Patent US4956696A successfully refreshed from Google Patents.
US4956696A
Expired / Lapsed
US
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Compression loaded semiconductor device
Assignee: Sundstrand Corp
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Filing: 1989-08-24
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Granted: 1990-09-11
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Expires: 2009-08-24
Abstract
Abstract A compression loaded semiconductor device package (40) in accordance with the invention includes a cylindrical semiconductor device (54) having a first region (66) on a first face, a control region (68) on the first face having a central portion (70) and a plurality of projections (72) extending radially from the central portion with the radial projections being symmetrically disposed around the periphery of the first face and a second region (74) on a second face with the second face being opposed to the first face; an electrically conductive contract (48) having an external control terminal (88), an annulus (84) electrically connected to the external control terminal, a plurality of projections (82) electrically connected to the annulus, projecting radially inward and a center (80) electrically connected to the radially inward projections and to the control region; and first and second annular insulators (112 and 114) each insulator having a plurality of faces, the upper cover being bonded to a first face (116) of the first insulator, a second face of the first insulator being bonded to a first attachment ring (122) with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face (116) of the second insulator, a second face (118) of the second insulator being bonded to a second attachment ring (124) with the second attachment ring being bonded to the annulus, the bonds (120) defining a sealed chamber containing the semiconductor device.
Inventors
- 👤 Richard J. Hoppe
- 👤 Steven E. Jackson
- 👤 William K. Anderson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:55
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W72/00
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
222 words
A compression loaded semiconductor device comprising: a cylindrical semiconductor device having a first region on a first face, a control region on the first face having a central portion and a second region on a second face with the second face being opposed to the first face; an upper cover in electrical contact with the first region of the semiconductor device; a lower cover in electrical contact with the second region of the semiconductor device; an electrically conductive contact having an external control terminal, an annulus electrically connected to the external control terminal, a plurality of projections electrically connected to the annulus and projecting radially inward, and a center connected to the radially inward projections and to the central portion of the control region; and first and second annular insulators, each annular insulator having a plurality of faces, the upper cover being bonded to a first face of the first insulator, a second face of the first insulator being bonded to a first attachment ring with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face of the second insulator, a second face of the second insulator being bonded to a second attachment ring with the second attachment ring being bonded to &he annulus, the bonds defining a sealed chamber containing the semiconductor device.
Claim 2
Dependent Claim
222 words
A compression loaded semiconductor device comprising: a cylindrical semiconductor device having a first region on a first face, a control region on the first face having a central portion and a second region on a second face with the second face being opposed to the first face; an upper cover in electrical contact with the first region of the semiconductor device; a lower cover in electrical contact with the second region of the semiconductor device; an electrically conductive contact having an external control terminal, an annulus electrically connected to the external control terminal, a plurality of projections electrically connected to the annulus and projecting radially inward, and a center connected to the radially inward projections and to the central portion of the control region; and first and second annular insulators, each annular insulator having a plurality of faces, the upper cover being bonded to a first face of the first insulator, a second face of the first insulator being bonded to a first attachment ring with the first attachment ring being bonded to the annulus, the lower cover being bonded to a first face of the second insulator, a second face of the second insulator being bonded to a second attachment ring with the second attachment ring being bonded to &he annulus, the bonds defining a sealed chamber containing the semiconductor device.
Claim 3
Dependent Claim
66 words
A compression loaded semiconductor device in accordance with claim 1 wherein: the control region has a plurality of projections extending radially outward from the central portion with the radial projections being symmetrically disposed around the periphery of the first face; and each of the projections projecting radially inward are in electrical contact with a different one of the radially outward extending projections of the control region.
Claim 4
Dependent Claim
28 words
A compression loaded semiconductor device package in accordance with claim 2 wherein: the first and second faces of the insulators are inner and outer radially separated cylindrical surfaces.
Claim 5
Dependent Claim
38 words
A compression loaded semiconductor device package in accordance with claim 3 wherein: the semiconductor device is a bipolar transistor, the first region is an emitter, the control region is a base, and the second region is a collector.
