Static ram cell with trench pull-down transistors and buried-layer ground plate

Claim 1

A method of fabricating a SRAM cell comprising in combination the steps of: forming an isolated, buried, n+ layer on a p- substrate; growing an epitaxial silicon layer on said substrate; forming p- well regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; performing a pull-down transistor threshold voltage adjustment; masking for trench formation; etching at least a first and a second trench into said grown epitaxial silicon layer so that the bottom of each of said first and said second trench is inside said buried layer, said first and said second trench being electrically interconnected by said buried layer; forming a dielectric in said trench; and forming a first conductive layer as a gate electrode for at least a first and a second trench transistor as well as a gate for a first and a second surface transistor;

Claim 2

A method of fabricating a SRAM cell comprising in combination the steps of: forming an isolated, buried, n+ layer on a p- substrate; growing an epitaxial silicon layer on said substrate; forming p- well regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; performing a pull-down transistor threshold voltage adjustment; masking for trench formation; etching at least a first and a second trench into said grown epitaxial silicon layer so that the bottom of each of said first and said second trench is inside said buried layer, said first and said second trench being electrically interconnected by said buried layer; forming a dielectric in said trench; and forming a first conductive layer as a gate electrode for at least a first and a second trench transistor as well as a gate for a first and a second surface transistor;

Claim 3

A method of fabricating a SRAM cell comprising in combination the steps of: forming an isolated, buried, n+ layer on a p- substrate; growing an epitaxial silicon layer on said substrate; forming p- well regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; performing a pull-down transistor threshold voltage adjustment; masking for trench formation; etching at least a first and a second trench into said grown epitaxial silicon layer so that the bottom of each of said first and said second trench is inside said buried layer, said first and said second trench being electrically interconnected by said buried layer; forming a dielectric in said trench; forming a first conductive layer as a gate electrode for at least a first and a second trench transistor as well as a gate for a first and a second surface transistor; forming a dielectric for at least one via hole; patterning said via hole dielectric to form said via hole; forming a second conductive layer; and implanting to form loads and interconnections followed by insulators, contact hole openings, metal line definitions and passivations.

Claim 4

A method of fabricating a SRAM cell comprising in combination the steps of: forming an isolated, buried, n+ layer on a p- substrate; growing an epitaxial silicon layer on said substrate; forming p- well regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; forming active island regions in said grown epitaxial silicon layer; performing a pull-down transistor threshold voltage adjustment; masking for trench formation; etching at least a first and a second trench into said grown epitaxial silicon layer so that the bottom of each of said first and said second trench is inside said buried layer, said first and said second trench being electrically interconnected by said buried layer; forming a dielectric in said trench; forming a first conductive layer as a gate electrode for at least a first and a second trench transistor as well as a gate for a first and a second surface transistor; forming a dielectric for at least one via hole; patterning said via hole dielectric to form said via hole; forming a second conductive layer; and implanting to form loads and interconnections followed by insulators, contact hole openings, metal line definitions and passivations.