Semiconductor device and method of manufacturing the same

Claim 2

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions and outer lead portions, respectively, and said pellet being disposed over said leads and being supported by some of said inner lead portions; means, disposed on said inner lead portions between said pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, said inner lead portions having a boundary line effected thereacross by an edge of an end side of said means for electrically insulating; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner lead portions having said boundary line thereacross, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead thereof in a direction both inwardly and outwardly with respect to said boundary line, the inwardly and outwardly going directions being defined, respectively, as directions toward and away from said semiconductor pellet at the rear surface thereof.

Claim 3

A semiconductor device according to claim 1, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position beyond said bent part of each corresponding outer lead portion.

Claim 4

A semiconductor device according to claim 1, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position short of reaching said bent part of each corresponding outer lead portion.

Claim 5

A semiconductor device according to claim 1, wherein said through hole is located within said molding member.

Claim 6

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively protrude outwardly beyond an edge of a relatively short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; means, disposed on said inner lead portions between said pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said means for electrically insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner lead portions having said boundary line thereacross, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead in a direction both inwardly and outwardly with respect to said boundary line, the inwardly and outwardly going directions being defined, respectively, as directions toward and away from said semiconductor pellet at the rear surface thereof.

Claim 7

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively protrude outwardly beyond an edge of a relatively short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; means, disposed on said inner lead portions between said pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said means for electrically insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner lead portions having said boundary line thereacross, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead in a direction both inwardly and outwardly with respect to said boundary line, the inwardly and outwardly going directions being defined, respectively, as directions toward and away from said semiconductor pellet at the rear surface thereof.

Claim 8

A semiconductor device according to claim 5, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position beyond said bent part of each corresponding outer lead portion.

Claim 9

A semiconductor device according to claim 5, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position short of reaching said bent part of each corresponding outer lead portion.

Claim 10

A semiconductor device according to claim 5, wherein said through hole is located within said molding member.

Claim 11

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively protrude outwardly from a short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; means, disposed on said inner lead portions between said pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said means for electrically insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein each of said leads is comprised of inner lead portions and corresponding outer lead portions which form a branched lead arrangement including a plurality of branched portions in a widthwise direction of said leads in, at least, each of said inner lead portions, said branched portions being lengthwise dimensioned so as to extend both inwardly and outwardly with respect to said boundary line.

Claim 12

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively protrude outwardly from a short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; means, disposed on said inner lead portions between said pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said means for electrically insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein each of said leads is comprised of inner lead portions and corresponding outer lead portions which form a branched lead arrangement including a plurality of branched portions in a widthwise direction of said leads in, at least, each of said inner lead portions, said branched portions being lengthwise dimensioned so as to extend both inwardly and outwardly with respect to said boundary line.

Claim 13

A semiconductor device according to claim 9, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein each of said leads is branched from, at least, said bent part of said outer lead portion to beneath said semiconductor pellet.

Claim 14

A semiconductor device according to claim 9, wherein the branched portions of said each lead are made of a plurality of wire rods.

Claim 15

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, said inner lead portions having front end parts which respectively protrude outwardly from a short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; a sheet of insulation, disposed on said inner lead portions between said semiconductor pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said sheet of insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein said sheet of insulation is in the shape of a rectangle dimensioned so as to have a short lateral end side which is set to be smaller than that of the short lateral end side of said rectangular-shaped semiconductor pellet.

Claim 16

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being disposed over said leads and being supported by some of said inner lead portions, said inner lead portions having front end parts which respectively protrude outwardly from a short end side of said rectangular-shaped semiconductor pellet along the rear surface thereof; a sheet of insulation, disposed on said inner lead portions between said semiconductor pellet and said inner lead portions, for electrically insulating said pellet from said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an edge of another end side corresponding to said sheet of insulating, and wherein said another end side is disposed near and along a lateral end side of said semiconductor pellet adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein said sheet of insulation is in the shape of a rectangle dimensioned so as to have a short lateral end side which is set to be smaller than that of the short lateral end side of said rectangular-shaped semiconductor pellet.

Claim 17

A semiconductor device according to claim 12, wherein said each inner lead portion is formed with a downward step under said pellet and at an aligned position with said another end side of said sheet of insulation which corresponds to a laterally adjacent end side of said short end side thereof.

Claim 18

A semiconductor device according to claim 13, wherein a groove is formed in a portion of that outer peripheral part of the rear surface of said semiconductor pellet which is between said lateral end side of said semiconductor pellet and said another end side of said sheet of insulation, said outer peripheral part of the rear surface of said semiconductor pellet corresponding to the part of the rear surface not insulated by said sheet of insulation.

Claim 19

A semiconductor device according to claim 2, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 20

A semiconductor device according to claim 3, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 21

A semiconductor device according to claim 6, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 22

A semiconductor device according to claim 7, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 23

A semiconductor device according to claim 10, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 24

A semiconductor device according to claim 10, wherein the branched portions of said each lead are made of a plurality of wire rods.

