Patent US4977012A successfully refreshed from Google Patents.
US4977012A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic wiring substrate blank material and process for production thereof
Assignee: Mitsui Kinzoku Co Ltd
•
Filing: 1988-03-04
•
Granted: 1990-12-11
•
Expires: 2008-03-04
Abstract
Abstract A blank material for use as a ceramic wiring substrate of this invention is prepared by laminating a copper foil onto a ceramic base formed from a boron nitride sintered body or the like via a bonding layer interposed therebetween, and incoporating an inorganic filler in at least the ceramic base-containing side of the bonding layer. A fine and high density circuit substrate can be easily formed from the ceramic wiring substrate blank material according to the present invention by a conventional etching method.
Inventors
- 👤 Eizo Ishikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:15
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/20; B32B7/00; B32B7/04; B32B7/12; B32B9/00; B32B9/005; B32B9/04; B32B9/041; H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; H05K3/386; B32B2305/00; B32B2305/30; B32B2311/00; B32B2311/12; B32B2315/00; B32B2315/02; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
103 words
A ceramic wiring substrate blank material having an exposed surface conductor and comprising, in laminated state, a ceramic base, a copper foil providing said exposed surface conductor, and a bonding layer interposed between said base and said foil and containing on at least the side thereof contacting said base an inorganic filler for filling the pores of said ceramic base and providing enhanced adhesion between said copper foil and ceramic base, wherein the bonding layer comprises a primer layer and an adhesive layer respectively contacting the ceramic base and the copper foil and wherein an inorganic filler is incorporated in the primer layer.
Claim 2
Dependent Claim
103 words
A ceramic wiring substrate blank material having an exposed surface conductor and comprising, in laminated state, a ceramic base, a copper foil providing said exposed surface conductor, and a bonding layer interposed between said base and said foil and containing on at least the side thereof contacting said base an inorganic filler for filling the pores of said ceramic base and providing enhanced adhesion between said copper foil and ceramic base, wherein the bonding layer comprises a primer layer and an adhesive layer respectively contacting the ceramic base and the copper foil and wherein an inorganic filler is incorporated in the primer layer.
Claim 3
Dependent Claim
19 words
The blank material according to claim 1, wherein the ceramic base is composed of a boron nitride sintered body.
Claim 4
Dependent Claim
62 words
The blank material according to claim 1, wherein the inorganic filler is at least one powder selected from boron nitride powder, beryllia powder, antimony trioxide powder, alumina powder, glass powder, carbon black, graphite powder, silica powder, diatomaceus earth powder, zirconia powder, titanium oxide powder, zeolite powder, calcium carbonate powder, magnesium carbonate powder, talc powder, barium sulfate powder, mica powder and gypsum powder.
Claim 5
Dependent Claim
23 words
The blank material according to claim 1, wherein the average particle size of the inorganic filler powder is from 0.05 to 3 micrometers.
Claim 6
Dependent Claim
22 words
The blank material according to claim 1, wherein the content of the inorganic filler powder is from 3% to 20% by weight.
Claim 7
Dependent Claim
98 words
A process for producing a ceramic wiring substrate blank material having an exposed surface conductor which can be processed into a conductive pattern, said process comprising the steps of priming at least a surface of a sintered ceramic base to be bonded with a primer coating composition containing an inorganic filler, and bonding a copper foil providing said exposed surface conductor to the primed surface of the ceramic base via an adhesive layer interposed therebetween, said inorganic filler filling the pores of said sintered ceramic base and providing enhanced adhesion between said copper foil and sintered ceramic base.
Claim 8
Dependent Claim
98 words
A process for producing a ceramic wiring substrate blank material having an exposed surface conductor which can be processed into a conductive pattern, said process comprising the steps of priming at least a surface of a sintered ceramic base to be bonded with a primer coating composition containing an inorganic filler, and bonding a copper foil providing said exposed surface conductor to the primed surface of the ceramic base via an adhesive layer interposed therebetween, said inorganic filler filling the pores of said sintered ceramic base and providing enhanced adhesion between said copper foil and sintered ceramic base.
Claim 9
Dependent Claim
21 words
The process for producing the blank material according to claim 6, wherein the ceramic base comprises a boron nitride sintered body.
Claim 10
Dependent Claim
64 words
The process for producing the blank material according to claim 6, wherein the step of bonding the copper foil to the primed surface of the ceramic base via the adhesive layer interposed therebetween is carried out by coating a surface of the copper foil with an adhesive and registering the adhesive-coated surface of the copper foil to the primed surface of the ceramic base.
Claim 11
Dependent Claim
53 words
The process for producing the blank material according to claim 6, wherein the step of bonding the copper foil to the primed surface of the ceramic base via the adhesive layer is carried out by bonding the copper foil to the primed surface of the ceramic base by inserting a contact-bonding film therebetween.
Claim 12
Dependent Claim
71 words
The process for producing the blank material according to claim 6, wherein the inorganic filler of the coating composition is at least one powder selected from boron nitride powder, beryllia powder, antimony trioxide powder, alumina powder, glass powder, carbon black powder, graphite powder, silica powder, diatomaceus earth powder, zirconia powder, titanium oxide powder, zeolite powder, calcium carbonate powder, magnesium carbonate powder, talc powder, barium sulfate powder, mica powder and gypsum powder.
Claim 13
Dependent Claim
31 words
The process for producing the blank material according to claim 10, wherein the average particle size of the inorganic filler powder of the coating composition is from 0.05 to 3 micrometers.
Claim 14
Dependent Claim
30 words
The process for producing the blank material according to claim 10, wherein the content of the inorganic filler powder of the coating composition is from 3% to 20% by weight.
Claim 15
Dependent Claim
18 words
The process for producing the blank material according to claim 6, wherein the adhesive comprises a thermosetting resin.
Claim 16
Dependent Claim
33 words
The process for producing the blank material according to claim 13, wherein the step of bonding the copper foil to the primed surface of the ceramic base is carried out by hot pressing.
References Cited (Backward Citations)
GB357510A
Cited
JPS544370A
Cited
JPS54149708A
Cited
US4492730A
Cited
JPS618292A
Cited
US4781968A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-12-10 | 1994-06-11 | 1994-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-12-10 | 1998-06-11 | 1998-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-12-10 | 2002-06-11 | 2002-12-11 | $7700.00 | Window Closed / Lapsed |