Patent US4970575A successfully refreshed from Google Patents.
US4970575A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1990-04-09
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Granted: 1990-11-13
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Expires: 2010-04-09
Abstract
Abstract A substrate and semiconductor chips are connected by solder bumps and a vacant space around the solder bumps is coated with resin in such a degree that the tops of the semiconductor chips are not coated therewith. Epoxy resin or a resin having a smaller thermal expansion coefficient than the epoxy resin is used in the resin coating, and an inorganic material having a smaller thermal expansion coefficient than said resin is mixed therein.
Inventors
- 👤 Tasao Soga
- 👤 Hiroaki Hachino
- 👤 Mamoru Sawahata
- 👤 Fumio Nakano
- 👤 Fumiyuki Kobayashi
- 👤 Seigou Yukutake
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 21:04
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/131; H10W74/141; H10W40/00; H10W40/40; H10W40/47; H10W74/40; H10W74/47; H10W90/00; H10W70/00; H10W70/60; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W74/142; H10W74/15; H10W90/20; H10W90/288; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
148 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps electrode terminals of said substrate and said semiconductor which connect electrically a circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powdery-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin and (c) a second powdery-particular body of a rubber state elastic material, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 2
Dependent Claim
148 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps electrode terminals of said substrate and said semiconductor which connect electrically a circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powdery-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin and (c) a second powdery-particular body of a rubber state elastic material, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 3
Dependent Claim
180 words
A semiconductor device comprising at least one semiconductor chip having integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filled up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powder-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin and a particle size of 1 to 40 μm and (c) a second powdery-particulate body of a rubber state elastic material having a particle size of 0.1 to 5 μm, the mixing rate of the aforesaid first powdery-particulate body is characterized by being 30 to 60 volume %, and the mixing rate of the aforesaid second powdery-particulate body is characterized by being 1 to 20 by parts weight.
Claim 4
Dependent Claim
180 words
A semiconductor device comprising at least one semiconductor chip having integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filled up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powder-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin and a particle size of 1 to 40 μm and (c) a second powdery-particulate body of a rubber state elastic material having a particle size of 0.1 to 5 μm, the mixing rate of the aforesaid first powdery-particulate body is characterized by being 30 to 60 volume %, and the mixing rate of the aforesaid second powdery-particulate body is characterized by being 1 to 20 by parts weight.
Claim 5
Dependent Claim
54 words
A semiconductor device according to claim 1, wherein said thermosetting resin is formed of epoxy resin, said first powdery-particulate body is formed at least one of silicon, calcium carbonate, silicon carbide or silicon carbide with beryllium oxide mixed therein, and said second powdery-particulate body is formed at least one of polybutadiene, or silicon rubber.
Claim 6
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein said composite covers a periphery and an upper surface of said semiconductor chip.
Claim 7
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein said composite covers a periphery except an upper surface of said semiconductor chip.
Claim 8
Dependent Claim
154 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powdery-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin, (c) a second powdery-particulate body of a rubber state elastic material, (d) a hardening accelerator, (e) a curing agent and (f) a silane coupling agent, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 9
Dependent Claim
154 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) a first powdery-particulate body formed of an inorganic material having a smaller thermal expansion coefficient than that of the thermosetting resin, (c) a second powdery-particulate body of a rubber state elastic material, (d) a hardening accelerator, (e) a curing agent and (f) a silane coupling agent, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 10
Dependent Claim
40 words
A semiconductor device according to claim 1, wherein a width of said composite formed around said semiconductor chip contacting on an upper surface of said substrate in more than 0.6 to less than 2.0 of a width of said chip.
Claim 11
Dependent Claim
127 words
A semiconductor device comprising at least one semicondcutor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically to the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 12
Dependent Claim
127 words
A semiconductor device comprising at least one semicondcutor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically to the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to that of the solder.
Claim 13
Dependent Claim
166 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semicondcutor chip and a cured resin filling up at least a space around of solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said substrate is formed of a multilayer printed board, a number of semiconductor chips are mounted on said multilayer printed board, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic rubber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
Claim 14
Dependent Claim
166 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semicondcutor chip and a cured resin filling up at least a space around of solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein said substrate is formed of a multilayer printed board, a number of semiconductor chips are mounted on said multilayer printed board, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic rubber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
Claim 15
Dependent Claim
186 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein a heat-radiating block contacts to a surface of said at least one semiconductor chip at an opposite surface thereof in which the circuit of said at least one semiconductor chip is mounted for releasing heat of said at least one semiconductor chip, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic ribber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
Claim 16
Dependent Claim
186 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, a substrate with said at least one semiconductor chip mounted thereon, solder bumps which connect electrically the circuit formed on the surface of the substrate and circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein a heat-radiating block contacts to a surface of said at least one semiconductor chip at an opposite surface thereof in which the circuit of said at least one semiconductor chip is mounted for releasing heat of said at least one semiconductor chip, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic ribber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
Claim 17
Dependent Claim
188 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, sa substrate with said at least one semiconductor chip mounted thereon, a solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein a heat sink contacts to a surface of said at least one semiconductor chip at an opposite surface thereof in which the circuit of said at least one semiconductor chip is mounted for releasing heat of said at least one semiconductor chip, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic rubber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
Claim 18
Dependent Claim
188 words
A semiconductor device comprising at least one semiconductor chip having an integrated circuit on one surface thereof, sa substrate with said at least one semiconductor chip mounted thereon, a solder bumps which connect electrically the circuit formed on the surface of the substrate and a circuit of said at least one semiconductor chip and a cured resin filling up at least a space around said solder bumps which is formed between said at least one semiconductor chip and the substrate, wherein a heat sink contacts to a surface of said at least one semiconductor chip at an opposite surface thereof in which the circuit of said at least one semiconductor chip is mounted for releasing heat of said at least one semiconductor chip, said cured resin comprises a composite of (a) a thermosetting resin, (b) an inorganic filler in an amount sufficient to substantially reduce a thermal expansion coefficient of the thermosetting resin and (c) an organic rubber filler in an amount sufficient to substantially lower the thermal expansion coefficient of the thermosetting resin, and a thermal expansion coefficient of said composite is approximately equal to the solder.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-11-12 | 1994-05-14 | 1994-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-11-12 | 1998-05-14 | 1998-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-11-12 | 2002-05-14 | 2002-11-13 | $7700.00 | Window Closed / Lapsed |