Claim 25

A semiconductor device according to claim 20, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 26

A semiconductor device according to claim 1, wherein said semiconductor pellet is of an elongated rectangular shape having a pair of long end sides and a pair of relatively short end sides, said elongated semiconductor pellet being insulatedly leads of the inner lead portions thereof which provide support for said semiconductor pellet.

Claim 27

A semiconductor device according to claim 22, wherein the inner lead portion arrangement is such that the front ends thereof include bonding portions and extend outwardly beyond the corresponding edges of the short end sides and are aligned for electrical connection via said metal wire pieces with a corresponding external terminal near the short end side edges of the semiconductor pellet, and wherein the respective back ends of said inner lead portions extend outwardly from the long end side edges of the semiconductor pellet toward a corresponding end side of said molding member envelope, the outer lead portions thereof corresponding to the lead portions outside of said molding member envelope are contiguous with the inner lead portions respectively associated therewith.

Claim 28

A semiconductor device according to claim 23, wherein said outer lead portions are bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 29

A semiconductor device according to claim 24, wherein said through hole is extended outwardly to a position beyond the bent part of each corresponding outer lead portion.

Claim 30

A semiconductor device according to claim 24, wherein said through hole is extended outwardly to a position short of reaching the bent part of each corresponding outer lead portion.

Claim 31

A semiconductor device according to claim 26, wherein each through hole formed on a corresponding lead extends outwardly to a position which is within said molding member envelope.

Claim 32

A semiconductor device according to claim 24, wherein said through holes are of an elongated shape.

Claim 33

A semiconductor device according to claim 24, wherein said through hole is of an elongated shape such that it becomes narrower outwardly away from the edge of the corresponding long end side of said semiconductor pellet.

Claim 34

A semiconductor device according to claim 1, wherein said through holes are of an elongated shape.

Claim 35

A semiconductor device according to claim 1, wherein said through hole is of an elongated shape such that it becomes narrower outwardly away from the edge of the corresponding long end side of said semiconductor pellet.

Claim 36

A semiconductor device comprising: A semiconductor pellet which has a principal surface and a rear surface; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions and outer lead portions, respectively, and said pellet being supported by some of said inner lead portions; means for electrically insulating said pellet and said some inner lead portions, said inner lead portions having a boundary line effected thereacross by an edge of an end side of said means for electrically insulating; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner load portions having said boundary line there across, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead thereof in a direction both inwardly and outwardly with respect to said boundary line.

Claim 37

A semiconductor device comprising: A semiconductor pellet which has a principal surface and a rear surface; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions and outer lead portions, respectively, and said pellet being supported by some of said inner lead portions; means for electrically insulating said pellet and said some inner lead portions, said inner lead portions having a boundary line effected thereacross by an edge of an end side of said means for electrically insulating; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner load portions having said boundary line there across, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead thereof in a direction both inwardly and outwardly with respect to said boundary line.

Claim 38

A semiconductor device according to claim 32, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position beyond said bent part of each corresponding outer lead portion.

Claim 39

A semiconductor device according to claim 33, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 40

A semiconductor device according to claim 32, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position short of reaching said bent part of each corresponding outer lead portion.

Claim 41

A semiconductor device according to claim 35, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 42

A semiconductor device according to claim 32, wherein said through hole is located within said molding member.

Claim 43

A semiconductor device according to claim 32, wherein said semiconductor pellet is of an elongated rectangular shape having a pair of long end sides and a pair of relatively short end sides, said elongated semiconductor pellet being insulatedly disposed via its principle surface thereof centrally on said leads and over a symmetrically dispersed laid-out arrangement of the inner lead portions thereof which provide support for said semiconductor pellet.

Claim 44

A semiconductor device according to claim 38, wherein the inner lead portion arrangement is such that the front ends thereof includes bonding portions and extend in the vicinity of the corresponding edges of the short end sides and are aligned for electrical connection via said means for electrically connecting with a corresponding external terminal near the short end side edges of the semiconductor pellet, and wherein the respective back ends of said inner lead portions extend outwardly from the long end side edges of the semiconductor pellet toward a corresponding end side of said molding member envelope, the outer lead portions thereof corresponding to the lead portions outside of said molding member envelope are contiguous with the inner lead portions respectively associated therewith.

Claim 45

A semiconductor device according to claim 39, wherein said outer lead portions are bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 46

A semiconductor device according to claim 40, wherein said through hole is extended outwardly to a position beyond the bent part of each corresponding outer lead portion.

Claim 47

A semiconductor device according to claim 40, wherein said through hole is extended outwardly to a position short of reaching the bent part of each corresponding outer lead portion.

Claim 48

A semiconductor device according to claim 42, wherein each through hole formed on a corresponding lead extends outwardly to a position which is within said molding member envelope.

Claim 49

A semiconductor device according to claim 40, wherein said through holes are of an elongated shape.

Claim 50

A semiconductor device according to claim 40, wherein said through hole is of an elongated shape such that it becomes narrower outwardly away from the edge of the corresponding long end side of said semiconductor pellet.

Claim 51

A semiconductor device according to claim 32, wherein said through holes are of an elongated shape.

