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US4964923A
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Method of forming a copper film on a ceramic body
Assignee: NGK Insulators Ltd
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Filing: 1986-06-27
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Granted: 1990-10-23
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Expires: 2006-06-27
Abstract
Abstract A film containing copper is deposited on a ceramic body, and the film and the ceramic body are heated in an oxidizing atmosphere, whereby the copper is oxidized and bonded to the body to form a metal oxide film thereon. Alternatively, a film containing copper oxide is deposited on a ceramic body, and the film and the ceramic body are heated in a non-reducing atmosphere, whereby the film is bonded to the body to form a metal oxide film thereon. A metal film consisting mainly of copper is deposited on the metal oxide film. The metal film and the metal oxide film are heated at a temperature not exceeding 1083 DEG C. in a non-oxidizing atmosphere, whereby a copper film is formed on the body.
Inventors
- 👤 Yukihisa Takeuchi
- 👤 Tetsuo Watanabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 06:49
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/50; C04B41/51; C04B41/5127; C04B41/52; C04B41/80; C04B41/81; C04B41/85; C04B41/88; C04B41/89; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1633; C23C18/1689; C23C18/1692; C23C18/1696; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1893; C23C18/31; C23C18/38; C23C18/40; H; H05; H05K; H05K3/00; H05K3/38
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
99 words
A method of forming a copper film on a ceramic body comprising the steps of: depositing a film containing copper oxide on said ceramic body; heating said film and said ceramic body at a temperature between 400° C. and 1200° C. in a non-reducing atmosphere to bond said film to said ceramic body, thereby resulting in a ceramic substrate having a metal oxide film bonded thereto; depositing a metal film consisting essentially of copper on said metal oxide film; and heating said metal film and said ceramic substrate at a temperature up to 1083° C. in a non-oxidizing atmosphere.
Claim 2
Independent Claim
99 words
A method of forming a copper film on a ceramic body comprising the steps of: depositing a film containing copper oxide on said ceramic body; heating said film and said ceramic body at a temperature between 400° C. and 1200° C. in a non-reducing atmosphere to bond said film to said ceramic body, thereby resulting in a ceramic substrate having a metal oxide film bonded thereto; depositing a metal film consisting essentially of copper on said metal oxide film; and heating said metal film and said ceramic substrate at a temperature up to 1083° C. in a non-oxidizing atmosphere.
Claim 3
Dependent Claim
27 words
The method of claim 1, wherein said depositing steps are effected by a process selected from the group consisting of printing, chemical solution deposition and vapor deposition.
Claim 4
Dependent Claim
19 words
The method of claim 1, wherein said step of depositing a metal film is effected by chemical solution deposition.
Claim 5
Dependent Claim
35 words
The method of claim 1, wherein said ceramic body comprises a substrate which contains a material selected from the group consisting of aluminum oxide and compounds which can be converted to aluminum oxide through oxidation.
Claim 6
Dependent Claim
16 words
The method of claim 1, wherein a thickness of said metal oxide film is 0.02-3 microns.
Claim 7
Dependent Claim
15 words
The method of claim 1, wherein said metal oxide film consists essentially of copper oxide.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1993-10-22 | 1994-04-23 | 1994-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-22 | 1998-04-23 | 1998-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-22 | 2002-04-23 | 2002-10-23 | $7700.00 | Window Closed / Lapsed |