Semiconductor device

Abstract

Abstract PURPOSE:To contrive to improve the moisture resistance by forming a cutout to a lead so as to extend inside and outside a synthetic resin package. CONSTITUTION:At the medium part of leads 41-4n a part of which is sealed in the synthetic resin package 12 together with a semiconductor element, a part extending inside and outside the package 12 is formed widely, and the Y-shaped cutout 22 is formed, thus enhancing the strength of supporting the lead by means of a supporting piece 26. At the time of molding the package 12, filling synthetic resin infiltrates into the cutout 22. Thereat, since the inner lead 24 is finely formed, the interface area with the package reduces, and the hermetic property increases, resulting in the improvement of the moisture resistance.

Inventors

• 👤 「つ」守　昌彦
• 👤 Masahiko Tsumori

Bibliographic Details