Claim 52

A semiconductor device according to claim 32, wherein said through hole is of an elongated shape such that it becomes narrower outwardly away from the edge of the corresponding long end side of said semiconductor pellet.

Claim 53

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively extend to the external terminals which are arranged in the vicinity of an edge of a relatively short end side of said rectangular shaped semiconductor pellet; means for electrically insulating said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said means for electrically insulating, and wherein said end side corresponds to a lateral side adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelopes said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner lead portions having said boundary line thereacross, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead in a direction both inwardly and outwardly with respect to said boundary line.

Claim 54

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively extend to the external terminals which are arranged in the vicinity of an edge of a relatively short end side of said rectangular shaped semiconductor pellet; means for electrically insulating said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said means for electrically insulating, and wherein said end side corresponds to a lateral side adjacent to said short end side; means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelopes said pellet, said inner lead portions and said means for electrically connecting; and wherein a through hole is provided in, at least, that part of each of said inner lead portions having said boundary line thereacross, each through hole being dimensioned such that it extends on at least the inner lead portion of the corresponding lead in a direction both inwardly and outwardly with respect to said boundary line.

Claim 55

A semiconductor device according to claim 48, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position beyond said bent part of each corresponding outer lead portion.

Claim 56

A semiconductor device according to claim 49, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 57

A semiconductor device according to claim 48, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein said through hole is extended outwardly to a position short of reaching said bent part of each corresponding outer lead portion.

Claim 58

A semiconductor device according to claim 51, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 59

A semiconductor device according to claim 48, wherein said through hole is located within said molding member.

Claim 60

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively extend to a short end side of said rectangular-shaped semiconductor pellet; means for electrically insulating said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said means for electrically insulating, and wherein said end side corresponds to a lateral side adjacent to said short end side, means for electrically connecting respective external terminals and corresponding one of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein each of said leads is comprised of inner lead portions and corresponding outer lead portions which form a branched lead arrangement including a plurality of branched portions in a widthwise direction of said leads in, at least, each of said inner lead portions, said branched portions being lengthwise dimensioned so as to extend both inwardly and outwardly with respect to said boundary line.

Claim 61

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads provided for said semiconductor pellet including ones associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, and said inner lead portions having front end parts which respectively extend to a short end side of said rectangular-shaped semiconductor pellet; means for electrically insulating said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said means for electrically insulating, and wherein said end side corresponds to a lateral side adjacent to said short end side, means for electrically connecting respective external terminals and corresponding one of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein each of said leads is comprised of inner lead portions and corresponding outer lead portions which form a branched lead arrangement including a plurality of branched portions in a widthwise direction of said leads in, at least, each of said inner lead portions, said branched portions being lengthwise dimensioned so as to extend both inwardly and outwardly with respect to said boundary line.

Claim 62

A semiconductor device according to claim 54, wherein each one of said outer lead portions is disposed outside said molding member and is bent at a part thereof, and wherein each of said leads is branched from, at least, said bent part of said outer lead portion to beneath said semiconductor pellet.

Claim 63

A semiconductor device according to claim 55, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 64

A semiconductor device according to claim 55, wherein the branched portions of said each lead are made of a plurality of wire rods.

Claim 65

A semiconductor device according to claim 57, wherein each one of said outer lead portions is bent in one of downwardly and upwardly extending directions with respect to a horizontal forming surface plane corresponding to the plane effected by said leads.

Claim 66

A semiconductor device according to claim 54, wherein the branched portions of said lead are made of a plurality of wire rods.

Claim 67

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, said inner lead portions having front end parts which respectively extend to a short end side of said rectangular-shaped semiconductor pellet; a sheet which electrically insulated said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said sheet, and wherein said end side thereof corresponds to a lateral end side adjacent to said short end side, means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein said sheet is in the shape of a rectangle dimensioned so as to have a short lateral end side which is set to be smaller than that of the short lateral end side of said rectangular-shaped semiconductor pellet.

Claim 68

A semiconductor device comprising: a semiconductor pellet which has a principal surface and a rear surface and which is in the shape of a rectangle; a plurality of external terminals which are formed on said principal surface of said semiconductor pellet; leads for said semiconductor pellet including ones which function as signal lines associated with said semiconductor pellet, said leads having inner lead portions as well as outer lead portions, respectively, said inner lead portions having front end parts wherein bonding portions are formed, said semiconductor pellet being supported by some of said inner lead portions, said inner lead portions having front end parts which respectively extend to a short end side of said rectangular-shaped semiconductor pellet; a sheet which electrically insulated said pellet and said some inner lead portions, wherein said inner lead portions have a boundary line effected thereacross by an outer edge of an end side of said sheet, and wherein said end side thereof corresponds to a lateral end side adjacent to said short end side, means for electrically connecting respective external terminals and corresponding ones of said inner lead portions at the respective bonding portions thereof; a molding member which envelops said pellet, said inner lead portions and said means for electrically connecting; and wherein said sheet is in the shape of a rectangle dimensioned so as to have a short lateral end side which is set to be smaller than that of the short lateral end side of said rectangular-shaped semiconductor pellet.