US4999083A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of etching crystalline material with etchant injection inlet
Assignee: Canon Inc
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Filing: 1989-10-02
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Granted: 1991-03-12
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Expires: 2009-10-02
Abstract
Abstract A fine working method of a crystalline material comprises forming an ion injection region in a crystalline material by irradiating a focused ion beam on a crystalline material and subsequently removing a predetermined region of the ion injection region by applying a chemical etching treatment. The method includes performing ion injection where no removal of the predetermined region occurs even if the crystalline material is exposed to an etchant. The predetermined region is removed by injecting an etchant into the ion injection region.
Inventors
- 👤 Nobuo Watanabe
- 👤 Takeo Tsukamoto
- 👤 Toshihiko Takeda
- 👤 Haruhito Ono
- 👤 Masahiko Okunuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:22
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/02; H; H10; H10P; H10P50/00; H10P50/60; H10P50/64; H10P50/642
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
178 words
A method of fine working crystalline material, which includes forming an ion injection region in a crystalline material by irradiating a focused ion beam on a predetermined first surface region (A) of said crystalline material and subsequently removing crystalline material beneath said predetermined surface region of said ion injection region by applying a chemical etching treatment, the improvement which comprises the steps of: performing ion injection under first ion injecting conditions where no removal of said first predetermined surface region (A) occurs even if said first surface region (A) is exposed to an etchant; forming an injection inlet for said etchant in said crystalline material located at a second surface region adjacent to said first surface region (A); introducing said etchant from said inlet onto said crystalline material; causing said etchant to make contact with a high ion concentration region of said ion injected region formed by ion injection under said first ion injection conditions; and removing said high ion concentration region without removing said first surface region (A) thereby forming a hollow shape in the crystalline material.
Claim 2
Independent Claim
178 words
A method of fine working crystalline material, which includes forming an ion injection region in a crystalline material by irradiating a focused ion beam on a predetermined first surface region (A) of said crystalline material and subsequently removing crystalline material beneath said predetermined surface region of said ion injection region by applying a chemical etching treatment, the improvement which comprises the steps of: performing ion injection under first ion injecting conditions where no removal of said first predetermined surface region (A) occurs even if said first surface region (A) is exposed to an etchant; forming an injection inlet for said etchant in said crystalline material located at a second surface region adjacent to said first surface region (A); introducing said etchant from said inlet onto said crystalline material; causing said etchant to make contact with a high ion concentration region of said ion injected region formed by ion injection under said first ion injection conditions; and removing said high ion concentration region without removing said first surface region (A) thereby forming a hollow shape in the crystalline material.
Claim 3
Dependent Claim
47 words
A fine working method of a crystalline material according to claim 1, wherein said ion injecting conditions are defined by performing at least one of control of the acceleration voltage of said injection ions, control of the amount of injected ions and selection of injected ion species.
Claim 4
Dependent Claim
42 words
The fine working method according to claim 1, wherein said injection inlet of the etchant is formed by injecting under second ion injection conditions an increased amount of ions as compared to said first ion injection conditions, and applying chemical etching treatment.
Claim 5
Dependent Claim
34 words
The fine working method according to claim 7, wherein the etchant used in removing the high ion concentration region and the etchant used for forming the injection inlet form the etchant are the same.
References Cited (Backward Citations)
JPS4931716A
Cited
JPS4991189A
Cited
FR2334199A1
Cited
GB1551290A
Cited
JPS53138286A
Cited
US4264382A
Cited
JPS5621331A
Cited
US4450041A
Cited
US4725332A
Cited
EP0148448A2
Cited
US4523971A
Cited
DD238468A1
Cited
EP0223694A2
Cited
JPS63141316A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-11 | 1994-09-10 | 1995-03-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-11 | 1998-09-10 | 1999-03-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-11 | 2002-09-10 | 2003-03-12 | $7700.00 | Window Closed / Lapsed |