JPS5623765A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Molded type electronic device
Assignee: Hitachi Ltd
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Filing: 1979-08-01
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Granted: —
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Expires: 1999-08-01
Abstract
Abstract PURPOSE:To reduce an interval space between lead wires and a package in a molded type electronic device by forming a hole at the portion passing the lead wires from the package. CONSTITUTION:A hole 3 is perforated at the lead wires 2 over the outer surface of a package 1. Thus, it increases the resin self-clamping strength and decreases the cross area of the portion passing the resin with the lead wires to largely reduce the interval between the package and the lead wires. Accordingly, it can improve a moisture resistance reliability.
Inventors
- 👤 Kazuo Shimizu
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 10:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
JPS5356545U
Cited
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