silica filler, and (D) a curing accelerator.
Claim 6
Dependent Claim
138 words
An epoxy resin composition for semiconductor sealing which comprises, as essential components, (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR24## wherein n and m are each an integer of 0 or more, n+m=1-10, (n+1) : m=3:1, R 1 is methyl, R 2 is tert-butyl, and R 3 is hydrogen, (B) a phenolic resin curing agent comprising 50-100% by weight, based on total amount of phenolic resin curing agent, of a dicyclopentadiene-modified phenolic resin curing agent represented by the formula (IV) ##STR25## wherein n is an integer of 0-5 and each R is independently an atom or group selected from hydrogen atom, a halogen atom and an alkyl group of 1-4 carbon atoms, (C) a silica filler, and (D) a curing accelerator.
Claim 7
Dependent Claim
14 words
An epoxy resin composition according to claim 1, wherein n=0-2 in the formula (II).
Claim 8
Dependent Claim
27 words
An epoxy resin composition according to claim 2, wherein in the formula (III) R means the combination of hydrogen atom and methyl group and (n+1) : m=3:1.
Claim 9
Dependent Claim
19 words
An epoxy resin composition according to claim 3, wherein in the formula (IV) R is hydrogen atom and n=1-4.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1994-03-18 | 1994-09-17 | 1995-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-18 | 1998-09-17 | 1999-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-18 | 2002-09-17 | 2003-03-19 | $7700.00 | Window Closed / Lapsed |