Apparatus for removal and installing electronic components with respect to a substrate

Claim 2

Apparatus for the removal and installation of at least one electronic component with respect to a substrate where the component includes a plurality of leads and the substrate includes a plurality of lands respectively associated with said component leads and where at least the leads or the lands have solder applied thereto, comprising workholder means for supporting the substrate; holding means for holding the component in a fixed position with respect to the substrate; hot air heating means for soldering the component leads to their associated substrate lands by a flow of heated gas, said heating means having a nozzle at a lower end thereof which is of a perimetric configuration that corresponds to the perimeter of the component but is slightly larger than that of the component to permit the flow of heated gas to pass along the perimeter of the component to the component leads with the component nested within an outlet opening of said nozzle; first and second positioning means for producing alignment of the component relative to the substrate and nozzle, said first positioning means producing a relative aligning movement between the component and the substrate and said second positioning means producing an aligning of said component relative to said nozzle; said heating means and said fixed position of the component being separated by a sub substantial distance so that, upon operation of said first positioning means, said lands of the substrate can be aligned with their associated leads of the component without the heating means obstructing the view of the component, whereby accurate alignment of the leads with respect to the lands may be effected, and said component peripherally aligned with respect to said nozzle by said second positioning means can be, thereafter, received within the nozzle with an essentially uniform clearance between their perimeters; where said holding means comprises a vacuum means for applying a vacuum to said component to hold the component in said fixed position; where said heating means is substantially vertically oriented and the nozzle has a rectangular opening at its lower end, and where said vacuum means includes a tubular member which extends through the heating means, said apparatus including means for rendering said tubular member and said heating means relatively movable with respect to one another.

Claim 3

Apparatus as in claim 1, where said holding means includes means for holding the vacuum tube with the component attached thereto such that said fixed position in which the component is held is said substantial distance below said outlet opening of said nozzle.

Claim 4

Apparatus as in claim 2, where said substantial distance is about 11/2 inches below said opening at the lower end of said nozzle.

Claim 5

Apparatus as in claim 2, where said nozzle includes locating means disposed therein for determining when said component is properly aligned with the nozzle such that the spacing between the sidewalls of the nozzle and the sidewalls of the component will be substantially the same around the perimeter of the component.

Claim 6

Apparatus as in claim 2, where said heating means includes means for vertically displacing the heater means including said nozzle into a reflow relationship with the component wherein the lower opening of the nozzle closely surrounds the component whereby said heated air may melt said solder to effect said installation of the component with respect to the substrate.

Claim 7

Apparatus as in claim 5, including means for translating said workholder means a predetermined distance between said heating means and a predetermined location wherein (a) said substrate can be processed preparatory to the installation of said component thereto, (b) the installed component can be inspected to insure appropriate installation thereof.

Claim 8

Apparatus according to claim 1, wherein said first and second positioning means comprise means for producing a displacement of said substrate in a pair of orthogonal directions, and means for setting a rotational position of the component relative to the nozzle about an axis oriented perpendicular to said pair of orthogonal directions prior to introduction of the component within the nozzle.

Claim 9

Apparatus as in claim 1, where an aligning means, which includes reticle means for viewing said component, is provided for aligning the position of said component.

Claim 10

Apparatus as in claim 1, including means for bringing said component leads and said substrate lands into semi-permanent engagement with one another after said alignment has been effected.

Claim 11

Apparatus as in claim 9, including means for pressing said leads onto said lands for effecting said semi-permanent engagement.

Claim 12

Apparatus as in claim 9, including an adhesive material disposed on said lands for effecting said semi-permanent engagement.

Claim 13

Apparatus as in claim 9, including means for moving said heating means to said fixed position so that said component may be soldered to said substrate.

Claim 14

Apparatus as in claim 9, including means for moving the substrate so that said aligned component is moved to the heating means whereby the component can be soldered to the substrate.

Claim 15

Apparatus as in claims 12 or 13, where said component is of the leadless carrier type.

