US4781968A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Micro-electronics devices and methods of manufacturing same
Assignee: Hewlett Packard Development Co LP
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Filing: 1986-02-28
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Granted: 1988-11-01
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Expires: 2006-02-28
Abstract
Abstract A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.
Inventors
- 👤 David Kellerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:51
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; C; C03; C03C; C03C14/00; C03C14/004; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W70/67; H10W70/69; H10W70/692; H10W99/00; C03C2214/00; C03C2214/04; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/29; Y10T428/2982; Y10T428/2991; Y10T428/2993; Y10T428/2996; Y10T428/31504; Y10T428/31551; Y10T428/31609; Y10T428/31612
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
54 words
A low dielectric constant material for use in the formation of thick film devices comprising a substantially homogenous blend of a thick film insulation matrix material comprising ceramic or glass ceramic composite said material having a dielectric constant less than about 4.5, a thick film organic vehicle and a plurality of hollow glass microspheres.
Claim 2
Dependent Claim
54 words
A low dielectric constant material for use in the formation of thick film devices comprising a substantially homogenous blend of a thick film insulation matrix material comprising ceramic or glass ceramic composite said material having a dielectric constant less than about 4.5, a thick film organic vehicle and a plurality of hollow glass microspheres.
Claim 3
Dependent Claim
17 words
The low dielectric constant material of claim 1 wherein said hollow glass microspheres are formed of silica.
Claim 4
Dependent Claim
24 words
The low dielectric constant material of claim 1 wherein said microspheres have a maximum size not exceeding about 400 mesh (U.S. Standard Sieve Series).
Claim 5
Dependent Claim
24 words
The low dielectric constant material of claim 1 and comprising about 15 to about 50 parts by volume percent of said hollow glass microspheres.
Claim 6
Dependent Claim
22 words
The low dielectric constant material of claim 1, and comprising about 20 to about 42 volume percent of said hollow glass microspheres.
Claim 7
Dependent Claim
22 words
The low dielectric constant material of claim 1, and comprising about 35 to about 39 volume percent of said hollow glass microspheres.
Claim 8
Dependent Claim
32 words
The low dielectric constant material of claim 6, wherein said microspheres comprise a mixture of different size glass microspheres having a maximum size not exceeding about 400 mesh (U.S. Standard Sieve Series).
Claim 9
Independent Claim
75 words
The method of making a low dielectric constant material for use in the formation of thick film devices comprising the steps of: (a) thoroughly blending a quantity of dry hollow glass microspheres with a thick film organic vehicle; and, (b) thoroughly mixing the blend produced from step (a) with a quantity of thick film insulation matrix material comprising ceramic or glass ceramic composite to provide a material having a dielectric constant less than about 4.5.
Claim 10
Independent Claim
75 words
The method of making a low dielectric constant material for use in the formation of thick film devices comprising the steps of: (a) thoroughly blending a quantity of dry hollow glass microspheres with a thick film organic vehicle; and, (b) thoroughly mixing the blend produced from step (a) with a quantity of thick film insulation matrix material comprising ceramic or glass ceramic composite to provide a material having a dielectric constant less than about 4.5.
Claim 11
Dependent Claim
34 words
The method of claim 8 and including the step of screening said hollow glass microspheres through a 400 mesh screen (U.S. Standard Sieve Series) prior to blending said hollow glass microspheres with said vehicle.
Claim 12
Independent Claim
89 words
A method of forming a low dielectric constant insulation layer according to thick film procedures comprising the steps of: (a) forming a low dielectric constant material by combining a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle, and a plurality of hollow glass microspheres into a homogeneous material; (b) depositing the low dielectric constant material from step (a) onto the circuit portion to a desired thickness for the insulation layer; and (c) drying and firing the deposited material from step (b).
Claim 13
Independent Claim
89 words
A method of forming a low dielectric constant insulation layer according to thick film procedures comprising the steps of: (a) forming a low dielectric constant material by combining a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle, and a plurality of hollow glass microspheres into a homogeneous material; (b) depositing the low dielectric constant material from step (a) onto the circuit portion to a desired thickness for the insulation layer; and (c) drying and firing the deposited material from step (b).
Claim 14
Dependent Claim
28 words
The method of claim 10 and including the step of screening said hollow glass microspheres through a 400 mesh screen (U.S. Standard Sieve Series) prior to said combining.
