Patent US5079703A successfully refreshed from Google Patents.
Patent US4970780A successfully refreshed from Google Patents.
US4970780A
Expired / Lapsed
US
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Method for the assemblage of a semiconductor device
Assignee: Shin-Etsu Polymer Co Ltd
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Filing: 1989-08-09
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Granted: 1990-11-20
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Expires: 2009-08-09
Abstract
Abstract The invention relates to an improvement in the so-called flip-chip method for electrically connecting bonding pads of a semiconductor device, e.g., IC chips, and electrodes of a circuit board. In place of the conventional bumps formed of a solder alloy on the bonding pads, the bonding pads in the invention are formed of a material having electric conductivity and rubbery elasticity so that the reliability of the electric connection can greatly be improved.
Inventors
- 👤 Takumi Suda
- 👤 Katsuhisa Aizawa
- 👤 Akio Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:32
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4473; H10W72/00; H10W72/20; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
150 words
A method for the assemblage of a semiconductor device having a plurality of bonding pads and a circuit board having a plurality of electrodes which comprises: (a) coating a surface of the semiconductor device having the bonding pads with an electrically conductive coating composition curable into a rubbery elastomer; (b) curing the electrically conductive coating composition selectively on the bonding pads into a rubber elastomer so as to leave uncured electrically conductive coating composition on the areas outside the bonding pads. (c) removing the uncured electrically conductive coating composition on the areas outside the bonding pads to leave bonding bumps of the cured composition on the bonding pads; and (d) press-contacting the semiconductor device to the circuit board in such a manner that each of the bonding pads of the semiconductor device is electrically connected to one of the electrodes on the circuit board with the bonding bump intervening therebetween.
Claim 2
Independent Claim
150 words
A method for the assemblage of a semiconductor device having a plurality of bonding pads and a circuit board having a plurality of electrodes which comprises: (a) coating a surface of the semiconductor device having the bonding pads with an electrically conductive coating composition curable into a rubbery elastomer; (b) curing the electrically conductive coating composition selectively on the bonding pads into a rubber elastomer so as to leave uncured electrically conductive coating composition on the areas outside the bonding pads. (c) removing the uncured electrically conductive coating composition on the areas outside the bonding pads to leave bonding bumps of the cured composition on the bonding pads; and (d) press-contacting the semiconductor device to the circuit board in such a manner that each of the bonding pads of the semiconductor device is electrically connected to one of the electrodes on the circuit board with the bonding bump intervening therebetween.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-19 | 1994-05-21 | 1994-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-19 | 1998-05-21 | 1998-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-19 | 2002-05-21 | 2002-11-20 | $7700.00 | Window Closed / Lapsed |