US4274576A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cryogenic chip removal technique
Assignee: International Business Machines Corp
•
Filing: 1979-11-13
•
Granted: 1981-06-23
•
Expires: 1999-11-13
Abstract
Abstract A semiconductor chip mounted on a substrate by solder columns connecting one side of the chip to the substrate, is removed from the substrate by cooling the unconnected side of the chip to embrittle the solder columns and then twisting the chip with small angle rotational motion to shear the columns at their midpoints. A mechanism for cooling and rotating the chip makes use of the cooling substance to minimize the contact of the substrate with the cooling substance.
Inventors
- 👤 Rafique S. Shariff
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:26
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T225/00; Y10T225/30; Y10T225/304; Y10T29/00; Y10T29/49; Y10T29/49815; Y10T29/49821; Y10T29/49822
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
52 words
The method of removing a semiconductor chip attached to a ceramic substrate by a plurality of solder columns, comprising the steps of: chilling said columns to cause embrittlement thereof, rupturing said columns which so chilled by moving said chip relative to said substrate, and therefter moving said chips away from said substrate.
Claim 2
Independent Claim
52 words
The method of removing a semiconductor chip attached to a ceramic substrate by a plurality of solder columns, comprising the steps of: chilling said columns to cause embrittlement thereof, rupturing said columns which so chilled by moving said chip relative to said substrate, and therefter moving said chips away from said substrate.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein said movement of the chips is a rotational motion around substantially the center of the chip.
Claim 4
Dependent Claim
19 words
The method of claim 2 wherein said columns are chilled by application of a cooling substance to the chip.
Claim 5
Dependent Claim
12 words
The method of claim 3 wherein the cooling substance is liquefied gas.
Claim 6
Dependent Claim
25 words
The method of claim 4 including, applying the cooling substance to the chip in a shroud which substantially shields the substrate from the cooling substance.
Claim 7
Dependent Claim
12 words
The method of claim 5 wherein said cooling substance is liquid nitrogen.
Claim 8
Dependent Claim
180 words
Apparatus for removing a semiconductor chip mounted on an insulating substrate by solder columns electrically connecting circuits on the side of the chips facing the substrate to an interconnecting network on the substrate comprising: conduit means for applying a cooling fluid to the surface of the chip facing away from the substrate, a shroud means for forming a cavity over the end of the conduit means applying the cooling fluid to the surface of the chip to prevent the fluid from spilling on the substrate, said shroud having an opening to said cavity substantially conforming to the shape of the chip into which the chip fits, said opening being slightly larger than the chip at room temperature, said shroud means being formed of a material which has coefficient of thermal expansion which is greater than the chip so that the opening shrinks relative to the chip and seals against the sides of the chip when the cooling fluid is introduced into the shroud; and rotation means for imparting rotational movement to said shroud when the chip is within the shroud.
Claim 9
Dependent Claim
180 words
Apparatus for removing a semiconductor chip mounted on an insulating substrate by solder columns electrically connecting circuits on the side of the chips facing the substrate to an interconnecting network on the substrate comprising: conduit means for applying a cooling fluid to the surface of the chip facing away from the substrate, a shroud means for forming a cavity over the end of the conduit means applying the cooling fluid to the surface of the chip to prevent the fluid from spilling on the substrate, said shroud having an opening to said cavity substantially conforming to the shape of the chip into which the chip fits, said opening being slightly larger than the chip at room temperature, said shroud means being formed of a material which has coefficient of thermal expansion which is greater than the chip so that the opening shrinks relative to the chip and seals against the sides of the chip when the cooling fluid is introduced into the shroud; and rotation means for imparting rotational movement to said shroud when the chip is within the shroud.
Claim 10
Dependent Claim
41 words
The apparatus of claim 7 wherein said shroud includes, an outer shell with said opening therein which moves with said rotational motion, and an inner portion to which the conduit means is attached that remains substantially stationary with said rotational motion.
References Cited (Backward Citations)
US3556366A
Cited
US3969813A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-06-22 | 1984-12-22 | 1985-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-06-22 | 1988-12-22 | 1989-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-06-22 | 1992-12-22 | 1993-06-23 | $7700.00 | Window Closed / Lapsed |