Claim 16

Apparatus as in claims 12 or 13, where said component is of the J-leaded carrier type.

Claim 17

Apparatus as in claims 12 or 13, where said component is of the gull-wing leaded carrier type.

Claim 18

Apparatus as in claim 1, where said workholder means is provided with translating means for horizontally translating said substrate between a position where said component is to be installed with respect to said substrate in proximity to said holding means so that said alignment of the lead with respect to the lands can be effected, and a position in proximity to said heating means.

Claim 19

Apparatus for the removal and installation of at least one electronic component with respect to a substrate where the component includes a plurality of leads and the substrate includes a plurality of lands respectively associated with said component leads and where at least the leads or the lands have solder applied thereto, comprising workholder means for supporting the substrate; holding means for holding the component in a fixed position with respect to the substrate; hot air heating means for soldering the component leads to their associated substrate lands by a flow of heated gas, said heating means having a nozzle at a lower end thereof which is of a perimetric configuration that corresponds to the perimeter of the component but is slightly larger than that of the component to permit the flow of heated gas to pass along the perimeter of the component to the component leads with the component nested within an outlet opening of said nozzle; first and second positioning means for producing alignment of the component relative to the substrate and nozzle, said first positioning means producing a relative aligning movement between the component and the substrate and said second positioning means producing an aligning of said component relative to said nozzle; said heating means and said fixed position of the component being separated by a sub substantial distance so that, upon operation of said first positioning means, said lands of the substrate can be aligned with their associated leads of the component without the heating means obstructing the view of the component, whereby accurate alignment of the leads with respect to the lands may be effected, and said component peripherally aligned with respect to said nozzle by said second positioning means can be, thereafter, received within the nozzle with an essentially uniform clearance between their perimeters; where said holding means is located at a position that is horizontally displaced a predetermined distance from said heating means in a plane substanitially parallel to said substrate whereby said leads and lands can be aligned by said positioning means from vertically above the leads and lands without interference by the heating means; where said holding means includes vacuum means for applying vacuum to said component to hold the component in said fixed position; where said holding means includes a cup-shaped member, the internal configuration of the cup-shaped member corresponding to that of a body portion of said component, said component being held within the cup-shaped member due to the application of vacuum by said holding means to said body portion within the cup-shaped member; the leads of the component extending outwardly beyond said cup-shaped member.

Claim 20

Apparatus for the removal and installation of at least one electronic component with respect to a substrate where the component includes a plurality of leads and the substrate includes a plurality of lands respectively associated with said component leads and where at least the leads or the lands have solder applied thereto, comprising workholder means for supporting the substrate; holding means for holding the component in a fixed position with respect to the substrate; hot air heating means for soldering the component leads to their associated substrate lands by a flow of heated gas, said heating means having a nozzle at a lower end thereof which is of a perimetric configuration that corresponds to the perimeter of the component but is slightly larger than that of the component to permit the flow of heated gas to pass along the perimeter of the component to the component leads with the component nested within an outlet opening of said nozzle; first and second positioning means for producing alignment of the component relative to the substrate and nozzle, said first positioning means producing a relative aligning movement between the component and the substrate and said second positioning means producing an aligning of said component relative to said nozzle; said heating means and said fixed position of the component being separated by a sub substantial distance so that, upon operation of said first positioning means, said lands of the substrate can be aligned with their associated leads of the component without the heating means obstructing the view of the component, whereby accurate alignment of the leads with respect to the lands may be effected, and said component peripherally aligned with respect to said nozzle by said second positioning means can be, thereafter, received within the nozzle with an essentially uniform clearance between their perimeters; where said holding means is located at a position that is horizontally displaced a predetermined distance from said heating means in a plane substanitially parallel to said substrate whereby said leads and lands can be aligned by said positioning means from vertically above the leads and lands without interference by the heating means; where said holding means includes vacuum means for applying vacuum to said component to hold the component in said fixed position; where said holding means includes a cup-shaped member, the internal configuration of the cup-shaped member corresponding to that of a body portion of said component, said component being held within the cup-shaped member due to the application of vacuum by said holding means to said body portion within the cup-shaped member; the leads of the component extending outwardly beyond said cup-shaped member.

