Disc-shaped semiconductor device having an annular housing of elastomer material

Claim 1

In a disc-shaped semiconductor arrangement composed of an annular housing of elastomer material having a hollow cylindrical interior, two contacting discs of cylindrical shape, and a disc-shaped semiconductor body defining a thyristor, having two opposed major surfaces, one major surface having a gate electrode centered therein and an annular cathode electrode surrounding the gate electrode, and the other major surface providing an anode electrode, and the semiconductor body having a cylindrical shape with a diameter no greater than that of either contacting disc, the semiconductor body being clamped, via its major surfaces, between respective axial end faces of the contacting discs, and being hermetically sealed in the housing, the improvement wherein: the hollow interior of said housing has the form of a circular cylinder; the diameter of the interior of said housing, when said housing is unstressed, is smaller than the diameter of each of said contacting discs; said contacting discs, with said semiconductor body clamped therebetween, are press fitted into the interior of said housing; the elastomer material of said housing has physical properties such that said housing acts on said contacting discs in a manner to maintain pressure contact between said contacting discs and the major surfaces of said semiconductor body and to establish a hermetic seal in the space defined between said contacting discs; and said arrangement further comprises means defining a gate electrode connector in the form of a silver disc contacting said gate electrode; a molded body of elastomer material disposed in said housing interior for establishing a pressure contact between said connector and said gate electrode, via the contacting discs, an annular silver ring aligned with, and contacting said cathode electrode, a conductive lead connected to said silver disc and extending radially through said housing, a Teflon sleeve enclosing said lead, a centering ring of insulating material disposed between said silver disc and said silver ring, and a copper ring aligned with, and contacting, said silver ring and having an outer diameter substantially corresponding to that of said silver ring and an inner diameter greater than that of said silver ring, said copper ring being further provided with a radially extending slit for passage of said sleeve and said lead, and wherein said molded body of elastomer material is press fitted into the interior of said copper ring for pressing said silver disc against said gate electrode, and said silver ring, said silver disc, said sleeve, said copper ring and said molded body are all interposed between said one major surface of said semiconductor body and an associated one of said contacting discs.