US4999741A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package in the heat dissipation of Electronic devices
Assignee: The General Electric Company PLC
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Filing: 1989-01-24
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Granted: 1991-03-12
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Expires: 2009-01-24
Abstract
Abstract Many housings for electronic devices require to be carefully sealed, as well as incorporate heat sinks for the electronic devices. Careful sealing has required expensive machined housing joints and, because electronic devices may be misaligned to the substrate, rounded heat sinks have been used, giving restricted contact areas and hence limited cooling. The invention employs a thermally conducting flexible membrane capable of being urged into thermal contact with the electronic device, for example by a evacuation of the housing, thereby permitting a simple hermetic seal as well as contact with the electronic device over a large area.
Inventors
- 👤 Stephen G. Tyler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:00
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/0091; H05K5/0095; H05K3/00; H05K3/22; H05K3/28; H05K3/284
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
147 words
A package including at least one electronic device disposed on a substrate, comprising: a base having a perimeter upon which the substrate is disposed; a composite, thermally conductive flexible membrane attached to the perimeter of the base, the composite flexible membrane being in thermal contact with the at least one electronic device, said composite flexible membrane comprising a foil disposed between first and second flexible members each having apertures therein, said flexible member having apertures only in the region of the at least one electronic device and each of said first and second members having thermally conductive material disposed in the respective apertures thereof, the first flexible member being in thermal contact with the at least one electronic device; and a heat sink disposed adjacent to the at least one electronic device, the heat sink being in thermal contact with the apertures of the second flexible member.
Claim 2
Dependent Claim
147 words
A package including at least one electronic device disposed on a substrate, comprising: a base having a perimeter upon which the substrate is disposed; a composite, thermally conductive flexible membrane attached to the perimeter of the base, the composite flexible membrane being in thermal contact with the at least one electronic device, said composite flexible membrane comprising a foil disposed between first and second flexible members each having apertures therein, said flexible member having apertures only in the region of the at least one electronic device and each of said first and second members having thermally conductive material disposed in the respective apertures thereof, the first flexible member being in thermal contact with the at least one electronic device; and a heat sink disposed adjacent to the at least one electronic device, the heat sink being in thermal contact with the apertures of the second flexible member.
Claim 3
Dependent Claim
36 words
The package defined in claim 1, wherein the thermal contact between the thermally conductive flexible membrane and the at least one electronic device is effected by evacuating the region between the flexible membrane and the base.
Claim 4
Dependent Claim
14 words
The package defined in claim 1, further comprising a closure disposed on the base.
Claim 5
Dependent Claim
36 words
The package defined in claim 3, wherein the thermal contact between the thermally conductive flexible membrane and the at least one electronic device is effected by pressurizing the region between the flexible membrane and the closure.
Claim 6
Dependent Claim
34 words
The package defined in claim 3, wherein the heat sink is a compression spring connecting the closure to the second flexible member in the respective regions adjacent to the at least one electronic device.
Claim 7
Dependent Claim
15 words
The package defined in claim 5, further comprising a coolant fluid flowing through the closure.
Claim 8
Dependent Claim
16 words
The package defined in claim 5, further comprising an exterior heat sink disposed on the closure.
Claim 9
Dependent Claim
16 words
A housing as claimed in claim 1, in which the second flexible member is a polymer.
Claim 10
Dependent Claim
16 words
A housing as claimed in claim 1, in which the thermally conducting membrane is of metal.
Claim 11
Dependent Claim
31 words
A housing as claimed in claim 1, in which there is provided a heat sink in thermally conducting contact with the thermally conducting membrane in the region of the electronic device.
Claim 12
Independent Claim
113 words
A method of containing an electronic device, which comprises the steps of inserting the device in a housing; providing a composite thermally conducting flexible membrane comprising a thermally conductive foil interposed between first and second flexible members each having apertures therein, said first flexible member having apertures only in the region of the electronic device and each of said flexible members having thermally conducting material in their respective apertures, the apertures in said first and second flexible members being in thermal contact with the electronic device and the thermally conductive foil respectively sealing the thermally conducting flexible membrane to the housing; and urging the flexible membrane into thermal contact with the electronic device.
Claim 13
Independent Claim
113 words
A method of containing an electronic device, which comprises the steps of inserting the device in a housing; providing a composite thermally conducting flexible membrane comprising a thermally conductive foil interposed between first and second flexible members each having apertures therein, said first flexible member having apertures only in the region of the electronic device and each of said flexible members having thermally conducting material in their respective apertures, the apertures in said first and second flexible members being in thermal contact with the electronic device and the thermally conductive foil respectively sealing the thermally conducting flexible membrane to the housing; and urging the flexible membrane into thermal contact with the electronic device.
Claim 14
Dependent Claim
23 words
The method defined in claim 11, wherein the flexible membrane is urged into thermal contact with the electronic device by evacuating the housing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-11 | 1994-09-10 | 1995-03-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-11 | 1998-09-10 | 1999-03-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-11 | 2002-09-10 | 2003-03-12 | $7700.00 | Window Closed / Lapsed |