Claim 6
Dependent Claim
103 words
A compression loaded semiconductor device package in accordance with claim 4 further comprising: a conductor disk interposed between the upper cover and the electrically conductive contact, the conductor disk being in electrical contact with an interior surface of the upper cover and having a plurality of radial slots and a central aperture, the plurality of radial slots and central aperture being aligned with the projections and the center of the electrically conductive contact so that the electrically conductive contact is spaced from the plurality of radial slots and central aperture so that the electrically conductive contact is electrically isolated from the conductor disk.
Claim 7
Dependent Claim
54 words
A compression loaded semiconductor device package in accordance with claim 5 further comprising: a base contact contained in and electrically insulated from the central aperture of the conductor disk; and means for isolating the base contact from forces applied to the upper and lower covers during compression loading of the transistor in the package.
Claim 8
Dependent Claim
53 words
A compression loaded semiconductor device package in accordance with claim 6 further wherein: the means for isolating includes a biasing means contained within an aperture of the center of the electrically conductive contact and the aperture of the conductor disk for applying a force between the control region and the electrically conductive contact.
Claim 9
Dependent Claim
20 words
A compression loaded semiconductor package in accordance with claim 7 wherein: the biasing means comprises at least one Bellevue washer.
Claim 10
Dependent Claim
48 words
A compression loaded semiconductor in accordance with claim 7 further comprising: an insulator interposed between the electrically conductive contact and an emitter region of the semiconductor device which contacts a surface of the semiconductor disk, the insulator including slots for accommodating the projections of the electrically conductive contact.
Claim 11
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 1 wherein: the bonds define a hermetically sealed chamber.
Claim 12
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 2 wherein: the bonds define a hermetically sealed chamber.
Claim 13
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 3 wherein: the bonds define a hermetically sealed chamber.
Claim 14
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 4 wherein: the bonds define a hermetically sealed chamber.
Claim 15
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 5 wherein: the bonds define a hermetically sealed chamber.
Claim 16
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 6 wherein: the bonds define a hermetically sealed chamber.
Claim 17
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 7 wherein: the bonds define a hermetically sealed chamber.
Claim 18
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 8 wherein: the bonds define a hermetically sealed chamber.
Claim 19
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 9 wherein: the bonds define a hermetically sealed chamber.
Claim 20
Dependent Claim
156 words
A compression loaded semiconductor device comprising: a cylindrical semiconductor device having a first region on a first face, a control region on the first face and a second region on a second face with the second face being opposed to the first face; an upper cover in electrical contact with the first region of the semiconductor device; a lower cover in electrical contact with the second region of the semiconductor device; an electrically conductive contact having an external control terminal and an annulus electrically connected to the external control terminal and electrically coupled to the control region; and first and second annular insulators each having a plurality of faces, the upper cover being bonded to a first face of the first insulator, a second face of the first insulator being bonded to a first attachment ring with the first attachment ring being bonded to the annulus, the bonds defining a sealed chamber containing the semiconductor device.
Claim 21
Dependent Claim
156 words
A compression loaded semiconductor device comprising: a cylindrical semiconductor device having a first region on a first face, a control region on the first face and a second region on a second face with the second face being opposed to the first face; an upper cover in electrical contact with the first region of the semiconductor device; a lower cover in electrical contact with the second region of the semiconductor device; an electrically conductive contact having an external control terminal and an annulus electrically connected to the external control terminal and electrically coupled to the control region; and first and second annular insulators each having a plurality of faces, the upper cover being bonded to a first face of the first insulator, a second face of the first insulator being bonded to a first attachment ring with the first attachment ring being bonded to the annulus, the bonds defining a sealed chamber containing the semiconductor device.
Claim 22
Dependent Claim
27 words
A compression bonded semiconductor device in accordance with claim 19 wherein: the first and second faces of the insulators are inner and outer radially separated cylindrical surfaces.
Claim 23
Dependent Claim
37 words
A compression loaded semiconductor device in accordance with claim 20 wherein: the semiconductor device is a bipolar transistor, the first region is an emitter, the control region is a base, and the second region is a collector.
Claim 24
Dependent Claim
18 words
A compression loaded semiconductor device in accordance with claim 21 wherein: the bonds define a hermetically sealed chamber.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-09-10 | 1994-03-12 | 1994-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-10 | 1998-03-12 | 1998-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-09-10 | 2002-03-12 | 2002-09-11 | $7700.00 | Window Closed / Lapsed |