Patent US4982267A successfully refreshed from Google Patents.
US4982267A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated semiconductor package
Assignee: Atmel Corp
•
Filing: 1987-05-08
•
Granted: 1991-01-01
•
Expires: 2007-05-08
Abstract
Abstract An integrated semiconductor package comprising a semiconductor body having a first surface and a plurality of pins, each pin having first and second ends. Also disclosed is an apparatus for connecting the first end of each pin to the first surface of the semiconductor body so that the semiconductor body provides the physical integrity to support the pins above and substantially perpendicular to the first surface. The apparatus of connecting the first end of each pin to the first surface comprises a plurality of metalization interconnects. A metalization interconnect is interspaced between the first end of each pin and the first surface of the semiconductor body. The pins are arranged in an array so that the second end of each pin can be removably inserted into a pin-grid socket.
Inventors
- 👤 Arthur H. Mones
- 👤 Xavier Sheehy
- 👤 Richard K. Spielberger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:34
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/698; H10W90/00; H10W90/701; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
172 words
An integrated circuit semiconductor package comprising: a semiconductor body having a first surface, the semiconductor body serving as a substrate, the substrate being connected to an integrated circuit chip, wherein the integrated circuit chip is flip-chip bonded to the substrate; a plurality of pins, each pin having first and second ends; and means for connecting the first end of each pin to the first surface on the semiconductor body to result in a bond between them so that the semiconductor supports the pins oriented outward from the substantially perpendicular to the first surface, the means for connecting comprising a plurality of metallization interconnects, adapted to be connected to the integrated circuit chip, with there being a metallization interconnect interspaced between the first end of each pin and the first surface of the semiconductor body, the pins being arranged in an array and free of any other supports bonded thereto, and the interconnect being of sufficient strength so that the second end of each pin can be removably inserted into a pin-grid socket.
Claim 2
Dependent Claim
172 words
An integrated circuit semiconductor package comprising: a semiconductor body having a first surface, the semiconductor body serving as a substrate, the substrate being connected to an integrated circuit chip, wherein the integrated circuit chip is flip-chip bonded to the substrate; a plurality of pins, each pin having first and second ends; and means for connecting the first end of each pin to the first surface on the semiconductor body to result in a bond between them so that the semiconductor supports the pins oriented outward from the substantially perpendicular to the first surface, the means for connecting comprising a plurality of metallization interconnects, adapted to be connected to the integrated circuit chip, with there being a metallization interconnect interspaced between the first end of each pin and the first surface of the semiconductor body, the pins being arranged in an array and free of any other supports bonded thereto, and the interconnect being of sufficient strength so that the second end of each pin can be removably inserted into a pin-grid socket.
Claim 3
Dependent Claim
19 words
The apparatus of claim 1 wherein at least one of the substrate and the integrated circuit chip comprises silicon.
Claim 4
Dependent Claim
19 words
The apparatus of claim 1 wherein both the substrate and the integrated circuit chip comprises the same semiconductor material.
Claim 5
Dependent Claim
36 words
The apparatus of claim 1 wherein at least one of the substrate and the integrated circuit chip comprises layers of semiconductor material selected from the group consisting of silicon, germanium, gallium arsenide and mercury cadmium telluride.
Claim 6
Dependent Claim
172 words
An integrated circuit semiconductor package comprising: a semiconductor body having a first surface, the semiconductor body serving as a substrate, the substrate being connected to an integrated circuit chip, wherein the integrated circuit chip is wire bonded to the substrate; a plurality of pins, each pin having first and second ends; and means for connecting the first end of each pin to the first surface on the semiconductor body to result in a bond between them so that the semiconductor supports the pins oriented outward from the substantially perpendicular to the first surface, the means for connecting comprising a plurality of metallization interconnects, adapted to be connected to the integrated circuit chip, with there being a metallization interconnect interspaced between the first end of each pin and the first surface of the semiconductor body, the pins being arranged in an array and free of any other supports bonded thereto, and the interconnect being of sufficient strength so that the second end of each pin can be removably inserted into a pin-grid socket.
Claim 7
Dependent Claim
172 words
An integrated circuit semiconductor package comprising: a semiconductor body having a first surface, the semiconductor body serving as a substrate, the substrate being connected to an integrated circuit chip, wherein the integrated circuit chip is wire bonded to the substrate; a plurality of pins, each pin having first and second ends; and means for connecting the first end of each pin to the first surface on the semiconductor body to result in a bond between them so that the semiconductor supports the pins oriented outward from the substantially perpendicular to the first surface, the means for connecting comprising a plurality of metallization interconnects, adapted to be connected to the integrated circuit chip, with there being a metallization interconnect interspaced between the first end of each pin and the first surface of the semiconductor body, the pins being arranged in an array and free of any other supports bonded thereto, and the interconnect being of sufficient strength so that the second end of each pin can be removably inserted into a pin-grid socket.
Claim 8
Dependent Claim
19 words
The apparatus of claim 5 wherein at least one of the substrate and the integrated circuit chip comprises silicon.
Claim 9
Dependent Claim
19 words
The apparatus of claim 5 wherein both the substrate and the integrated circuit chip comprise the same semiconductor material.
Claim 10
Dependent Claim
36 words
The apparatus of claim 5 wherein at least one of the substrate and the integrated circuit chip comprises layers of semiconductor material selected from the group consisting of silicon, germanium, gallium arsenide and mercury cadmium telluride.
References Cited (Backward Citations)
US3101523A
Cited
US3374537A
Cited
US3651562A
Cited
US3909929A
Cited
US4074342A
Cited
US4000508A
Cited
US4250520A
Cited
US4272140A
Cited
US4441119A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-31 | 1994-07-02 | 1995-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-31 | 1998-07-02 | 1999-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-31 | 2002-07-02 | 2003-01-01 | $7700.00 | Window Closed / Lapsed |