EP0061592A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic package
Assignee: International Business Machines Corp
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Filing: 1982-03-01
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Granted: —
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Expires: 2002-03-01
Abstract
Abstract A cooling system for an electronic package has a support substrate (12) with at least one electronic device (20) and a cover (14) in spaced proximity to the device. A thermal bridge for conducting heat from the device to the cover includes a relatively thick (24) metal sheet provided with cuts that define at least one tab element (34, 35) with grooves (30, 32) that make it bendable. Spring means (26) selectively urge the tab element into contact with the device.
Inventors
- 👤 Lewis D. Lipschutz
- 👤 Ralph Ernst Meagher
- 👤 Frank Patrick Presti
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 21:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
103 words
Cooling system for an electronic package (10) having a support substrate (12), at least one electronic device (20) mounted on said substrate, a cover (14) mounted on said substrate disposed over said device having a surface in spaced proximity to said device, and means for conducting heat from said device (20) to said cover (14),characterized by a thermal bridge comprising a relatively thick metal sheet (24) provided with cuts (28) that define at least one tab element (34) and grooves (30, 32) in said tab that make it bendable, and spring means (26) to selectively urge said tab into contact with said device.
Claim 2
Dependent Claim
103 words
Cooling system for an electronic package (10) having a support substrate (12), at least one electronic device (20) mounted on said substrate, a cover (14) mounted on said substrate disposed over said device having a surface in spaced proximity to said device, and means for conducting heat from said device (20) to said cover (14),characterized by a thermal bridge comprising a relatively thick metal sheet (24) provided with cuts (28) that define at least one tab element (34) and grooves (30, 32) in said tab that make it bendable, and spring means (26) to selectively urge said tab into contact with said device.
Claim 3
Dependent Claim
35 words
The cooling system of claim 1, wherein a plurality of devices (20) are mounted on said substrate (12), and said metal sheet (24) is provided with a like number of sets of tab elements (34).
Claim 4
Dependent Claim
49 words
The cooling system of claim 2, wherein said metal (24) sheet has an X-shaped slot (28) over each device (20) that defines four tabs (34) that contact each device (20), and said spring means (26) has four corresponding fingers (36) that urge said tabs into contact with said device.
Claim 5
Dependent Claim
34 words
The cooling system of claim 1, wherein said spring means (26) is a flat sheet of material provided with at least one finger (36) for urging said tab (34) into contact with said device(20).
Claim 6
Dependent Claim
23 words
The cooling system of claim 4, wherein said tab element is formed by an X-shaped cut (28) defining four inwardly directed tabs (34).
Claim 7
Dependent Claim
38 words
The cooling system of claim 5, wherein each of said tabs (34, 35) has at least two parallel transverse grooves (30, 32), said grooves extending through 50 to 98 percent of the thickness of said metal sheet (24).
Claim 8
Dependent Claim
29 words
The cooling system of claim 6, wherein said relatively thick metal sheet (24) has a thickness in the range of approximately 0.127 to 1.27 mm (0.005 to 0.050 inch).
Claim 9
Dependent Claim
17 words
The cooling system of claim 7, wherein said relatively thick metal sheet (24) is made of copper.
Claim 10
Dependent Claim
31 words
The cooling system of claim 7, wherein said flat sheet of material has four bent fingers (36) overlying each of said four tabs (34) of said relatively thick metal sheet (34).
Claim 11
Dependent Claim
45 words
A thermal conduction element for a semiconductor package (10), characterized by a flat sheet of metal (24), cuts (28) in said sheet of metal defining at least one tab element (34, 35), and transverse grooves (30, 32) in said tab element that make it bendable.
Claim 12
Dependent Claim
45 words
A thermal conduction element for a semiconductor package (10), characterized by a flat sheet of metal (24), cuts (28) in said sheet of metal defining at least one tab element (34, 35), and transverse grooves (30, 32) in said tab element that make it bendable.
References Cited (Backward Citations)
No citation records indexed.
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