Claim 21

Apparatus as in claim 18, where said workholder means includes translating means for translating said substrate between a position where the component is held by said holding means, and a position beneath said heating means.

Claim 22

Apparatus for the removal and installation of at least one electronic component with respect to a substrate where the component includes a plurality of leads and the substrate includes a plurality of lands respectively associated with said component leads and where at least the leads or the lands have solder applied thereto, comprising workholder means for supporting the substrate; holding means for holding the component in a fixed position with respect to the substrate; hot air heating means for soldering the component leads to their associated substrate lands by a flow of heated gas, said heating means having a nozzle at a lower end thereof which is of a perimetric configuration that corresponds to the perimeter of the component but is slightly larger than that of the component to permit the flow of heated gas to pass along the perimeter of the component to the component leads with the component nested within an outlet opening of said nozzle; first and second positioning means for producing alignment of the component relative to the substrate and nozzle, said first positioning means producing a relative aligning movement between the component and the substrate and said second positioning means producing an aligning of said component relative to said nozzle; said heating means and said fixed position of the component being separated by a sub substantial distance so that, upon operation of said first positioning means, said lands of the substrate can be aligned with their associated leads of the component without the heating means obstructing the view of the component, whereby accurate alignment of the leads with respect to the lands may be effected, and said component peripherally aligned with respect to said nozzle by said second positioning means can be, thereafter, received within the nozzle with an essentially uniform clearance between their perimeters; and further comprising attachment means for removably attaching said nozzle means to said heater assembly such that the nozzle means is positioned at a predetermined orientation with respect to the heater assembly, said attachment means including rotation means for rotating sid nozzle means from said predetermined orientation and then back to the predetermined orientation to thus facilitate shearing of said component from said substrate

Claim 23

Apparatus for the removal and installation of at least one electronic component with respect to a substrate where the component includes a plurality of leads and the substrate includes a plurality of lands respectively associated with said component leads and where at least the leads or the lands have solder applied thereto, comprising workholder means for supporting the substrate; holding means for holding the component in a fixed position with respect to the substrate; hot air heating means for soldering the component leads to their associated substrate lands by a flow of heated gas, said heating means having a nozzle at a lower end thereof which is of a perimetric configuration that corresponds to the perimeter of the component but is slightly larger than that of the component to permit the flow of heated gas to pass along the perimeter of the component to the component leads with the component nested within an outlet opening of said nozzle; first and second positioning means for producing alignment of the component relative to the substrate and nozzle, said first positioning means producing a relative aligning movement between the component and the substrate and said second positioning means producing an aligning of said component relative to said nozzle; said heating means and said fixed position of the component being separated by a sub substantial distance so that, upon operation of said first positioning means, said lands of the substrate can be aligned with their associated leads of the component without the heating means obstructing the view of the component, whereby accurate alignment of the leads with respect to the lands may be effected, and said component peripherally aligned with respect to said nozzle by said second positioning means can be, thereafter, received within the nozzle with an essentially uniform clearance between their perimeters; and further comprising attachment means for removably attaching said nozzle means to said heater assembly such that the nozzle means is positioned at a predetermined orientation with respect to the heater assembly, said attachment means including rotation means for rotating sid nozzle means from said predetermined orientation and then back to the predetermined orientation to thus facilitate shearing of said component from said substrate

Claim 24

Apparatus as in claim 20, where said attachment means and said rotation means commonly employ resilient biasing means.

Claim 25

Apparatus as in claim 20, where said holding means includes vacuum means for applying vacuum to said component to hold the component in said fixed position, and where said vacuum means includes a tubular member which extends through the heating means, said apparatus including means for rendering said tubular member and said heating means relatively movable with respect to one another.