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US4960719A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for producing amorphous silicon thin film transistor array substrate

Assignee: Seiko Precision Inc
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Filing: 1989-01-23
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Granted: 1990-10-02
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Expires: 2009-01-23
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Abstract

Abstract A method for producing an amorphous silicon thin film transistor array substrate comprising successively coating a gate insulating layer, an amorphous silicon layer and a protective insulating layer on a glass substrate provided with a gate electrode and a gate wiring having a predetermined shape, in such a manner as to not cover the connecting terminal region of the gate wiring. A protective insulating layer is patterned into a predetermined shape. After passing through a predetermined production process to produce an amorphous silicon thin film transistor array, at least a gate wiring and a source wiring are provided. The step of paterning the protective insulating layer comprises covering the connecting terminals of the gate wiring and the exposed region of the glass substrate with a photoresist.

Inventors

  • 👤 Sakae Tanaka
  • 👤 Yoshiaki Watanabe

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 23:51
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/40; H10D86/441; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0316; H10D30/60; H10D30/67; H10D30/6729; H10D30/673; H10D30/6732; H10D86/01; H10D86/021; H10D86/0231; H10D86/443; H10D86/60

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 187 words
In a method for producing an amorphous silicon thin film transistor array substrate comprising successively coating a gate insulating layer, an amorphous silicon layer and a protective insulating layer on a glass substrate provided with a gate electrode and a gate wiring having a predetermined shape, in such a manner as to not cover the terminal region at the end of the gate wiring, said terminal being used for connecting the array to an external circuit, patterning said protective insulating layer into a predetermined shape, and then after passing through a predetermined production process including etching, providing at least an amorphous silicon thin film transistor array, a gate wiring and source wiring, the improvement comprising covering said terminal region at the end of said gate wiring and exposed regions of said glass substrate with a photoresist during said step of patterning said protective insulating layer, and maintaining said photoresist on said terminal region of said gate wiring and exposed regions of said glass substrate during said etching to protect said terminal region at the end of said gate wiring and said exposed region of said glass substrate.
Claim 2
Dependent Claim 187 words
In a method for producing an amorphous silicon thin film transistor array substrate comprising successively coating a gate insulating layer, an amorphous silicon layer and a protective insulating layer on a glass substrate provided with a gate electrode and a gate wiring having a predetermined shape, in such a manner as to not cover the terminal region at the end of the gate wiring, said terminal being used for connecting the array to an external circuit, patterning said protective insulating layer into a predetermined shape, and then after passing through a predetermined production process including etching, providing at least an amorphous silicon thin film transistor array, a gate wiring and source wiring, the improvement comprising covering said terminal region at the end of said gate wiring and exposed regions of said glass substrate with a photoresist during said step of patterning said protective insulating layer, and maintaining said photoresist on said terminal region of said gate wiring and exposed regions of said glass substrate during said etching to protect said terminal region at the end of said gate wiring and said exposed region of said glass substrate.
Claim 3
Dependent Claim 44 words
A method for producing an amorphous silicon thin film transistor array substrate as claimed in claim 1 wherein said step of covering comprises covering said array with said photoresist to enable exposing the amorphous silicon layer of the source and drain regions for etching.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-10-01 1994-04-02 1994-10-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-10-01 1998-04-02 1998-10-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-10-01 2002-04-02 2002-10-02 $7700.00 Window Closed / Lapsed

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