Process for preparing selectively metallized articles

Claim 2

Process for producing a selectively metallized article comprising (a) contacting a polymeric substrate with an organic solvent for said polymeric substrate for a time sufficient to swell the surface of said substrate, (b) contacting said substrate with an aqueous solution of a strong base or strong acid for a time sufficient to stress-crack the substrate, (c) repeating step (a) or steps (a) and (b) any number of times, (d) etching the substrate, and (e) electroless plating said substrate to obtain a selectively metallized article.

Claim 3

Process according to claim 1 in which the time of contact with said organic solvent is about 1-5 minutes and the time of contact with said strong acid or strong base is sufficient for full contact and temperature equilibration.

Claim 4

Process according to claim 1 wherein said organic solvent is dimethylformamide, methanol, methylene chloride, methylethyl ketone, 1,3-dichloroisopropanol, ethylacetate, butylacetate, toluene, orthodichlolorobenzene, γ-butyrolactone, dimethylphthalate and cyclohexane.

Claim 5

Process according to claim 1 wherein said aqueous solution in step (b) is of a strong base.

Claim 6

Process according to claim 1 wherein said polymeric substrate comprises about 1-99 wt % of an amorphous polymer and about 99-1 wt % of a semicrystalline polymer.

Claim 7

Process according to claim 5 wherein said semicrystalline polymer is poly(cyclohexylene dimethylene terephthalate), poly(ethylene terephthalate) or poly(butylene terephthalate).

Claim 8

Process according to claim 5 wherein said amorphous polymer is polyarylate, polyethersulfone, polysulfone or polyetherimide.

Claim 9

Process for producing a selectively metallized article comprising (a) contacting a polymeric substrate with an organic solvent selected from the group consisting of dimethylformamide, methanol, methylene chloride, methylethyl ketone, 1,3-dichloroisopropanol, ethylacetate, butylacetate, toluene, orthodichloro-benzene, γ-butyrolactone, dimethylphthalate and cyclohexane, for a time of about 1-5 minutes, said polymeric substrate comprising a blend of about 1-99 wt % of a semicrystalline polymer and about 99-1 wt % of an amorphous polymer, (b) contacting said substrate with an aqueous solution of a strong base, said solution having a pH of 10 or higher, to stress-crack said substrate, alternatively repeating steps (a) and/or (b) any (c) etching said substrate, and (d) electroless plating said substrate to form a selectively metallized article.

Claim 10

Process for producing a selectively metallized article comprising (a) contacting a polymeric substrate with an organic solvent selected from the group consisting of dimethylformamide, methanol, methylene chloride, methylethyl ketone, 1,3-dichloroisopropanol, ethylacetate, butylacetate, toluene, orthodichloro-benzene, γ-butyrolactone, dimethylphthalate and cyclohexane, for a time of about 1-5 minutes, said polymeric substrate comprising a blend of about 1-99 wt % of a semicrystalline polymer and about 99-1 wt % of an amorphous polymer, (b) contacting said substrate with an aqueous solution of a strong base, said solution having a pH of 10 or higher, to stress-crack said substrate, alternatively repeating steps (a) and/or (b) any (c) etching said substrate, and (d) electroless plating said substrate to form a selectively metallized article.

Claim 11

A selectively metallized article produced by the process of claim 1.

Claim 12

A selectively metallized article produced by the process of claim 8.

Claim 13

A selectively metallized circuit board produced by the process of claim 1.

Claim 14

A selectively metallized circuit board produced by the process of claim 8.