Abstract A method of producing a semiconductor laser including deposition a first film as a source of n type impurities on a portion of a semiconductor structure produced by growing at least a p type lower cladding layer, a quantum well active layer, and an n type upper cladding layer successively on a substrate, depositing a second film as a source of p type impurities at least on the surface of the semiconductor structure on both sides of and on the first film and annealing to diffuse p and n type impurities at the same time, thereby disordering portions of the quantum well except for the portion becoming an active region with p type impurities reaching at least the p type lower cladding layer, n type impurities reverting the portions of the n type cladding layer to which p type impurities have diffused to n type, and the n type impurities reaching the n type cladding layer but not reaching the active layer.
A method of producing a semiconductor laser comprising: growing at least a p type lower cladding layer, a quantum well active layer, and an type upper cladding layer successively on a substrate; depositing a first film as a source for diffusion of n type impurities on a portion of the n type upper cladding layer; depositing a second film as a source for diffusion of p type impurities at least on the upper cladding layer on opposite sides of the first film; and annealing to diffuse p and n type impurities at the same time, thereby to disorder portions of the quantum well except for a portion becoming the active region of the laser with p type impurities reaching the p type lower cladding layer, n type impurities reverting portions of the n type cladding layer to which p type impurities have diffused to n type, and n type impurities entering the n type upper cladding layer but not reaching the active layer.
Claim 2
Independent Claim
163 words
A method of producing a semiconductor laser comprising: growing at least a p type lower cladding layer, a quantum well active layer, and an type upper cladding layer successively on a substrate; depositing a first film as a source for diffusion of n type impurities on a portion of the n type upper cladding layer; depositing a second film as a source for diffusion of p type impurities at least on the upper cladding layer on opposite sides of the first film; and annealing to diffuse p and n type impurities at the same time, thereby to disorder portions of the quantum well except for a portion becoming the active region of the laser with p type impurities reaching the p type lower cladding layer, n type impurities reverting portions of the n type cladding layer to which p type impurities have diffused to n type, and n type impurities entering the n type upper cladding layer but not reaching the active layer.
Claim 3
Dependent Claim
12 words
The method of claim 1 including depositing silicon as the first film.
Claim 4
Dependent Claim
18 words
The method of claim 2 including depositing a mixture of ZnO and SiO 2 as the second film.
Claim 5
Dependent Claim
13 words
The method of claim 1 wherein said active layer comprises multi-quantum well structure.
Claim 6
Dependent Claim
14 words
The method of claim 1 wherein said active layer comprises single quantum well structure.
Claim 7
Dependent Claim
17 words
The method of claim 1 including depositing an SiO 2 film on the second film before annealing.
Claim 8
Dependent Claim
34 words
The method of claim 1 wherein the p type lower cladding layer comprises AlGaAs, the quantum well active layer comprises AlGaAs, the n type upper cladding layer comprises AlGaAs and the substrate comprises GaAs.
Claim 9
Dependent Claim
26 words
The method of claim 7 including growing an n type GaAs contact layer on said n type AlGaAs upper cladding layer before depositing said first film.