Claim 15
Independent Claim
139 words
A method of producing a low dielectric constant insulation layer according to thick film procedures comprising the steps of: (a) forming a low dielectric constant material by combining a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle, and a plurality of hollow glass microspheres into a homogenous material; (b) depositing the low dielectric constant material from step (b) onto the metal pattern to a desired thickness; (c) drying and firing the low dielectric constant material deposited in step (b); (d) repeating steps (b) and (c) until the final desired thickness of the insulation layer is approached; (e) depositing a conventional thick film dielectric insulating material onto the structure resulting from step (d) to a desired thickness to planarize the resulting structure; and, (f) drying and firing the material from step (e).
Claim 16
Independent Claim
139 words
A method of producing a low dielectric constant insulation layer according to thick film procedures comprising the steps of: (a) forming a low dielectric constant material by combining a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle, and a plurality of hollow glass microspheres into a homogenous material; (b) depositing the low dielectric constant material from step (b) onto the metal pattern to a desired thickness; (c) drying and firing the low dielectric constant material deposited in step (b); (d) repeating steps (b) and (c) until the final desired thickness of the insulation layer is approached; (e) depositing a conventional thick film dielectric insulating material onto the structure resulting from step (d) to a desired thickness to planarize the resulting structure; and, (f) drying and firing the material from step (e).
Claim 17
Independent Claim
121 words
A method of producing a thick film device according to thick film procedures comprising the steps of: (a) providing a rigid dielectric substrate; (b) depositing a predetermined metal pattern on said substrate; (c) providing a low dielectric constant material which comprises a substantially homogeneous blend of a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle and a plurality of hollow glass microspheres; (d) depositing the low dielectric constant material from step (c) onto the deposited metal pattern; (e) drying and firing the low dielectric constant material deposited in step (d); and (f) repeating steps (b) to (e) until the desired number of metal patterns separated by layers of low dielectric material are completed.
Claim 18
Independent Claim
121 words
A method of producing a thick film device according to thick film procedures comprising the steps of: (a) providing a rigid dielectric substrate; (b) depositing a predetermined metal pattern on said substrate; (c) providing a low dielectric constant material which comprises a substantially homogeneous blend of a thick film insulation matrix material comprising ceramic or glass ceramic composite, a thick film organic vehicle and a plurality of hollow glass microspheres; (d) depositing the low dielectric constant material from step (c) onto the deposited metal pattern; (e) drying and firing the low dielectric constant material deposited in step (d); and (f) repeating steps (b) to (e) until the desired number of metal patterns separated by layers of low dielectric material are completed.
Claim 19
Dependent Claim
26 words
A method according to claim 13, wherein said metal pattern is deposited as a firable ink, and including the step of drying and firing the ink.
Claim 20
Dependent Claim
17 words
A method according to claim 14, wherein said ink and said low dielectric constant material are co-fired.
Claim 21
Dependent Claim
31 words
A method according to claim 13, and including the step of depositing a conventional thick film dielectric insulating material onto the structure resulting from step (e) to planarize the resulting structure.
Claim 22
Dependent Claim
60 words
In a thick film device of the type comprising a rigid insulating substrate and having one or a plurality of circuit layers separated by insulation layers, the improvement wherein at least one of said insulation layers comprises a fired-in-place thick film insulating material comprising ceramic or glass ceramic composite, having a plurality of hollow glass microspheres substantially homogenously dispersed therein.
Claim 23
Dependent Claim
60 words
In a thick film device of the type comprising a rigid insulating substrate and having one or a plurality of circuit layers separated by insulation layers, the improvement wherein at least one of said insulation layers comprises a fired-in-place thick film insulating material comprising ceramic or glass ceramic composite, having a plurality of hollow glass microspheres substantially homogenously dispersed therein.
Claim 24
Dependent Claim
26 words
In a thick film device according to claim 17 wherein said hollow glass microspheres comprise about 15 to about 50 volume percent of said insulation layer(s).
Claim 25
Dependent Claim
26 words
In a thick film device according to claim 18 wherein said hollow glass microspheres comprise about 20 to about 42 volume percent of said insulation layer(s).
Claim 26
Dependent Claim
26 words
In a thick film device according to claim 18 wherein said hollow glass microspheres comprise about 35 to about 39 volume percent of said insulation layer(s).
Claim 27
Dependent Claim
27 words
In a thick film device according to claim 17 wherein said hollow glass microspheres are prescreened to pass through a 400 mesh screen (U.S. Standard Sieve Series).
Claim 28
Dependent Claim
35 words
In a thick film device according to claim 21 wherein said hollow glass microspheres comprise a mixture of different size hollow glass microspheres prescreened to pass through a 400 mesh screen (U.S. Standard Sieve Series).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-01 | 1992-05-02 | 1992-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-01 | 1996-05-02 | 1996-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-01 | 2000-05-02 | 2000-11-01 | $7700.00 | Window Closed / Lapsed |