Patent US4984954A successfully refreshed from Google Patents.
US4984954A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Spatula for wafer transport
Assignee: Individual
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Filing: 1990-08-03
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Granted: 1991-01-15
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Expires: 2010-08-03
Abstract
Abstract In apparatus for transporting semiconductor wafers, a spatula contains a single major recess for receiving a wafer. Adjacent one edge of the recess is a shoulder for locating the wafer in the sequence of operations for loading the spatula. As a result of the sequence, the center of the wafer is held at a predetermined, known location.
Inventors
- 👤 Douglas H. Warenback
- 👤 Josef T. Hoog
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:32
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7602
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
169 words
In a spatula for supporting a semiconductor wafer comprising an elongated blade of predetermined length and thickness and having a width less than the diameter of said wafer, the length of said blade terminating in a free end and a supported end, the improvement comprising: a recess comprising a reduced thickness portion adjacent to but spaced from the free end of said blade, said recess forming a pair of arcs across the width of the blade, said pair of arcs having a common center and a diameter slightly greater then the diameter of said wafer; a ridge at said free end, said ridge defining an arc having the same diameter as said pair of arcs but having a center displaced slightly from said common center toward said free end; whereby said spatula can be inserted between wafers in a cassette to engage a wafer initially with said ridge and remove it slightly so that said spatula can be re-inserted into the cassette to support said wafer in said recess.
Claim 2
Dependent Claim
169 words
In a spatula for supporting a semiconductor wafer comprising an elongated blade of predetermined length and thickness and having a width less than the diameter of said wafer, the length of said blade terminating in a free end and a supported end, the improvement comprising: a recess comprising a reduced thickness portion adjacent to but spaced from the free end of said blade, said recess forming a pair of arcs across the width of the blade, said pair of arcs having a common center and a diameter slightly greater then the diameter of said wafer; a ridge at said free end, said ridge defining an arc having the same diameter as said pair of arcs but having a center displaced slightly from said common center toward said free end; whereby said spatula can be inserted between wafers in a cassette to engage a wafer initially with said ridge and remove it slightly so that said spatula can be re-inserted into the cassette to support said wafer in said recess.
Claim 3
Dependent Claim
23 words
The spatula as set forth in claim 1 wherein the thickness of said blade at said ridge is greater than said predetermined thickness.
Claim 4
Dependent Claim
23 words
The spatula as set forth in claim 1 wherein the width of said blade is greater than the flat on said semiconductor wafer.
References Cited (Backward Citations)
US3272350A
Cited
US4002254A
Cited
US4433951A
Cited
US4542712A
Cited
JPS6019620A
Cited
JPS61273441A
Cited
JPS61291335A
Cited
US4810473A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-14 | 1994-07-16 | 1995-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-14 | 1998-07-16 | 1999-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-14 | 2002-07-16 | 2003-01-15 | $7700.00 | Window Closed / Lapsed |